MCIMX6X1EVO10AC
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (17x17) |
|---|---|
| Quantity | 117 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 400-MAPBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 400-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 227MHz, 1GHz | Supplier Device Package | 400-MAPBGA (17×17) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X1EVO10AC – IC MPU I.MX6SX 1GHZ 400-MAPBGA
The MCIMX6X1EVO10AC is an NXP Semiconductors i.MX 6X series heterogeneous dual-core microprocessor integrating an ARM® Cortex®-A9 and an ARM® Cortex®-M4. The device combines a high-performance Cortex‑A9 core operating up to 1 GHz with a Cortex‑M4 real-time core operating up to 227 MHz, delivering a mix of application and real-time processing in a single package.
Designed for embedded and connected product designs, this MPU provides integrated memory controller support, multi-Gigabit Ethernet, USB connectivity with PHYs, and a comprehensive set of security features — enabling system-level integration for multimedia-focused and connected devices.
Key Features
- Heterogeneous Cores ARM® Cortex®-A9 application core (up to 1 GHz) paired with an ARM® Cortex®-M4 real-time core (up to 227 MHz) for concurrent application and control tasks.
- Memory Interfaces Integrated controllers for LPDDR2, LVDDR3, and DDR3 memories to support a range of system memory configurations.
- Connectivity Dual 10/100/1000 Mbps Ethernet interfaces and multiple USB 2.0 ports (USB 2.0 + PHY and USB 2.0 OTG + PHY) for high-bandwidth networking and peripheral connectivity.
- System Interfaces Display controller support for LCD and keypad interfaces and additional legacy interface AC'97 for audio/peripheral integration.
- Security and Debug Hardware security features including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, and System JTAG for secure boot, cryptography, and system debug.
- Package and Mounting 400‑MAPBGA package (17×17 mm, 0.8 mm pitch) supplied in a 400‑LFBGA footprint and intended for surface-mount assembly.
- Operating Range Operational temperature range from −20 °C to 105 °C suitable for a wide range of embedded environments.
- Standards and Compliance RoHS compliant to meet common environmental requirements.
Typical Applications
- Connected Consumer Devices — Use the dual-core architecture to run rich user applications on the Cortex‑A9 while handling real‑time control and sensor tasks on the Cortex‑M4 for devices with displays and cameras.
- Multimedia-Focused Products — Target multimedia-focused embedded designs that require application processing plus real-time responsiveness, leveraging integrated memory controllers and display interfaces.
- Networking and Communication Appliances — Dual Gigabit Ethernet and multiple USB PHYs enable designs for networking gateways, routers, or communication modules requiring robust wired connectivity.
- Wireless-Enabled Systems — Integrate with WLAN, Bluetooth, or GPS peripherals through the processor’s peripheral interfaces for connected device implementations.
Unique Advantages
- Dual-Mode Processing: The combination of a high-speed Cortex‑A9 core and a Cortex‑M4 core allows separation of application and real-time workloads, simplifying software partitioning and system design.
- Comprehensive Connectivity: Built-in dual gigabit Ethernet and multiple USB 2.0 ports with PHY support reduce external component count for networked and peripheral-rich systems.
- Memory Flexibility: Support for LPDDR2, LVDDR3, and DDR3 memory types enables scalable memory choices across product variants and performance targets.
- Hardware Security Suite: On-chip security modules (A-HAB, ARM TZ, CAAM, CSU, SNVS) provide mechanisms for secure boot, cryptography, and system integrity without requiring additional external security devices.
- Compact, Production-Ready Package: The 400‑MAPBGA (17×17 mm, 0.8 mm pitch) surface-mount package supports high-density board layouts for space-constrained embedded designs.
- Wide Operating Temperature: Rated from −20 °C to 105 °C to support deployments across a broad set of embedded environments.
Why Choose MCIMX6X1EVO10AC?
MCIMX6X1EVO10AC positions itself as a versatile, integrated MPU for embedded and connected designs that need both application-level performance and deterministic real-time control. The dual-core combination, flexible memory interface support, and multiple high-speed I/O options enable compact system designs with reduced BOM complexity.
Backed by NXP Semiconductors’ i.MX 6X series architecture, this part is appropriate for designers seeking a single-chip solution that combines application processing, connectivity, and on-chip security features — providing a clear pathway for scalable, secure embedded products.
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