MCIMX6X1CVO08AB

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17)

Quantity 1,487 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1CVO08AB – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X1CVO08AB is a dual-core i.MX 6SX microprocessor from NXP Semiconductors combining ARM® Cortex®-A9 and ARM® Cortex®-M4 architectures. It pairs a high-performance 800 MHz Cortex‑A9 application core with a 200 MHz Cortex‑M4 real-time core in a compact 400‑MAPBGA (17×17) surface‑mount package.

Designed for embedded and industrial applications, this device delivers a mix of application processing and deterministic control, integrated high‑speed networking and USB connectivity, and hardware security features for robust system designs across industrial, HMI and networked embedded use cases.

Key Features

  • Processor Cores 
    Dual‑core ARM architecture combining an ARM® Cortex®‑A9 application core (800 MHz) and an ARM® Cortex®‑M4 real‑time core (200 MHz) for split application and control tasks.
  • Memory Interfaces 
    Supports LPDDR2, LVDDR3 and DDR3 memory controllers to match a range of system memory requirements.
  • Connectivity 
    Dual 10/100/1000 Mbps Ethernet ports and multiple USB interfaces (USB 2.0 + PHY ×1 and USB 2.0 OTG + PHY ×2) for high‑bandwidth networked and peripheral connections.
  • Display and Audio I/O 
    Integrated display interface controllers for keypad and LCD support plus AC'97 audio interface for legacy audio paths.
  • Security 
    Hardware security features including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE to support platform integrity and secure boot strategies.
  • Package and Mounting 
    400‑MAPBGA (17×17) package in a surface‑mount form factor for space‑efficient board designs.
  • Industrial Qualification & Temperature Range 
    Industrial qualification with an operating temperature range of −40 °C to 105 °C for demanding environments.
  • Compliance 
    RoHS compliant construction for regulatory conformity in many manufacturing environments.
  • Graphics Acceleration 
    Graphics acceleration: No (explicitly indicated), enabling designers to plan system graphics requirements accordingly.

Typical Applications

  • Digital Signage 
    Networked media players and signage controllers that benefit from dual gigabit Ethernet and dual‑core processing to manage content delivery and local control.
  • Human–Machine Interfaces (HMI) 
    Touch and display controllers that use the Cortex‑A9 for user interface tasks and the Cortex‑M4 for responsive control and real‑time processing.
  • Intelligent Industrial Control Systems 
    Control nodes and gateways operating across −40 °C to 105 °C where industrial qualification and integrated security features support reliable operation.
  • IoT Gateways 
    Edge gateway designs leveraging multiple Ethernet ports, USB connectivity and a scalable multicore architecture for protocol bridging and local processing.
  • Point‑of‑Sale Devices 
    Payment terminals and POS controllers needing secure boot and cryptographic support alongside robust I/O and network connectivity.

Unique Advantages

  • Dual‑core architecture with dedicated real‑time core: Separates application processing (Cortex‑A9) from deterministic control (Cortex‑M4), simplifying real‑time system design.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support enables designers to choose memory options that balance cost and performance.
  • High‑throughput networking and USB: Dual gigabit Ethernet and multiple USB PHYs reduce external bridging components and simplify connectivity design.
  • Comprehensive hardware security: On‑chip security modules (A‑HAB, TrustZone, CAAM, CSU, SNVS) enable robust platform security and trusted boot implementations.
  • Industrial temperature range and qualification: Rated for −40 °C to 105 °C and designated for industrial use, supporting deployments in harsh environments.
  • Compact BGA footprint: 400‑MAPBGA (17×17) package supports dense board layouts while retaining extensive I/O and feature integration.

Why Choose MCIMX6X1CVO08AB?

The MCIMX6X1CVO08AB positions itself as a balanced embedded processor that combines an 800 MHz ARM® Cortex®‑A9 with a 200 MHz ARM® Cortex®‑M4 to deliver both application throughput and deterministic control in a single device. Its integrated connectivity, flexible memory support and strong hardware security make it suitable for industrial, HMI, gateway and POS designs that require a mix of performance, reliability and system integration.

Backed by the i.MX 6 series platform approach, this device offers scalability within the series and alignment with NXP’s ecosystem and documentation, helping teams reduce BOM complexity and accelerate time‑to‑market for embedded solutions.

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