MCIMX6U1AVM08ACR

IC MPU I.MX6DL 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 420 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U1AVM08ACR – IC MPU I.MX6DL 800MHZ 624MAPBGA

The MCIMX6U1AVM08ACR is an ARM® Cortex®-A9 based microprocessor module in the i.MX 6U series, featuring a dual-core 32-bit implementation running at 800 MHz. It combines general-purpose processing with dedicated multimedia and NEON™ SIMD co-processing capabilities to support display, video and connectivity-focused embedded designs.

Built with multiple memory controller options, rich peripheral connectivity and on-chip security features, this surface-mount 624-MAPBGA (21×21) device is targeted at embedded systems requiring integrated multimedia, graphics acceleration and robust connectivity in a compact package.

Key Features

  • Core  Dual ARM® Cortex®-A9 cores, 32-bit architecture operating at 800 MHz for responsive application and multimedia processing.
  • Co-Processing  Multimedia co-processor support with NEON™ SIMD acceleration for enhanced signal and media processing.
  • Memory Interfaces  Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 to match a range of system memory requirements.
  • Display and Graphics  Display interface controllers for keypad and LCD and on-chip graphics acceleration to support rich user interfaces.
  • Connectivity  One 10/100/1000 Mbps Ethernet interface, four USB 2.0 ports with PHY and CAN support for networking and peripheral connectivity.
  • Security  Built-in security features including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package and Mounting  Supplier device package: 624-MAPBGA (21×21); package case listed as 624-LFBGA; surface-mount mounting type for compact PCB integration.
  • Operating Range  Industrial operating temperature range from −40°C to 125°C.
  • Compliance  RoHS compliant.

Typical Applications

  • Infotainment and Multimedia Systems  Use the dual-core Cortex-A9 and NEON™ SIMD acceleration for audio/video processing and rich media playback.
  • Human‑Machine Interfaces (HMI)  Drive LCD displays and responsive user interfaces using the integrated display controllers and graphics acceleration.
  • Embedded Networking Gateways  Leverage the integrated Gigabit Ethernet, multiple USB ports and CAN support for connected embedded appliances and gateways.
  • Industrial Control and Visualization  Combine wide temperature range and robust memory options to implement control panels and visualization nodes in embedded systems.

Unique Advantages

  • Balanced compute and media acceleration: Dual ARM Cortex‑A9 cores with NEON™ SIMD provide a combination of application processing and media handling in one device.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support allows designers to select memory technology that best fits cost and performance targets.
  • Comprehensive connectivity: Integrated Gigabit Ethernet, four USB 2.0 ports with PHY and CAN simplify system-level connectivity and reduce external components.
  • Integrated security primitives: Multiple on-chip security features (TrustZone, secure boot, cryptography and tamper detection) help protect system integrity and sensitive data.
  • Compact, surface‑mount packaging: 624‑MAPBGA (21×21) package enables high-density board designs for space-constrained embedded products.
  • Extended temperature capability: Rated from −40°C to 125°C for deployments across demanding environmental conditions.

Why Choose MCIMX6U1AVM08ACR?

The MCIMX6U1AVM08ACR positions itself as an integrated microprocessor solution for embedded designs that require a blend of application performance, multimedia capability and extensive peripheral connectivity. Its dual-core ARM® Cortex®-A9 architecture, alongside NEON™ SIMD and graphics acceleration, supports responsive user interfaces and media processing while reducing the need for separate co-processors.

This part is suitable for designers seeking a compact, RoHS-compliant MPU in a 624‑MAPBGA package with broad memory interface compatibility, multiple USB ports, gigabit Ethernet, CAN and robust on-chip security features. It offers a stable platform for scalable embedded product designs that demand multimedia handling, connectivity and secure boot capabilities.

Request a quote or submit an inquiry to begin procurement and receive pricing and availability details for the MCIMX6U1AVM08ACR.

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