MCIMX6X2CVN08AC
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17) |
|---|---|
| Quantity | 134 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 400-MAPBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 400-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 200MHz, 800MHz | Supplier Device Package | 400-MAPBGA (17×17) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X2CVN08AC – IC MPU I.MX6SX 800MHZ 400MAPBGA
The MCIMX6X2CVN08AC is an NXP Semiconductors i.MX 6X series microprocessor integrating an ARM® Cortex®-A9 core and an ARM® Cortex®-M4 core in a heterogeneous multicore architecture. The device combines an 800 MHz-class Cortex‑A9 processing engine with a 200 MHz Cortex‑M4 real‑time controller to address embedded designs requiring both application-level performance and deterministic control.
Targeted for industrial and embedded applications, the part offers graphics acceleration, multiple memory interface options, integrated connectivity and security features, and industrial qualification for extended temperature operation.
Key Features
- Dual-Core Architecture ARM® Cortex‑A9 and ARM® Cortex‑M4 cores provide a split between high‑performance application processing and real‑time control.
- Performance Cortex‑A9 up to 800 MHz and Cortex‑M4 at 200 MHz (as listed) for responsive UI and deterministic tasks.
- Multimedia Acceleration Co‑processor support for multimedia and NEON™ MPE to accelerate 2D/3D and media workloads; graphics acceleration is included.
- Memory Interfaces Supports LPDDR2, LVDDR3 and DDR3 memory controllers for flexible system memory choices.
- Display and I/O Integrated display interface controllers including keypad and LCD support, suitable for human‑machine interfaces.
- High‑Speed Connectivity Two 10/100/1000 Mbps Ethernet controllers and multiple USB 2.0 ports (USB 2.0 + PHY ×1, USB 2.0 OTG + PHY ×2) provide robust wired I/O options.
- Security and System Debug Security features include A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE to support secure boot and system integrity workflows.
- Audio/Legacy Interface Includes AC’97 for legacy audio or codec interfacing.
- Package and Mounting Supplied in a 400‑MAPBGA (17 × 17 mm) surface‑mount package (400‑LFBGA case).
- Industrial Qualification and Temperature Range Industrial qualification with operating temperature from −40 °C to 105 °C for extended environmental use.
- Regulatory Compliance RoHS‑compliant device.
Typical Applications
- Industrial Control and HMI Graphically capable display controller and multimedia acceleration make this device suitable for human‑machine interfaces and industrial operator panels.
- Embedded Networking Appliances Dual Gigabit Ethernet controllers and multiple USB interfaces enable networked embedded systems and gateway devices.
- Medical and Instrumentation Industrial qualification and broad temperature range support medical and diagnostic instruments that require reliable operation and responsive user interfaces.
- Multi‑domain Embedded Systems Heterogeneous cores allow separation of real‑time control tasks (Cortex‑M4) from application and UI workloads (Cortex‑A9).
Unique Advantages
- Heterogeneous Processing: Combining Cortex‑A9 and Cortex‑M4 cores enables designers to partition high‑level application processing and low‑latency control within a single device.
- Integrated Connectivity: On‑chip Gigabit Ethernet and multiple USB 2.0 ports simplify system design for connected embedded products.
- Flexible Memory Support: Support for LPDDR2, LVDDR3 and DDR3 memory types allows optimization for cost, performance or power.
- Security and Debug Support: Built‑in security modules and System JTAG facilitate secure boot, secure data handling and ease of development.
- Industrial‑Grade Reliability: Industrial qualification and a −40 °C to 105 °C operating range provide suitability for harsh environments.
- Compact Package: 400‑MAPBGA (17 × 17 mm) package enables high‑density board designs while delivering extensive I/O and functionality.
Why Choose MCIMX6X2CVN08AC?
The MCIMX6X2CVN08AC positions itself as a highly integrated solution for embedded and industrial designs that require a balance of application performance and real‑time control. With an ARM® Cortex‑A9 application core paired with an ARM® Cortex‑M4 controller, on‑chip multimedia acceleration, broad memory support and extensive connectivity, the device addresses multi‑domain system requirements while supporting secure and debuggable designs.
Manufactured by NXP Semiconductors and offered in a compact 400‑MAPBGA package with industrial qualification and RoHS compliance, this part is suitable for designers seeking long‑term platform stability and a robust feature set for advanced embedded applications.
Request a quote or submit an inquiry to receive pricing, availability and support information for the MCIMX6X2CVN08AC.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016