MCIMX6X1EVK10AC

IC MPU I.MX6SX 1GHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (14x14)

Quantity 526 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (14x14)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed227MHz, 1GHzSupplier Device Package400-MAPBGA (14×14)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1EVK10AC – IC MPU I.MX6SX 1GHZ 400MAPBGA

The MCIMX6X1EVK10AC is a dual-core microprocessor IC from NXP’s i.MX 6X family, combining an ARM® Cortex®-A9 application core with an ARM® Cortex®-M4 real-time core. The device targets connected devices and consumer product designs that require a mix of high-performance application processing and deterministic real-time control.

Designed for integration and efficient system partitioning, the part delivers heterogeneous multicore capability—Cortex‑A9 operation up to 1 GHz and Cortex‑M4 operation up to 227 MHz—along with a broad set of memory and peripheral interfaces to support embedded and multimedia-focused systems.

Key Features

  • Cores & Performance  Heterogeneous dual-core architecture: ARM® Cortex®-A9 (up to 1 GHz) paired with ARM® Cortex®-M4 (up to 227 MHz) for application throughput plus real-time responsiveness.
  • Core DSPs  Includes multimedia co-processor support and NEON™ MPE for accelerated media and signal processing tasks.
  • Memory Interfaces  Flexible memory controller support for LPDDR2, LVDDR3, and DDR3 to match multiple system memory architectures.
  • Connectivity & I/O  Two 10/100/1000 Mbps Ethernet ports and multiple USB controllers: USB 2.0 + PHY (1) and USB 2.0 OTG + PHY (2). Additional AC'97 interface and display controllers for keypad and LCD integration.
  • Security  Comprehensive security feature set including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG, and TVDECODE for system protection and secure boot options.
  • Package & Mounting  Supplied in a 400-MAPBGA (14 × 14 mm) surface-mount package suitable for high-density board designs.
  • Operating Range & Compliance  Extended operating temperature from −20 °C to 105 °C and RoHS compliant.
  • Graphics  Graphics acceleration is not present on this specific device.

Typical Applications

  • Connected Devices  Enables IoT and connected consumer devices that require application processing plus secure, real-time control.
  • Consumer Electronics  Suitable for consumer products requiring multimedia processing and a mix of high-level and low-latency control tasks.
  • Embedded Networking  Dual Gigabit Ethernet and multiple USB interfaces support networked embedded systems and communication gateways.
  • Real-Time Control Systems  Cortex‑M4 real-time core provides deterministic control for sensor interfacing and time-sensitive tasks alongside the application core.

Unique Advantages

  • Heterogeneous Processing: Combines a high-speed Cortex‑A9 application core and a Cortex‑M4 real-time core to separate application and control workloads efficiently.
  • Integrated Security Suite: On-chip A-HAB, ARM TrustZone, CAAM and related modules help simplify implementation of secure boot and protected services.
  • Flexible Memory Support: LPDDR2, LVDDR3, and DDR3 controller support enables designers to choose the memory type that matches performance and cost targets.
  • Robust Connectivity: Dual gigabit Ethernet and multiple USB ports provide high-throughput I/O options for networked and peripheral-rich designs.
  • Industrial Temperature Range: −20 °C to 105 °C operating range supports deployment in a variety of embedded environments.
  • Compact BGA Package: 400-MAPBGA (14×14 mm) package offers high I/O density in a compact form factor for space-constrained PCBs.

Why Choose MCIMX6X1EVK10AC?

The MCIMX6X1EVK10AC positions itself as a versatile embedded processor for designers who need both application-level performance and deterministic real-time control in a single device. Its heterogeneous ARM® Cortex® cores, flexible memory interfaces, rich connectivity (including dual gigabit Ethernet and multiple USB PHYs), and comprehensive on-chip security features make it well suited to connected devices and consumer-focused embedded systems.

With a compact 400-MAPBGA package, extended operating temperature and RoHS compliance, this part offers a balance of integration and robustness for projects that require integration of application processing, real-time tasks, and secure connectivity.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for the MCIMX6X1EVK10AC. Our team can provide the information needed to evaluate this processor for your design.

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