MCIMX6X1EVO10AB

IC MPU I.MX6SX 1GHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (17x17)

Quantity 402 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed227MHz, 1GHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X1EVO10AB – IC MPU I.MX6SX 1GHZ 400MAPBGA

The MCIMX6X1EVO10AB is an NXP i.MX 6X family microprocessor IC featuring ARM® Cortex®-A9 and ARM® Cortex®-M4 cores in a dual-core 32-bit configuration. The device lists operating frequencies of 227 MHz and 1 GHz and targets embedded consumer and industrial applications that require integrated processing, connectivity and security.

Designed for scalable multimedia and control-oriented designs, this part emphasizes integration of memory interfaces, Ethernet and USB connectivity, alongside hardware security features and a compact 400-MAPBGA (17×17) surface-mount package.

Key Features

  • Cores & Architecture  ARM® Cortex®-A9 and ARM® Cortex®-M4 dual-core, 32-bit configuration with listed operating points of 227 MHz and 1 GHz.
  • Memory Controllers  Integrated controllers supporting LPDDR2, LVDDR3 and DDR3 memory options for flexible system memory architectures.
  • Connectivity  Dual 10/100/1000 Mbps Ethernet interfaces provide high-bandwidth wired networking for embedded systems.
  • USB  One USB 2.0 host + PHY and two USB 2.0 OTG + PHY interfaces enable multiple host/device connectivity options.
  • Security Building Blocks  Includes A-HAB, ARM TrustZone (TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE for on-chip security and system protection features.
  • Display & Audio Interfaces  Display interface controllers include LCD and keypad support; AC’97 is provided for legacy audio interfacing.
  • Co-processors / DSP  Multimedia co-processor support with NEON™ MPE for enhanced media processing capabilities at the series level.
  • Graphics Acceleration  Graphics acceleration: No (device reports no dedicated graphics acceleration).
  • Package & Mounting  400-MAPBGA (17×17) / 400-LFBGA supplier package; surface-mount mounting type for compact board designs.
  • Operating Temperature  Rated for −20 °C to 105 °C operating temperature range.
  • Compliance  RoHS compliant.

Typical Applications

  • Digital Signage  Drive content playback and networked media delivery using dual Ethernet and integrated multimedia processing.
  • Human–Machine Interfaces (HMI)  Combine Cortex-A9 application processing with Cortex-M4 control for responsive user interfaces and local control tasks.
  • IoT Gateways  Use multi-gigabit Ethernet and multiple USB OTG ports for protocol translation and edge connectivity.
  • Point-of-Sale (POS) Systems  Leverage secure boot and on-chip security blocks alongside USB and display interfaces for secure transaction terminals.
  • Portable Medical and Industrial Control  Beneficial for embedded medical devices and intelligent control systems requiring integrated connectivity and security within a compact package.

Unique Advantages

  • Heterogeneous Dual-Core Architecture: Provides separate application and control processing domains through ARM Cortex-A9 and Cortex-M4 cores, enabling workload partitioning.
  • Flexible Memory Support: Built-in controllers for LPDDR2, LVDDR3 and DDR3 simplify system design choices across performance and power trade-offs.
  • Robust Wired Connectivity: Dual gigabit Ethernet ports support high-bandwidth networking and redundancy options for embedded systems.
  • Multiple USB Interfaces: One USB 2.0 host and two USB 2.0 OTG ports give designers flexible peripheral connectivity and device roles.
  • Comprehensive On-Chip Security: A-HAB, ARM TrustZone, CAAM and related subsystems support integrated security schemes and secure system partitioning.
  • Compact, Production-Ready Package: 400-MAPBGA (17×17) surface-mount package supports space-constrained board layouts and standard manufacturing processes.

Why Choose MCIMX6X1EVO10AB?

The MCIMX6X1EVO10AB places a dual-core, mixed ARM® Cortex® architecture in a single, compact package with broad memory and connectivity options, making it suitable for embedded designs that require both application processing and real-time control. Its on-chip security features and dual gigabit Ethernet support help address integration and connectivity requirements without adding external silicon.

As part of the i.MX 6 series platform, this device aligns with a scalable product family and vendor support resources, helping teams design for current requirements while retaining options for related i.MX 6 series solutions in future iterations.

Request a quote or submit a purchasing inquiry to receive pricing, availability, and technical support information for MCIMX6X1EVO10AB.

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