Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX6U4AVM08ADMCIMX6U4AVM08ADNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
76
MCIMX6U4AVM08ADRMCIMX6U4AVM08ADRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
652
MCIMX6U4AVM10ACMCIMX6U4AVM10ACNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
612
MCIMX6U4AVM10ADMCIMX6U4AVM10ADNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
516
MCIMX6U5DVM10ABMCIMX6U5DVM10ABNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
312
MCIMX6U5DVM10ABRMCIMX6U5DVM10ABRNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
680
MCIMX6U5DVM10ACMCIMX6U5DVM10ACNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
587
MCIMX6U5DVM10ACRMCIMX6U5DVM10ACRNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
130
MCIMX6U5DVM10ADMCIMX6U5DVM10ADNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,635
MCIMX6U5DVM10ADRMCIMX6U5DVM10ADRNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,513
MCIMX6U5EVM10ABMCIMX6U5EVM10ABNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,202
MCIMX6U5EVM10ABRMCIMX6U5EVM10ABRNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
390
N/AMCIMX6U5EVM10ACNXP SemiconductorsIC MPU I.MX6S 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit, 64-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
150
MCIMX6U5EVM10ACRMCIMX6U5EVM10ACRNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
196
MCIMX6U5EVM10ADMCIMX6U5EVM10ADNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,141
MCIMX6U5EVM10ADRMCIMX6U5EVM10ADRNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,274
MCIMX6U6AVM08ABMCIMX6U6AVM08ABNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
121
MCIMX6U6AVM08ABRMCIMX6U6AVM08ABRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
665
MCIMX6U6AVM08ACMCIMX6U6AVM08ACNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
104
MCIMX6U6AVM08ACRMCIMX6U6AVM08ACRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
327

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