MCIMX6X2AVN08AB

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17)

Quantity 663 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X2AVN08AB – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X2AVN08AB is an industrial-qualified microprocessor integrating ARM® Cortex®-A9 and ARM® Cortex®-M4 cores in a compact 400-MAPBGA (17×17) surface-mount package. It combines multi-core processing, hardware multimedia acceleration and a broad set of peripheral interfaces to address embedded designs that require performance, connectivity and on-chip security.

Designed for applications ranging from HMI and industrial control to networked multimedia devices, this i.MX 6X family device emphasizes system integration, flexible memory support and rugged operating range for demanding environments.

Key Features

  • Core Architecture  Dual-core ARM® Cortex®-A9 plus an ARM® Cortex®-M4 co-processor provide a heterogeneous processing environment for application and real-time tasks.
  • Clock Domains  Documented speeds include 200 MHz and 800 MHz values in the part description, supporting multi-frequency operation across cores.
  • Memory Interfaces  Integrated controllers support LPDDR2, LVDDR3 and DDR3 memory types for flexible system memory choices.
  • Graphics & Display  Includes graphics acceleration and display interface controllers for LCD and keypad-driven user interfaces.
  • Connectivity  Dual Gigabit Ethernet (10/100/1000 Mbps) and multiple USB 2.0 ports (one USB 2.0 + PHY and two USB 2.0 OTG + PHY) enable high-performance wired networking and peripheral support.
  • Audio & Legacy Interfaces  Additional interfaces include AC'97 for legacy audio connectivity.
  • Security Subsystems  Hardware security features include A‑HAB, ARM TrustZone (TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE for on-chip secure boot and runtime protection capabilities.
  • Package & Mounting  Supplied in a 400-LFBGA / 400-MAPBGA (17×17) surface-mount package suitable for space-constrained board designs.
  • Industrial Temperature Range  Rated for operation from −40 °C to 125 °C to meet industrial environment requirements.

Typical Applications

  • Industrial Control  Real-time tasks and application processing separation provided by the Cortex‑M4 and Cortex‑A9 cores support PLC, motion control and equipment interface functions.
  • Human‑Machine Interfaces (HMI)  Graphics acceleration and LCD/keypad controllers enable responsive displays and user interfaces for control panels and operator stations.
  • Networking & Communications  Dual Gigabit Ethernet and multiple USB ports allow robust wired connectivity for gateways, routers and networked embedded appliances.
  • Multimedia Devices  Multimedia DSP support and NEON™ MPE acceleration provide processing resources for audio/video processing and rich media applications.

Unique Advantages

  • Heterogeneous Processing: Combined ARM Cortex‑A9 and Cortex‑M4 cores let designers allocate high-level OS tasks and real‑time processing to the most efficient core.
  • Integrated Security Hardware: On-chip A‑HAB, TrustZone and CAAM reduce external security components and simplify secure system design.
  • Flexible Memory Support: LPDDR2, LVDDR3 and DDR3 controller compatibility lowers BOM risk by supporting multiple memory choices.
  • High‑Throughput Connectivity: Dual Gigabit Ethernet ports and USB 2.0 interfaces enable high-bandwidth data transfer and peripheral integration.
  • Rugged Operating Range: Industrial temperature qualification (−40 °C to 125 °C) supports deployment in harsh operational environments.
  • Compact Surface‑Mount Package: The 400-MAPBGA (17×17) footprint offers a balance of I/O density and board space efficiency for embedded systems.

Why Choose MCIMX6X2AVN08AB?

The MCIMX6X2AVN08AB places multi-core performance, hardware security and broad interfacing into an industrial‑grade package, enabling designs that demand both application processing and deterministic real-time control. Its flexible memory support and high-speed Ethernet/USB connectivity simplify system architecture for networked and multimedia-enabled embedded products.

This device is appropriate for engineers building industrial control systems, HMIs, gateway appliances or multimedia-enabled embedded platforms that require integrated security, robust thermal operation and a compact surface-mount form factor backed by the i.MX 6 series ecosystem.

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