MCIMX6U1AVM08ACR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 420 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6U |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6U1AVM08ACR – IC MPU I.MX6DL 800MHZ 624MAPBGA
The MCIMX6U1AVM08ACR is an ARM® Cortex®-A9 based microprocessor module in the i.MX 6U series, featuring a dual-core 32-bit implementation running at 800 MHz. It combines general-purpose processing with dedicated multimedia and NEON™ SIMD co-processing capabilities to support display, video and connectivity-focused embedded designs.
Built with multiple memory controller options, rich peripheral connectivity and on-chip security features, this surface-mount 624-MAPBGA (21×21) device is targeted at embedded systems requiring integrated multimedia, graphics acceleration and robust connectivity in a compact package.
Key Features
- Core Dual ARM® Cortex®-A9 cores, 32-bit architecture operating at 800 MHz for responsive application and multimedia processing.
- Co-Processing Multimedia co-processor support with NEON™ SIMD acceleration for enhanced signal and media processing.
- Memory Interfaces Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 to match a range of system memory requirements.
- Display and Graphics Display interface controllers for keypad and LCD and on-chip graphics acceleration to support rich user interfaces.
- Connectivity One 10/100/1000 Mbps Ethernet interface, four USB 2.0 ports with PHY and CAN support for networking and peripheral connectivity.
- Security Built-in security features including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Package and Mounting Supplier device package: 624-MAPBGA (21×21); package case listed as 624-LFBGA; surface-mount mounting type for compact PCB integration.
- Operating Range Industrial operating temperature range from −40°C to 125°C.
- Compliance RoHS compliant.
Typical Applications
- Infotainment and Multimedia Systems Use the dual-core Cortex-A9 and NEON™ SIMD acceleration for audio/video processing and rich media playback.
- Human‑Machine Interfaces (HMI) Drive LCD displays and responsive user interfaces using the integrated display controllers and graphics acceleration.
- Embedded Networking Gateways Leverage the integrated Gigabit Ethernet, multiple USB ports and CAN support for connected embedded appliances and gateways.
- Industrial Control and Visualization Combine wide temperature range and robust memory options to implement control panels and visualization nodes in embedded systems.
Unique Advantages
- Balanced compute and media acceleration: Dual ARM Cortex‑A9 cores with NEON™ SIMD provide a combination of application processing and media handling in one device.
- Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support allows designers to select memory technology that best fits cost and performance targets.
- Comprehensive connectivity: Integrated Gigabit Ethernet, four USB 2.0 ports with PHY and CAN simplify system-level connectivity and reduce external components.
- Integrated security primitives: Multiple on-chip security features (TrustZone, secure boot, cryptography and tamper detection) help protect system integrity and sensitive data.
- Compact, surface‑mount packaging: 624‑MAPBGA (21×21) package enables high-density board designs for space-constrained embedded products.
- Extended temperature capability: Rated from −40°C to 125°C for deployments across demanding environmental conditions.
Why Choose MCIMX6U1AVM08ACR?
The MCIMX6U1AVM08ACR positions itself as an integrated microprocessor solution for embedded designs that require a blend of application performance, multimedia capability and extensive peripheral connectivity. Its dual-core ARM® Cortex®-A9 architecture, alongside NEON™ SIMD and graphics acceleration, supports responsive user interfaces and media processing while reducing the need for separate co-processors.
This part is suitable for designers seeking a compact, RoHS-compliant MPU in a 624‑MAPBGA package with broad memory interface compatibility, multiple USB ports, gigabit Ethernet, CAN and robust on-chip security features. It offers a stable platform for scalable embedded product designs that demand multimedia handling, connectivity and secure boot capabilities.
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