MCIMX6U4AVM08AC

IC MPU I.MX6DL 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 1,269 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U4AVM08AC – IC MPU I.MX6DL 800MHZ 624MAPBGA

The MCIMX6U4AVM08AC is a dual-core ARM® Cortex®-A9 microprocessor in the i.MX 6U series, featuring two 32-bit cores running at 800 MHz. It delivers integrated multimedia capabilities and a broad set of peripheral interfaces optimized for embedded multimedia and display-focused designs.

Designed for applications that require graphics acceleration and real-time media handling, this device combines 2D/3D graphics processing, 1080p video capabilities, integrated power management, and a flexible memory interface to simplify system design and enable rich user interfaces.

Key Features

  • Core  Dual ARM® Cortex®-A9 32-bit cores running at 800 MHz, providing a balanced mix of compute performance for multimedia and control tasks.
  • Multimedia Acceleration  Includes 2D and 3D graphics processors and NEON™ SIMD support for accelerated multimedia and signal-processing workloads, plus 1080p video processing capability indicated in the technical documentation.
  • Memory Support  Memory controller support for LPDDR2, LVDDR3 and DDR3 devices, enabling flexible system memory choices for performance and cost trade-offs.
  • Display and UI  Integrated display interface controllers including LCD and keypad support to drive modern graphical user interfaces and displays.
  • Connectivity  One 10/100/1000 Mbps Ethernet interface, four USB 2.0 ports with integrated PHY, and additional CAN support for robust wired connectivity options.
  • Security  Comprehensive security feature set including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC, and tamper detection for hardened device security.
  • Package & Mounting  Delivered in a 624-MAPBGA (21 × 21 mm) package suitable for surface-mount assembly; package case listed as 624-LFBGA in supplier data.
  • Operating Range  Specified operating temperature range of −40 °C to 125 °C to support extended-temperature embedded applications.
  • Mounting & Integration  Surface-mount construction and integrated power management features in the series documentation help reduce external BOM and simplify board-level design.

Typical Applications

  • Infotainment systems  Delivers multimedia processing, graphics acceleration, and display interfaces for rich in-cabin user experiences and media playback.
  • Human–Machine Interfaces (HMI)  Handles responsive graphical UIs and touch or keypad inputs using integrated display controllers and graphics engines.
  • Telematics and connected devices  Provides connectivity options including Ethernet, USB, and CAN for data communications and peripheral integration.
  • Advanced display controllers  Supports driving high-resolution displays and multimedia streams with onboard video processing and graphics acceleration.

Unique Advantages

  • Dual-core processing for parallel tasks  Two Cortex‑A9 cores enable concurrent handling of user interface, media decode, and I/O processing.
  • Integrated multimedia and NEON acceleration  On-chip 2D/3D graphics and NEON SIMD support reduce external accelerator requirements and speed media workloads.
  • Flexible memory interface  Support for LPDDR2, LVDDR3, and DDR3 memory lets designers choose the right memory technology for cost and performance targets.
  • Comprehensive security suite  Multiple hardware security features protect boot, runtime, and stored data without requiring extensive external security components.
  • Rich connectivity  Gigabit Ethernet, multiple USB 2.0 + PHY ports, and CAN provide a broad set of I/O options for system integration.
  • Wide operating temperature  Rated from −40 °C to 125 °C for use in applications that demand extended temperature performance.

Why Choose MCIMX6U4AVM08AC?

The MCIMX6U4AVM08AC positions itself as a highly integrated MPU option within the i.MX 6U family, combining dual ARM® Cortex®-A9 performance with multimedia acceleration, flexible memory support, and a comprehensive security feature set. Its integrated interfaces and on-chip capabilities reduce external component count and help streamline system design for display- and media-centric embedded products.

This device is well suited for engineers and product teams building infotainment, HMI, telematics, and advanced display systems that require balanced compute performance, multimedia handling, and robust on-chip connectivity. The combination of package options and extended operating temperature range supports a variety of deployment environments and hardware implementations.

Request a quote or submit a pricing request to obtain availability and lead-time information for the MCIMX6U4AVM08AC.

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