MCIMX6X1EVK10AB
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (14x14) |
|---|---|
| Quantity | 55 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 400-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 400-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 227MHz, 1GHz | Supplier Device Package | 400-MAPBGA (14×14) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X1EVK10AB – IC MPU I.MX6SX 1GHZ 400MAPBGA
The MCIMX6X1EVK10AB is an NXP Semiconductors i.MX 6X series microprocessor featuring heterogeneous dual cores: an ARM® Cortex®-A9 core operating up to 1 GHz paired with an ARM® Cortex®-M4 core at 227 MHz. It targets embedded applications that require a mix of high-performance application processing and real-time microcontroller-class control.
Designed for embedded and industrial use, the device offers integrated memory controller support, multi‑port Ethernet and USB connectivity, and a compact 400‑MAPBGA (14×14) surface‑mount package, providing a balance of performance, integration and system-level security features.
Key Features
- Core Dual-core architecture combining an ARM® Cortex®-A9 application core up to 1 GHz and an ARM® Cortex®-M4 core at 227 MHz for mixed application and real-time processing.
- Memory Interfaces Supported memory controllers include LPDDR2, LVDDR3 and DDR3 to accommodate a range of system memory designs.
- Connectivity Dual 10/100/1000 Mbps Ethernet ports and multiple USB PHYs (USB 2.0 + PHY and USB 2.0 OTG + PHY) provide high-speed wired interfaces for networking and peripherals.
- Display & Audio Interfaces Display interface controllers support keypad and LCD integration; additional audio/legacy interface support includes AC'97.
- Security Hardware security features include A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE to support secure boot and system integrity functions.
- Package & Mounting Available in a 400‑MAPBGA (14×14) supplier device package / 400‑LFBGA case, designed for surface‑mount assembly.
- Operating Range & Compliance Rated for an operating temperature range of −20 °C to 105 °C and RoHS compliant for environmental compliance in manufacturing.
Typical Applications
- Digital Signage — Drive content playback and networked display systems with multi‑core processing and gigabit Ethernet connectivity.
- Human‑Machine Interfaces (HMI) — Run responsive user interfaces and keypad/LCD control while offloading deterministic tasks to the M4 core.
- IoT Gateways — Combine application processing and secure connectivity for protocol bridging and edge data aggregation.
- Point‑of‑Sale (POS) Devices — Support transaction processing, peripheral connectivity and network links via integrated USB and Ethernet interfaces.
- Portable Medical Devices — Enable embedded control and data handling in compact systems within the specified temperature range.
Unique Advantages
- Heterogeneous dual‑core processing: Combines a high‑performance Cortex‑A9 application core with a Cortex‑M4 real‑time core to partition tasks between rich OS workloads and deterministic control.
- Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller compatibility lets designers choose memory technology to match performance and cost targets.
- Robust wired connectivity: Dual gigabit Ethernet ports and multiple USB PHYs simplify networked and peripheral system design without external bridging.
- Comprehensive hardware security: Built‑in features such as A‑HAB, ARM TrustZone and CAAM enable secure boot and cryptographic acceleration for protected systems.
- Compact, manufacturable package: 400‑MAPBGA (14×14) surface‑mount package supports dense board layouts and automated assembly processes.
- Industry‑oriented thermal range and compliance: −20 °C to 105 °C rating and RoHS compliance align with a range of embedded deployment environments and manufacturing standards.
Why Choose MCIMX6X1EVK10AB?
The MCIMX6X1EVK10AB positions itself as a scalable, dual‑core embedded processor for designs that require a mix of high‑performance application processing and real‑time control. Its combination of Cortex‑A9 and Cortex‑M4 cores, broad memory interface support, multi‑port Ethernet and USB connectivity, and integrated security features make it suitable for diverse embedded systems where integration and reliability matter.
The device is part of the i.MX 6 series platform, which offers scalable multicore solutions and is supported by companion power management ICs and vendor resources, helping teams develop and scale products across related i.MX platforms.
Request a quote or submit a sales inquiry for MCIMX6X1EVK10AB to receive pricing and availability information and discuss how this processor fits your next embedded design.

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