MCIMX6X1CVO08ACR

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17)

Quantity 1,043 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1CVO08ACR – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X1CVO08ACR is an industrial-grade microprocessor IC from the i.MX 6X series featuring heterogeneous ARM processing cores. It integrates an ARM® Cortex®-A9 application-class core and an ARM® Cortex®-M4 real-time core in a dual-core, 32-bit architecture optimized for embedded applications.

Designed for industrial and embedded systems, this device delivers a combination of application processing and real-time control, with memory controller support and robust I/O connectivity to address advanced industrial, medical and networked embedded designs while meeting extended temperature ranges.

Key Features

  • Dual-Core Architecture  ARM® Cortex®-A9 and ARM® Cortex®-M4 cores provide application-class processing alongside a dedicated real-time processor for responsive control tasks. The series supports Cortex-A9 operation up to 800 MHz while this device lists a 200 MHz core speed for the real-time domain.
  • Memory Support  Integrated memory controllers support LPDDR2, LVDDR3 and DDR3 memory types to match a range of system performance and cost targets.
  • High-Speed Networking  Dual 10/100/1000 Mbps Ethernet interfaces enable gigabit-capable wired networking for industrial communications and edge applications.
  • USB Connectivity  Multiple USB interfaces including USB 2.0 with PHY and USB 2.0 OTG with PHY provide flexible peripheral and host connectivity options.
  • Security and System Integrity  On-chip security features include A-HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE to support secure boot and runtime protections.
  • Industrial Qualification & Temperature Range  Qualified for industrial use with an operating temperature range of –40 °C to 105 °C for deployment in demanding environments.
  • Display and Audio Interfaces  Includes LCD and keypad display interface controllers and AC'97 support for legacy audio connectivity.
  • Package and Mounting  Supplied in a 400-MAPBGA (17×17 mm) surface-mount package for compact board integration.

Typical Applications

  • Industrial Control Systems  Dual-core processing and real-time responsiveness suit motion control, PLCs and factory automation where deterministic control and application processing coexist.
  • Medical Devices  Industrial qualification and secure boot/security features support medical instrumentation that requires reliable operation across extended temperature ranges.
  • Human Machine Interfaces (HMI)  Integrated display interfaces and application-class processing enable responsive user interfaces and local graphics control.
  • Edge Networking and Gateways  Dual gigabit Ethernet and multiple USB interfaces allow robust wired connectivity for edge routers, protocol gateways and data aggregation nodes.

Unique Advantages

  • Heterogeneous Processing: Combines an ARM Cortex-A9 application core with an ARM Cortex-M4 real-time core to separate high-level OS workloads from low-latency control tasks.
  • Broad Memory Compatibility: Built-in controllers for LPDDR2, LVDDR3 and DDR3 simplify memory selection across cost and performance points.
  • Industrial-Grade Reliability: Industrial qualification and –40 °C to 105 °C operating range enable deployment in harsh and temperature-variable environments.
  • Robust Security Suite: Multiple on-chip security modules (A-HAB, ARM TZ, CAAM, CSU, SNVS) support secure boot, trusted execution and runtime protection.
  • Flexible Connectivity: Dual gigabit Ethernet ports plus USB host/OTG and AC'97 provide a comprehensive set of interfaces for networking, I/O expansion and multimedia peripherals.
  • Compact Surface-Mount Package: 400-MAPBGA (17×17 mm) footprint supports dense board layouts and modern embedded form factors.

Why Choose MCIMX6X1CVO08ACR?

The MCIMX6X1CVO08ACR positions itself as a capable, industrially qualified embedded processor that balances application performance and real-time control within a single device. Its dual-core ARM architecture, comprehensive security feature set and wide memory support make it suitable for designs that require both responsive user-facing processing and deterministic control tasks.

This part is well suited to developers and system designers building industrial automation, medical instrumentation, HMI and edge networking devices who need a compact, secure and thermally robust MPU solution backed by the i.MX 6X series ecosystem and documentation.

Request a quote or submit your specifications to receive pricing, availability and lead-time information for the MCIMX6X1CVO08ACR. Our team can assist with volume requirements and delivery planning.

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