MCIMX6X1CVK08AB

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (14x14)

Quantity 802 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (14x14)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (14×14)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1CVK08AB – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X1CVK08AB from NXP Semiconductors is a dual-core embedded microprocessor featuring heterogeneous ARM cores: an ARM® Cortex®-A9 and an ARM® Cortex®-M4. It combines application-processing performance with a deterministic microcontroller core and on-chip system integration tailored for industrial-grade embedded designs.

This device targets embedded and industrial use cases where networking, integrated I/O and hardware security are required, delivering a balance of performance, memory interface flexibility and industrial temperature operation.

Key Features

  • Core Architecture Dual-core configuration with an ARM® Cortex®-A9 and an ARM® Cortex®-M4; documented frequencies include 800 MHz for the A9 domain and 200 MHz for the M4 domain.
  • Memory Interfaces On-chip controllers for LPDDR2, LVDDR3 and DDR3 memory types provide flexible memory subsystem options for varied performance and power targets.
  • Connectivity Two Gigabit Ethernet controllers (10/100/1000 Mbps) support high-bandwidth networking. USB connectivity includes one USB 2.0 (with PHY) and two USB 2.0 OTG ports (with PHY).
  • Display and Audio I/O Integrated display interface controllers for LCD and keypad control and an AC'97 audio interface for legacy audio integration.
  • Security and System Management Hardware security and system protection features include A-HAB, ARM TrustZone (TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE to support secure boot and runtime security architectures.
  • Co-processing Multimedia co-processors and NEON™ MPE support optimized signal processing and SIMD acceleration tasks.
  • Package and Mounting Supplied in a 400-MAPBGA (14 × 14 mm) 400-LFBGA package for surface-mount assembly.
  • Industrial Qualification and Temperature Range Qualified for industrial applications with an operating temperature range of −40°C to 105°C.
  • Graphics No dedicated graphics acceleration is indicated for this device.

Typical Applications

  • Industrial Control Deterministic ARM Cortex‑M4 processing plus application-level ARM Cortex‑A9 capability support control, monitoring and protocol handling in industrial automation.
  • Human-Machine Interfaces (HMI) LCD and keypad interface controllers make the device suitable for embedded HMI panels and operator terminals in industrial environments.
  • Networked Edge Devices Dual Gigabit Ethernet and multiple USB ports enable secure, high-throughput edge appliances, gateways and communication modules.
  • Secure Embedded Systems On-chip security features (A-HAB, TrustZone, CAAM, CSU, SNVS) support secure boot and protected execution for industrial and critical systems.

Unique Advantages

  • Heterogeneous Dual-Core Design: Combines an ARM Cortex‑A9 for application processing with an ARM Cortex‑M4 for real-time tasks, enabling workload partitioning without adding external MCUs.
  • Flexible Memory Support: Built-in controllers for LPDDR2, LVDDR3 and DDR3 allow designers to choose memory options that match performance and power requirements.
  • Robust Industrial Credentials: Industrial qualification and a −40°C to 105°C operating range make the device suitable for harsh environments.
  • Integrated High-Speed Networking: Two Gigabit Ethernet ports provide native support for high-bandwidth and redundant network topologies.
  • Comprehensive Security Suite: Multiple hardware security modules and TrustZone support help establish secure boot and runtime protection without extensive external hardware.
  • Compact Surface-Mount Package: 400-MAPBGA (14×14) package delivers high integration density for space-constrained embedded boards.

Why Choose MCIMX6X1CVK08AB?

MCIMX6X1CVK08AB positions itself as a compact, industrially qualified embedded MPU that pairs application-level processing and real-time control on a single device. Its integration of flexible memory interfaces, dual Gigabit Ethernet, multiple USB ports and on-chip security modules reduces board-level complexity while supporting robust networking and secure operation.

This part is suited for design teams building industrial controls, HMIs, secure edge appliances and other embedded systems that require a mix of performance, real-time capability and industrial temperature reliability, backed by NXP’s i.MX 6 series ecosystem.

Request a quote or submit an inquiry to receive pricing and availability for MCIMX6X1CVK08AB and to discuss how it fits your next embedded design.

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