MCIMX6X2CVN08AB

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17)

Quantity 293 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X2CVN08AB – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X2CVN08AB is an NXP i.MX 6X series multicore microprocessor integrating an ARM® Cortex®-A9 core and an ARM® Cortex®-M4 core. The device combines high-performance application processing with a real-time microcontroller core, addressing consumer and industrial embedded designs that require multimedia, connectivity, and deterministic control.

Designed for integrated multimedia and connectivity solutions, the part emphasizes performance, security and broad memory and peripheral support to simplify system design and improve time-to-market.

Key Features

  • Heterogeneous CPU cores — ARM® Cortex®-A9 and ARM® Cortex®-M4 cores, providing application-level processing and a dedicated 200 MHz microcontroller core.
  • Core performance — Cortex-A9 core operating at 800 MHz for application and multimedia workloads; Cortex-M4 at 200 MHz for real-time tasks.
  • Memory controller support — On-chip controllers for LPDDR2, LVDDR3 and DDR3 memory types to match system memory performance and cost targets.
  • Graphics and multimedia — Integrated graphics acceleration for 2D/3D and video use cases (graphics acceleration: Yes).
  • Connectivity — Dual 10/100/1000 Mbps Ethernet interfaces and multiple USB options: one USB 2.0 with PHY and two USB 2.0 OTG with PHY.
  • Security and system management — Hardware features including A-HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot, cryptography and system debug.
  • Peripherals and audio — Integrated display controllers (LCD, keypad) and AC'97 audio interface for human‑machine interfaces.
  • Package and mounting — 400-ball MAPBGA supplier package (400-MAPBGA, 17×17) / 400-LFBGA case; surface-mount device.
  • Industrial temperature rating — Qualified for industrial use with an operating temperature range of −40 °C to 105 °C.
  • RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

  • Digital signage and displays — Hardware-accelerated graphics and LCD interface support enable rich user interfaces and multimedia playback.
  • Human‑machine interfaces (HMI) — Combined application and real-time cores support responsive UI control alongside deterministic I/O handling.
  • IoT gateways and industrial control — Dual gigabit Ethernet, extensive security features and industrial temperature range suit networked embedded controllers and gateways.
  • Point‑of‑sale and IP phones — Integrated connectivity and multimedia support simplify design for communication and POS terminals.

Unique Advantages

  • Heterogeneous dual-core architecture: Separates application processing (Cortex-A9) from real-time control (Cortex-M4) to simplify mixed workload designs.
  • Broad memory compatibility: Support for LPDDR2, LVDDR3 and DDR3 offers flexibility across performance and cost trade-offs.
  • Rich connectivity: Dual gigabit Ethernet and multiple USB PHYs reduce external bridge and PHY requirements for connected products.
  • Comprehensive security set: On-chip security engines and TrustZone enable secure boot and cryptographic acceleration without external coprocessors.
  • Industrial-ready thermal range: −40 °C to 105 °C qualification supports reliable operation in demanding environments.
  • Reduced BOM and integration: Integrated graphics acceleration, display controllers, audio interface and peripheral controllers lower component count and simplify layout.

Why Choose MCIMX6X2CVN08AB?

The MCIMX6X2CVN08AB positions itself as a versatile embedded application processor combining an ARM® Cortex®-A9 application core and an ARM® Cortex®-M4 real-time core to address multimedia-rich and connected industrial designs. Its integrated security features, flexible memory support and multiple high-speed interfaces provide a balanced platform for designs that need both performance and deterministic control.

As part of the i.MX 6 series, the device benefits from platform-level scalability and ecosystem support, including companion power management ICs for system-level integration. This makes it well suited for engineers designing consumer and industrial products that require multimedia capabilities, secure operation and robust connectivity.

If you would like pricing or availability for MCIMX6X2CVN08AB, submit a quote request or contact our sales team to request a formal quote and technical assistance.

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