MCIMX6X1CVO08AC

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17)

Quantity 841 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1CVO08AC – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X1CVO08AC is an industrial-grade heterogeneous microprocessor featuring ARM® Cortex®‑A9 and ARM® Cortex®‑M4 cores in a 2‑core, 32‑bit configuration. The device pairs an ARM Cortex‑A9 core operating up to 800 MHz with an ARM Cortex‑M4 core at 200 MHz to address applications that require both high‑performance application processing and real‑time control.

Designed for embedded and industrial systems, the part offers integrated connectivity, memory interfaces and on‑device security features to support networked, secure and user‑interface driven designs in harsh operating environments.

Key Features

  • Heterogeneous CPU cores — ARM® Cortex®‑A9 (up to 800 MHz) plus ARM® Cortex®‑M4 (200 MHz) for split application and real‑time processing.
  • 2‑core, 32‑bit architecture — Dual‑core design with 32‑bit bus width for conventional embedded software models.
  • Memory controller support — Interfaces for LPDDR2, LVDDR3 and DDR3 memory types to match application memory-performance and cost targets.
  • Connectivity — Dual 10/100/1000 Mbps Ethernet ports and multiple USB ports (USB 2.0 + PHY ×1, USB 2.0 OTG + PHY ×2) for wired networking and peripheral attachment.
  • Display and HMI — Integrated controllers for LCD and keypad interfaces to support operator displays and simple human‑machine interfaces.
  • Security and system integrity — On‑chip features including A‑HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE for device authentication and secure operation.
  • Co‑processing and media — Multimedia co‑processor support and NEON™ MPE for accelerated media processing tasks.
  • Industrial qualification and temperature range — Qualified for industrial use with an operating temperature range of −40 °C to 105 °C.
  • Compact surface‑mount package — 400‑MAPBGA (17 × 17 mm) package for space‑constrained board designs.
  • Additional interfaces — AC'97 support for legacy audio or codec connectivity.
  • RoHS compliant — Conforms to RoHS requirements for lead‑free assembly.

Typical Applications

  • Industrial Control — Use the dual‑core MCU architecture and industrial temperature rating for control systems that require both application processing and real‑time tasks.
  • Human‑Machine Interfaces (HMI) — Drive LCD displays and keypad input for operator panels and machine interfaces that need responsive UI control.
  • Networked Embedded Systems — Dual gigabit Ethernet and multiple USB channels enable connected devices such as gateways, controllers and instrumentation.
  • Secure Embedded Appliances — Built‑in security modules (A‑HAB, ARM TZ, CAAM, SNVS) support authenticated boot and runtime protection for secure devices.

Unique Advantages

  • Heterogeneous processing — Separate Cortex‑A9 and Cortex‑M4 cores let designers partition compute‑intensive application code and deterministic control functions for cleaner system architecture.
  • Broad memory flexibility — Support for LPDDR2, LVDDR3 and DDR3 lets designers choose memory technologies to balance cost and performance.
  • Integrated wired connectivity — Two gigabit Ethernet ports and multiple USB PHYs reduce external controller requirements for networking and peripheral I/O.
  • Industrial readiness — Industrial qualification and extended temperature range simplify selection for factory and field deployments.
  • On‑chip security stack — Multiple hardware security modules and trusted execution features enable robust device authentication and secure boot strategies.
  • Compact package for dense boards — 400‑MAPBGA (17×17 mm) surface‑mount package supports compact designs without sacrificing I/O capability.

Why Choose MCIMX6X1CVO08AC?

The MCIMX6X1CVO08AC positions itself as a versatile embedded processor for industrial and embedded applications that require a combination of application performance and real‑time responsiveness. Its heterogeneous ARM cores, broad memory interface support and extensive connectivity options make it suitable for designs that must integrate networking, secure boot and human‑machine interface functionality in a single device.

With industrial qualification, a comprehensive set of on‑chip security features and a compact 400‑MAPBGA package, this part is intended for engineers seeking a scalable, robust MPU platform backed by a detailed technical datasheet and device documentation.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the MCIMX6X1CVO08AC.

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