MCIMX6X1EVK10AC
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (14x14) |
|---|---|
| Quantity | 526 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 400-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 400-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 227MHz, 1GHz | Supplier Device Package | 400-MAPBGA (14×14) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X1EVK10AC – IC MPU I.MX6SX 1GHZ 400MAPBGA
The MCIMX6X1EVK10AC is a dual-core microprocessor IC from NXP’s i.MX 6X family, combining an ARM® Cortex®-A9 application core with an ARM® Cortex®-M4 real-time core. The device targets connected devices and consumer product designs that require a mix of high-performance application processing and deterministic real-time control.
Designed for integration and efficient system partitioning, the part delivers heterogeneous multicore capability—Cortex‑A9 operation up to 1 GHz and Cortex‑M4 operation up to 227 MHz—along with a broad set of memory and peripheral interfaces to support embedded and multimedia-focused systems.
Key Features
- Cores & Performance Heterogeneous dual-core architecture: ARM® Cortex®-A9 (up to 1 GHz) paired with ARM® Cortex®-M4 (up to 227 MHz) for application throughput plus real-time responsiveness.
- Core DSPs Includes multimedia co-processor support and NEON™ MPE for accelerated media and signal processing tasks.
- Memory Interfaces Flexible memory controller support for LPDDR2, LVDDR3, and DDR3 to match multiple system memory architectures.
- Connectivity & I/O Two 10/100/1000 Mbps Ethernet ports and multiple USB controllers: USB 2.0 + PHY (1) and USB 2.0 OTG + PHY (2). Additional AC'97 interface and display controllers for keypad and LCD integration.
- Security Comprehensive security feature set including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG, and TVDECODE for system protection and secure boot options.
- Package & Mounting Supplied in a 400-MAPBGA (14 × 14 mm) surface-mount package suitable for high-density board designs.
- Operating Range & Compliance Extended operating temperature from −20 °C to 105 °C and RoHS compliant.
- Graphics Graphics acceleration is not present on this specific device.
Typical Applications
- Connected Devices Enables IoT and connected consumer devices that require application processing plus secure, real-time control.
- Consumer Electronics Suitable for consumer products requiring multimedia processing and a mix of high-level and low-latency control tasks.
- Embedded Networking Dual Gigabit Ethernet and multiple USB interfaces support networked embedded systems and communication gateways.
- Real-Time Control Systems Cortex‑M4 real-time core provides deterministic control for sensor interfacing and time-sensitive tasks alongside the application core.
Unique Advantages
- Heterogeneous Processing: Combines a high-speed Cortex‑A9 application core and a Cortex‑M4 real-time core to separate application and control workloads efficiently.
- Integrated Security Suite: On-chip A-HAB, ARM TrustZone, CAAM and related modules help simplify implementation of secure boot and protected services.
- Flexible Memory Support: LPDDR2, LVDDR3, and DDR3 controller support enables designers to choose the memory type that matches performance and cost targets.
- Robust Connectivity: Dual gigabit Ethernet and multiple USB ports provide high-throughput I/O options for networked and peripheral-rich designs.
- Industrial Temperature Range: −20 °C to 105 °C operating range supports deployment in a variety of embedded environments.
- Compact BGA Package: 400-MAPBGA (14×14 mm) package offers high I/O density in a compact form factor for space-constrained PCBs.
Why Choose MCIMX6X1EVK10AC?
The MCIMX6X1EVK10AC positions itself as a versatile embedded processor for designers who need both application-level performance and deterministic real-time control in a single device. Its heterogeneous ARM® Cortex® cores, flexible memory interfaces, rich connectivity (including dual gigabit Ethernet and multiple USB PHYs), and comprehensive on-chip security features make it well suited to connected devices and consumer-focused embedded systems.
With a compact 400-MAPBGA package, extended operating temperature and RoHS compliance, this part offers a balance of integration and robustness for projects that require integration of application processing, real-time tasks, and secure connectivity.
Request a quote or submit an inquiry to receive pricing, availability, and technical support for the MCIMX6X1EVK10AC. Our team can provide the information needed to evaluate this processor for your design.

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