MCIMX6X1EVO10AC

IC MPU I.MX6SX 1GHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (17x17)

Quantity 117 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed227MHz, 1GHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1EVO10AC – IC MPU I.MX6SX 1GHZ 400-MAPBGA

The MCIMX6X1EVO10AC is an NXP Semiconductors i.MX 6X series heterogeneous dual-core microprocessor integrating an ARM® Cortex®-A9 and an ARM® Cortex®-M4. The device combines a high-performance Cortex‑A9 core operating up to 1 GHz with a Cortex‑M4 real-time core operating up to 227 MHz, delivering a mix of application and real-time processing in a single package.

Designed for embedded and connected product designs, this MPU provides integrated memory controller support, multi-Gigabit Ethernet, USB connectivity with PHYs, and a comprehensive set of security features — enabling system-level integration for multimedia-focused and connected devices.

Key Features

  • Heterogeneous Cores ARM® Cortex®-A9 application core (up to 1 GHz) paired with an ARM® Cortex®-M4 real-time core (up to 227 MHz) for concurrent application and control tasks.
  • Memory Interfaces Integrated controllers for LPDDR2, LVDDR3, and DDR3 memories to support a range of system memory configurations.
  • Connectivity Dual 10/100/1000 Mbps Ethernet interfaces and multiple USB 2.0 ports (USB 2.0 + PHY and USB 2.0 OTG + PHY) for high-bandwidth networking and peripheral connectivity.
  • System Interfaces Display controller support for LCD and keypad interfaces and additional legacy interface AC'97 for audio/peripheral integration.
  • Security and Debug Hardware security features including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, and System JTAG for secure boot, cryptography, and system debug.
  • Package and Mounting 400‑MAPBGA package (17×17 mm, 0.8 mm pitch) supplied in a 400‑LFBGA footprint and intended for surface-mount assembly.
  • Operating Range Operational temperature range from −20 °C to 105 °C suitable for a wide range of embedded environments.
  • Standards and Compliance RoHS compliant to meet common environmental requirements.

Typical Applications

  • Connected Consumer Devices — Use the dual-core architecture to run rich user applications on the Cortex‑A9 while handling real‑time control and sensor tasks on the Cortex‑M4 for devices with displays and cameras.
  • Multimedia-Focused Products — Target multimedia-focused embedded designs that require application processing plus real-time responsiveness, leveraging integrated memory controllers and display interfaces.
  • Networking and Communication Appliances — Dual Gigabit Ethernet and multiple USB PHYs enable designs for networking gateways, routers, or communication modules requiring robust wired connectivity.
  • Wireless-Enabled Systems — Integrate with WLAN, Bluetooth, or GPS peripherals through the processor’s peripheral interfaces for connected device implementations.

Unique Advantages

  • Dual-Mode Processing: The combination of a high-speed Cortex‑A9 core and a Cortex‑M4 core allows separation of application and real-time workloads, simplifying software partitioning and system design.
  • Comprehensive Connectivity: Built-in dual gigabit Ethernet and multiple USB 2.0 ports with PHY support reduce external component count for networked and peripheral-rich systems.
  • Memory Flexibility: Support for LPDDR2, LVDDR3, and DDR3 memory types enables scalable memory choices across product variants and performance targets.
  • Hardware Security Suite: On-chip security modules (A-HAB, ARM TZ, CAAM, CSU, SNVS) provide mechanisms for secure boot, cryptography, and system integrity without requiring additional external security devices.
  • Compact, Production-Ready Package: The 400‑MAPBGA (17×17 mm, 0.8 mm pitch) surface-mount package supports high-density board layouts for space-constrained embedded designs.
  • Wide Operating Temperature: Rated from −20 °C to 105 °C to support deployments across a broad set of embedded environments.

Why Choose MCIMX6X1EVO10AC?

MCIMX6X1EVO10AC positions itself as a versatile, integrated MPU for embedded and connected designs that need both application-level performance and deterministic real-time control. The dual-core combination, flexible memory interface support, and multiple high-speed I/O options enable compact system designs with reduced BOM complexity.

Backed by NXP Semiconductors’ i.MX 6X series architecture, this part is appropriate for designers seeking a single-chip solution that combines application processing, connectivity, and on-chip security features — providing a clear pathway for scalable, secure embedded products.

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