MCIMX6U1AVM10AC

IC MPU I.MX6DL 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1GHz 624-MAPBGA (21x21)

Quantity 792 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A002A1Ethernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U1AVM10AC – IC MPU I.MX6DL 1GHZ 624MAPBGA

The MCIMX6U1AVM10AC is a dual-core ARM® Cortex®-A9 microprocessor in the i.MX 6U series, running at 1 GHz and packaged in a 624-MAPBGA (21 × 21 mm) footprint. It delivers integrated multimedia and system functionality in a compact surface-mount package suitable for embedded applications that require balanced processing performance and peripheral integration.

Designed with multimedia co-processors and a broad set of memory and I/O controllers, this device addresses use cases that include display-driven user interfaces, connected embedded systems, and general-purpose multimedia processing where deterministic temperature and package characteristics are required.

Key Features

  • Processor Core Dual ARM® Cortex®-A9 cores, 32-bit, running at 1 GHz for multi-threaded embedded processing.
  • Multimedia Acceleration Includes multimedia co-processors and NEON™ SIMD for accelerated media and signal processing tasks.
  • Memory Interfaces Integrated controllers for LPDDR2, LVDDR3, and DDR3 memory types to support flexible system memory configurations.
  • Display and HMI Display interface controllers supporting LCD and keypad integration for user interface and display systems.
  • Networking and USB Single Gigabit Ethernet controller (10/100/1000 Mbps) and up to four USB 2.0 controllers with PHY for wired connectivity and peripheral expansion.
  • Additional Interfaces CAN interface available for system control and device networking in embedded applications.
  • Security Features Hardware security primitives including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC, and tamper detection.
  • Graphics Graphics acceleration capability to support GUI rendering and multimedia graphics tasks.
  • Package and Mounting Supplier device package: 624-MAPBGA (21 × 21 mm); package case listed as 624-LFBGA. Surface mount device.
  • Operating Temperature Rated for −40 °C to 125 °C operating temperature range.
  • Regulatory Compliance RoHS compliant.

Typical Applications

  • Infotainment and Multimedia Systems Use for embedded multimedia processing and display-driven interfaces that require graphics acceleration and multimedia co-processing.
  • Human–Machine Interfaces (HMI) Drive LCD displays and keypad-based user interfaces for industrial control panels and consumer devices.
  • Connected Embedded Devices Integrate Ethernet, multiple USB ports, and CAN connectivity for networked and peripheral-rich embedded systems.

Unique Advantages

  • Balanced Dual-Core Performance: Two ARM Cortex-A9 cores at 1 GHz deliver multi-threaded processing without excessive footprint or power overhead.
  • Multimedia-Ready Architecture: Built-in multimedia co-processors and NEON SIMD accelerate media and signal processing, reducing the need for external accelerators.
  • Flexible Memory Support: Native controllers for LPDDR2, LVDDR3, and DDR3 enable designers to choose memory types that match performance and power targets.
  • Comprehensive I/O Integration: Gigabit Ethernet, four USB 2.0 + PHY controllers, CAN, and display interfaces reduce external component count and simplify board design.
  • Hardware Security Suite: Multiple hardware security features—TrustZone, secure boot, cryptography, and tamper detection—help protect system integrity and sensitive data.
  • Industrial Temperature Range: Rated −40 °C to 125 °C to support deployment in thermally demanding embedded environments.

Why Choose MCIMX6U1AVM10AC?

The MCIMX6U1AVM10AC positions itself as a compact, integrated microprocessor solution combining dual-core ARM Cortex-A9 performance with multimedia acceleration, extensive memory interface options, and a broad set of wired I/O. Its package options and operating temperature range make it suitable for designs that require robustness and a reduced bill-of-materials through on-chip peripherals.

This part is well suited for engineers building display-centric embedded systems, connected devices with multiple peripheral interfaces, and applications that benefit from onboard security features and graphics acceleration. The combination of integrated peripherals and memory flexibility provides long-term design scalability and a streamlined hardware platform.

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