MCIMX6U4AVM10AC

IC MPU I.MX6DL 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1GHz 624-MAPBGA (21x21)

Quantity 800 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A002A1Ethernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U4AVM10AC – IC MPU I.MX6DL 1GHZ 624MAPBGA

The MCIMX6U4AVM10AC is an ARM® Cortex®-A9 based microprocessor implementing the i.MX6DL architecture. It features a dual-core, 32-bit design running at up to 1 GHz and integrates multimedia acceleration, memory interfaces, and a broad set of peripheral controllers in a 624-ball MAPBGA (21×21 mm) package.

Targeted for embedded infotainment, HMI and display-heavy applications, the device combines 2D/3D graphics and 1080p video processing with on-chip power management and multiple I/O options to simplify system integration and accelerate time to market.

Key Features

  • Core Dual ARM® Cortex®-A9 cores, 32-bit operation at up to 1 GHz for responsive application and multimedia processing.
  • Memory Interfaces Integrated memory controllers supporting LPDDR2, LVDDR3, and DDR3 to match application performance and cost targets.
  • Graphics & Video 2D and 3D graphics acceleration and 1080p video processing capabilities for advanced user interfaces and multimedia playback.
  • Display & HMI On-chip display interface controllers including LCD and keypad support for direct connection to common user-interface elements.
  • High-Speed Connectivity Gigabit Ethernet (10/100/1000 Mbps) and four USB 2.0 ports with PHY enable robust wired networking and peripheral connectivity.
  • Vehicle/Field Interfaces Integrated CAN interface for common vehicle and industrial network connectivity.
  • Security Features ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC, and tamper detection provide layered platform security.
  • Package & Mounting 624-ball MAPBGA (21×21 mm) supplier device package; surface-mount mounting for compact board designs. Package case referenced as 624-LFBGA.
  • Extended Temperature Range Operating temperature from −40 °C to 125 °C for deployment in thermally demanding environments.
  • Compliance RoHS-compliant manufacturing status.

Typical Applications

  • Infotainment Systems Multimedia processing, display driving and multiple I/O options enable rich audio/video playback and peripheral integration.
  • Human-Machine Interfaces (HMI) 2D/3D graphics acceleration and LCD/keypad controllers support responsive, visually rich operator interfaces.
  • Multimedia Gateways Gigabit Ethernet, multiple USB ports and integrated PHYs allow high-throughput connectivity and peripheral expansion.
  • Telematics and Sensor Hubs CAN interface, security features and flexible memory support make the device suitable for connected embedded data processing.

Unique Advantages

  • Integrated Multimedia Subsystem: Combines 2D/3D graphics and 1080p video processing to reduce external accelerator requirements.
  • Flexible Memory Support: Native LPDDR2, LVDDR3 and DDR3 controllers allow selection of memory technology to balance performance and cost.
  • Comprehensive Security Stack: Multiple on-chip security mechanisms (ARM TZ, cryptography, secure boot and fusebox) help protect system assets and boot integrity.
  • Broad I/O Connectivity: Gigabit Ethernet, multiple USB 2.0 + PHYs and CAN provide connectivity options for diverse peripheral ecosystems.
  • Rugged Operating Range: −40 °C to 125 °C operation supports deployment in demanding thermal environments.
  • Compact, Surface-Mount Packaging: 624-ball MAPBGA (21×21 mm) enables high-density board layouts while maintaining thermal and signal integrity.

Why Choose MCIMX6U4AVM10AC?

The MCIMX6U4AVM10AC positions dual ARM® Cortex®-A9 performance together with integrated multimedia, extensive peripheral interfaces, and a comprehensive security feature set—providing a balanced platform for embedded designs that require responsive UI, multimedia handling, and robust connectivity. Its flexible memory options and compact MAPBGA package ease BOM and PCB design choices for varied application needs.

This device is well suited for designers building infotainment, HMI, multimedia gateway, and connected embedded systems who require a unified microprocessor solution with multimedia acceleration, wide I/O support, and extended temperature operation.

Request a quote or submit an inquiry to get pricing, lead-time and availability for the MCIMX6U4AVM10AC. Our team can provide additional technical details and assist with volume requirements.

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