MCIMX6X1CVK08AC

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (14x14)

Quantity 820 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (14x14)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (14×14)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1CVK08AC – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X1CVK08AC is a heterogeneous dual-core microprocessor IC combining ARM® Cortex®-A9 and ARM® Cortex®-M4 cores in a compact 400-MAPBGA (14×14) package. It is targeted at industrial-grade embedded systems that require mixed high-performance application processing and real-time control.

Designed for connected, interface-rich applications, this device offers integrated connectivity options, flexible memory controller support, and hardware security features while supporting an extended operating temperature range for industrial deployments.

Key Features

  • Core Architecture  ARM® Cortex®-A9 and ARM® Cortex®-M4 in a 2-core, 32-bit configuration; frequencies referenced in product data include up to 800 MHz for one core and 200 MHz for the other.
  • Multimedia/Acceleration  Includes multimedia co-processor support and NEON™ MPE for optimized media processing.
  • Memory Controller Support  Compatible with LPDDR2, LVDDR3 and DDR3 memory interfaces for flexible system memory designs.
  • Connectivity  Dual 10/100/1000 Mbps Ethernet ports and multiple USB ports (USB 2.0 + PHY (1) and USB 2.0 OTG + PHY (2)) for robust wired connectivity.
  • Display and Audio Interfaces  On-chip controllers for LCD and keypad interfaces and an AC'97 audio interface for legacy audio connectivity.
  • Security and Debug  Hardware security features including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot, cryptography and debug control.
  • Package and Mounting  400-MAPBGA (14×14) surface-mount package (also referenced as 400-LFBGA in package case), enabling high-density board designs.
  • Industrial Qualification and Temperature  Qualified for industrial applications with an operating temperature range of −40 °C to 105 °C.
  • Regulatory  RoHS compliant.
  • Graphics  No graphics acceleration indicated in the product data.

Typical Applications

  • Industrial Automation  Use as a main controller for industrial HMI, protocol bridging and high-speed Ethernet-connected control nodes where real-time tasks and application processing coexist.
  • Medical Devices  Integration into advanced medical instrumentation requiring secure processing, deterministic control and industrial temperature operation.
  • Connectivity Gateways  Dual Gigabit Ethernet and multiple USB interfaces make the device suitable for secure edge gateways and protocol converters in industrial networks.
  • Embedded Control Systems  Combined application and real-time cores support mixed workloads such as user interface management on the A9 core while the M4 handles real-time sensor and actuator control.

Unique Advantages

  • Heterogeneous Dual-Core Architecture: Combines ARM Cortex-A9 and Cortex-M4 cores to separate application-level processing from real-time tasks, simplifying software partitioning.
  • Broad Memory Interface Support: Native support for LPDDR2, LVDDR3 and DDR3 enables designers to select memory types that balance cost, density and performance.
  • Extensive Connectivity: Dual Gigabit Ethernet plus multiple USB interfaces reduce external bridging components and simplify board-level connectivity.
  • Industrial-Grade Qualification: Industrial qualification and −40 °C to 105 °C operating range support reliable deployment in harsh environments.
  • Integrated Security Primitives: On-chip A-HAB, ARM TrustZone, CAAM and related blocks provide hardware foundation for secure boot and cryptographic operations.
  • Compact High-Density Package: 400-MAPBGA (14×14) packaging enables integration into compact embedded designs while maintaining rich I/O.

Why Choose MCIMX6X1CVK08AC?

The MCIMX6X1CVK08AC positions itself as a practical choice for embedded designers needing a mixed-architecture processor with industrial qualification, comprehensive connectivity and on-chip security. Its combination of an ARM Cortex-A9 application core alongside an ARM Cortex-M4 real-time core, supported memory interfaces, and dual Gigabit Ethernet enables designs that require both high-level operating environments and deterministic control.

This device is suited to engineering teams building industrial, medical and connected embedded systems where long-term reliability, secure boot/crypto capabilities and flexible memory and interface options are priorities. The compact 400-MAPBGA package and RoHS compliance further simplify integration into production hardware.

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