MCIMX6X1AVO08ACR

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17)

Quantity 739 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1AVO08ACR – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X1AVO08ACR is a dual‑core microprocessor IC from NXP’s i.MX 6X series featuring an ARM® Cortex®‑A9 core alongside an ARM® Cortex®‑M4 core. It combines heterogeneous processing for application and real‑time tasks with a broad set of peripheral interfaces and security functions.

Targeted at advanced infotainment, telematics, HMI and display‑centric embedded systems, the device delivers integrated connectivity, memory support and system interfaces in a compact 400‑MAPBGA (17 × 17 mm) package, with an extended operating range to support industrial temperature environments.

Key Features

  • Heterogeneous CPU cores — ARM® Cortex®‑A9 and ARM® Cortex®‑M4 dual‑core architecture for application processing and real‑time control; A‑core frequency indicated at 800 MHz with M‑core operation noted at 200 MHz.
  • Memory controller support — Compatible with LPDDR2, LVDDR3 and DDR3 memory types to match a range of system memory requirements.
  • High‑speed networking — Dual 10/100/1000 Mbps Ethernet interfaces for robust wired connectivity and networking throughput.
  • USB connectivity — Multiple USB options including USB 2.0 with PHY and USB 2.0 OTG with PHY to support host and OTG device roles.
  • Display and HMI interfaces — Integrated controllers for LCD and keypad interfaces suitable for display‑based user interfaces and instrument clusters.
  • Security and system integrity — Hardware security features including A‑HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE to support secure boot, cryptography and system debugging.
  • Peripheral and audio support — Additional interfaces such as AC'97 for legacy audio connectivity.
  • Package and mounting — 400‑MAPBGA supplier device package (17 × 17 mm), surface mount; compact form factor for space‑constrained designs.
  • Extended operating temperature — Rated for operation from −40 °C to 125 °C, supporting designs requiring wide temperature capability.
  • Compliance — RoHS compliant for environmental regulatory alignment.

Typical Applications

  • Infotainment systems — Drives multimedia and user‑interface processing with mixed‑core architecture and multiple connectivity options.
  • Telematics and connectivity modules — Dual Gigabit Ethernet and multiple USB PHYs enable high‑throughput data and networked applications.
  • Human‑machine interfaces (HMI) — LCD and keypad controller support simplifies development of responsive operator panels and control interfaces.
  • Display‑based clusters — Integrated display controllers and real‑time companion core support responsive instrument displays and graphical interfaces.

Unique Advantages

  • Heterogeneous processing for mixed workloads: ARM Cortex‑A9 plus Cortex‑M4 enables separation of application and real‑time tasks to simplify system partitioning and responsiveness.
  • Broad memory flexibility: Support for LPDDR2, LVDDR3 and DDR3 memory types allows designers to match performance and cost targets.
  • Rich connectivity set: Dual Gigabit Ethernet and multiple USB PHYs provide high bandwidth I/O options for networking and peripheral expansion.
  • Comprehensive security framework: Multiple hardware security modules and trusted execution features help protect boot, data and cryptographic operations.
  • Engineered for wide temperature ranges: −40 °C to 125 °C operating range supports deployment in harsh or industrial environments.
  • Compact BGA footprint: 400‑MAPBGA (17 × 17 mm) package enables integration into space‑constrained system boards.

Why Choose MCIMX6X1AVO08ACR?

The MCIMX6X1AVO08ACR positions itself as an integrated, dual‑core microprocessor platform that pairs an ARM Cortex‑A9 application core with an ARM Cortex‑M4 real‑time companion, delivering a balance of compute capability and deterministic control. Its combination of memory interface flexibility, dual Gigabit Ethernet, multiple USB PHYs and extensive security features makes it suitable for embedded systems that require connectivity, secure operation and user interface support.

Designed in a compact 400‑MAPBGA package and rated for −40 °C to 125 °C operation, the device is targeted at developers building infotainment, telematics, HMI and display‑centric systems who need a documented, feature‑rich MPU with integrated interfaces and security functionality.

Request a quote or submit an inquiry for MCIMX6X1AVO08ACR to discuss availability, pricing and integration details for your project.

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