MCIMX6X1CVO08ABR
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17) |
|---|---|
| Quantity | 1,766 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 400-MAPBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 400-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 200MHz, 800MHz | Supplier Device Package | 400-MAPBGA (17×17) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X1CVO08ABR – IC MPU I.MX6SX 800MHZ 400MAPBGA
The MCIMX6X1CVO08ABR is an NXP i.MX 6X series microprocessor module combining ARM® Cortex®-A9 and ARM® Cortex®-M4 cores in a heterogeneous dual-core architecture. It is designed for industrial applications requiring integrated connectivity, real-time responsiveness, and robust security features.
This device offers a broad set of interfaces and memory controller support, industrial qualification, and an extended operating temperature range for deployment in demanding embedded systems.
Key Features
- Dual-Core Architecture ARM® Cortex®-A9 and ARM® Cortex®-M4 cores provide a heterogeneous processing model; the part description lists core frequencies of 800 MHz and 200 MHz respectively for application and real-time tasks.
- Multimedia and SIMD Acceleration On-chip multimedia DSP and NEON™ MPE support for compute-intensive media processing.
- Memory Interfaces Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types to match a range of system memory designs.
- Display and HMI Support Display interface controllers for LCD and keypad peripherals to support human-machine interfaces.
- High-Speed Connectivity Dual 10/100/1000 Mbps Ethernet ports and multiple USB 2.0 interfaces (one USB 2.0 + PHY and two USB 2.0 OTG + PHY) for wired networking and host/device connectivity.
- Audio/Legacy Codec Interface AC'97 interface available for legacy audio codec integration.
- Security and Debug Hardware security and system management features including A-HAB, ARM TrustZone (TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE.
- Industrial Qualification & Temperature Range Industrial-grade qualification with an operating temperature range of -40 °C to 105 °C for reliable operation in harsh environments.
- Package & Mounting Available in a 400-ball MAPBGA (17 × 17 mm) package (also listed as 400-LFBGA); designed for surface-mount PCB assembly.
- RoHS Compliant Meets RoHS environmental requirements.
Typical Applications
- Industrial HMI and Control Panels LCD and keypad interfaces combined with multimedia DSP/NEON acceleration support responsive user interfaces and local processing for industrial operator panels.
- Industrial Communication Gateways Dual gigabit Ethernet and multiple USB interfaces enable high-throughput networked devices and protocol bridging.
- Medical and Instrumentation Devices Industrial qualification, extended temperature range, and on-chip security features support robust operation and data protection in regulated equipment.
- Embedded Real-Time Subsystems The ARM Cortex-M4 core provides a dedicated real-time processing domain for sensor interfacing and control tasks while the Cortex-A9 handles application-level processing.
Unique Advantages
- Heterogeneous Dual-Core Design: Enables separation of real-time control and application processing to simplify system partitioning and improve responsiveness.
- Broad Memory Support: LPDDR2, LVDDR3 and DDR3 controller compatibility provides flexibility in selecting memory for performance, cost, and power trade-offs.
- Comprehensive Connectivity: Dual gigabit Ethernet and multiple USB PHYs reduce external interface components and accelerate integration of networked systems.
- Security-Ready Platform: Integrated security modules (A-HAB, ARM TZ, CAAM, CSU, SNVS) help implement secure boot and runtime protection strategies.
- Industrial Reliability: Industrial qualification and -40 °C to 105 °C operating range support deployment in temperature-extreme and industrial environments.
- Compact Surface-Mount Package: 400-MAPBGA (17 × 17 mm) package enables high-density PCB layouts for space-constrained embedded designs.
Why Choose MCIMX6X1CVO08ABR?
The MCIMX6X1CVO08ABR positions itself as a versatile, industrial-grade application processor combining ARM Cortex-A9 and Cortex-M4 cores with a wide set of connectivity, memory interface options, and hardware security features. Its package and thermal range make it suitable for embedded systems where integration, deterministic control, and network connectivity are required.
For designs that demand a balance of application performance, real-time control capability, and industrial robustness, this part delivers a well-rounded foundation with the interface set and qualification needed to accelerate development and reduce BOM complexity.
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