MCIMX6U1AVM10AC
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1GHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 792 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6U |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A002A1 | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 1GHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6U1AVM10AC – IC MPU I.MX6DL 1GHZ 624MAPBGA
The MCIMX6U1AVM10AC is a dual-core ARM® Cortex®-A9 microprocessor in the i.MX 6U series, running at 1 GHz and packaged in a 624-MAPBGA (21 × 21 mm) footprint. It delivers integrated multimedia and system functionality in a compact surface-mount package suitable for embedded applications that require balanced processing performance and peripheral integration.
Designed with multimedia co-processors and a broad set of memory and I/O controllers, this device addresses use cases that include display-driven user interfaces, connected embedded systems, and general-purpose multimedia processing where deterministic temperature and package characteristics are required.
Key Features
- Processor Core Dual ARM® Cortex®-A9 cores, 32-bit, running at 1 GHz for multi-threaded embedded processing.
- Multimedia Acceleration Includes multimedia co-processors and NEON™ SIMD for accelerated media and signal processing tasks.
- Memory Interfaces Integrated controllers for LPDDR2, LVDDR3, and DDR3 memory types to support flexible system memory configurations.
- Display and HMI Display interface controllers supporting LCD and keypad integration for user interface and display systems.
- Networking and USB Single Gigabit Ethernet controller (10/100/1000 Mbps) and up to four USB 2.0 controllers with PHY for wired connectivity and peripheral expansion.
- Additional Interfaces CAN interface available for system control and device networking in embedded applications.
- Security Features Hardware security primitives including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC, and tamper detection.
- Graphics Graphics acceleration capability to support GUI rendering and multimedia graphics tasks.
- Package and Mounting Supplier device package: 624-MAPBGA (21 × 21 mm); package case listed as 624-LFBGA. Surface mount device.
- Operating Temperature Rated for −40 °C to 125 °C operating temperature range.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Infotainment and Multimedia Systems Use for embedded multimedia processing and display-driven interfaces that require graphics acceleration and multimedia co-processing.
- Human–Machine Interfaces (HMI) Drive LCD displays and keypad-based user interfaces for industrial control panels and consumer devices.
- Connected Embedded Devices Integrate Ethernet, multiple USB ports, and CAN connectivity for networked and peripheral-rich embedded systems.
Unique Advantages
- Balanced Dual-Core Performance: Two ARM Cortex-A9 cores at 1 GHz deliver multi-threaded processing without excessive footprint or power overhead.
- Multimedia-Ready Architecture: Built-in multimedia co-processors and NEON SIMD accelerate media and signal processing, reducing the need for external accelerators.
- Flexible Memory Support: Native controllers for LPDDR2, LVDDR3, and DDR3 enable designers to choose memory types that match performance and power targets.
- Comprehensive I/O Integration: Gigabit Ethernet, four USB 2.0 + PHY controllers, CAN, and display interfaces reduce external component count and simplify board design.
- Hardware Security Suite: Multiple hardware security features—TrustZone, secure boot, cryptography, and tamper detection—help protect system integrity and sensitive data.
- Industrial Temperature Range: Rated −40 °C to 125 °C to support deployment in thermally demanding embedded environments.
Why Choose MCIMX6U1AVM10AC?
The MCIMX6U1AVM10AC positions itself as a compact, integrated microprocessor solution combining dual-core ARM Cortex-A9 performance with multimedia acceleration, extensive memory interface options, and a broad set of wired I/O. Its package options and operating temperature range make it suitable for designs that require robustness and a reduced bill-of-materials through on-chip peripherals.
This part is well suited for engineers building display-centric embedded systems, connected devices with multiple peripheral interfaces, and applications that benefit from onboard security features and graphics acceleration. The combination of integrated peripherals and memory flexibility provides long-term design scalability and a streamlined hardware platform.
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