MCIMX6X1AVO08AC

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17)

Quantity 1,211 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1AVO08AC – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X1AVO08AC is a heterogeneous dual‑core microprocessor from NXP Semiconductors combining ARM® Cortex®‑A9 and ARM® Cortex®‑M4 architectures. The device integrates high‑performance application processing with a real‑time microcontroller core and a wide set of on‑chip peripherals and security features for embedded systems.

Designed for embedded multimedia and control applications, this i.MX 6X series device offers multi‑interface connectivity, flexible memory controller support, and a compact 400‑MAPBGA (17×17 mm) package suitable for space‑constrained designs.

Key Features

  • Heterogeneous Dual Cores  ARM® Cortex®‑A9 (up to 800 MHz per datasheet) paired with an ARM® Cortex®‑M4 real‑time core (datasheet cites up to 227 MHz; product listing includes a 200 MHz operating point).
  • Memory Interfaces  Supports LPDDR2, LVDDR3 and DDR3 memory controllers for flexible system memory configurations.
  • Connectivity  Dual 10/100/1000 Mbps Ethernet interfaces and multiple USB options including USB 2.0 + PHY and USB 2.0 OTG + PHY.
  • Peripheral Interfaces  On‑chip controllers for keypad and LCD display interfaces plus AC'97 audio interface support.
  • Security and System Management  Includes A‑HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE to support secure boot and system integrity functions.
  • Package and Mounting  Supplier device package is 400‑MAPBGA (17×17); package case listed as 400‑LFBGA with surface‑mount mounting type.
  • Operating Range  Extended operating temperature from −40 °C to 125 °C for deployment in demanding environments.
  • Graphics Acceleration  No graphics acceleration (as specified), enabling designers to choose external or software rendering approaches where required.
  • Regulatory Status  RoHS compliant for environmental and manufacturing considerations.

Typical Applications

  • Embedded multimedia systems  Use the Cortex‑A9 application core for high‑level processing and the Cortex‑M4 for real‑time control in multimedia and interactive devices.
  • Industrial HMI and display controllers  On‑chip LCD and keypad interfaces make the device suitable for human‑machine interfaces and compact display control designs.
  • Networked embedded modules  Dual Gigabit Ethernet and integrated USB PHYs support connected gateway and communication module implementations.
  • Real‑time control subsystems  The Cortex‑M4 core can handle deterministic control tasks while the Cortex‑A9 manages the user experience and higher‑level processing.

Unique Advantages

  • Heterogeneous processing model: Combines application‑level processing (ARM Cortex‑A9) with a dedicated real‑time core (ARM Cortex‑M4) to separate workload domains and simplify system partitioning.
  • Integrated connectivity: Dual Gigabit Ethernet and multiple USB PHYs reduce external component count for networked embedded systems.
  • Comprehensive security feature set: On‑chip A‑HAB, TrustZone and CAAM support secure boot and cryptographic functions to protect system integrity.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support enables designers to right‑size memory performance and cost for target applications.
  • Industrial temperature capability: −40 °C to 125 °C operating range supports deployment in thermally demanding environments.
  • Compact BGA package: 400‑MAPBGA (17×17) offers a small footprint for space‑constrained PCB layouts.

Why Choose MCIMX6X1AVO08AC?

The MCIMX6X1AVO08AC positions itself as a versatile embedded processor delivering a balanced mix of application processing and real‑time control with extensive I/O and security capabilities. Its heterogeneous core architecture, multi‑standard memory support, and integrated connectivity make it suitable for designers who need to combine user experience processing with deterministic subsystem control.

Backed by NXP Semiconductors documentation and the i.MX 6SoloX series technical datasheet, this part is appropriate for projects that require documented performance envelopes, a compact MAPBGA package, and a broad peripheral set for connected embedded designs.

Request a quote or submit a procurement inquiry to begin sourcing MCIMX6X1AVO08AC for your next embedded design.

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