MCIMX6U1AVM08AB

IC MPU I.MX6DL 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 107 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U1AVM08AB – IC MPU I.MX6DL 800MHz 624MAPBGA

The MCIMX6U1AVM08AB is a dual-core ARM® Cortex®-A9 microprocessor operating at 800 MHz, offered in a 624-MAPBGA (21×21 mm) package. It is part of the i.MX 6U series and is designed for embedded multimedia applications requiring integrated processing, graphics and peripheral connectivity.

Typical use cases include infotainment, telematics, human–machine interfaces and display-based systems where a combination of CPU performance, graphics acceleration and broad I/O support is required.

Key Features

  • Core and Performance Dual ARM® Cortex®-A9 cores, 32-bit, running at up to 800 MHz for responsive application processing.
  • Multimedia Acceleration Integrated multimedia engines including 2D/3D graphics acceleration and 1080p-capable video processing as described in the i.MX 6Solo/6DualLite family.
  • Memory Interfaces Supports LPDDR2, LVDDR3 and DDR3 memory controllers to match a variety of system memory configurations.
  • Security Hardware security features including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection for layered device protection.
  • Connectivity and Peripherals Integrated interfaces such as 10/100/1000 Mbps Ethernet (1), four USB 2.0 ports with PHY, and CAN provide flexible peripheral and network connectivity.
  • Package and Mounting 624-MAPBGA (21×21 mm) surface-mount package suitable for high-density board designs.
  • Operating Range Rated for operation from −40 °C to 125 °C to accommodate wide thermal environments.
  • Compliance RoHS compliant for environmental and manufacturing standards adherence.

Typical Applications

  • Infotainment Systems — Handles multimedia processing, graphics and display pipelines for integrated audio/video UIs.
  • Telematics and Connectivity Modules — Provides networking and USB/CAN interfaces for telemetry, navigation and connected services.
  • Human–Machine Interfaces (HMI) — Drives rich graphical user interfaces and touch displays with accelerated graphics.
  • Display-Based Systems — Supports high-resolution displays and camera sensors for advanced visualization and monitoring.

Unique Advantages

  • Dual-Core Processing — Two ARM® Cortex®-A9 cores at 800 MHz deliver balanced performance for multitasking embedded applications.
  • Integrated Multimedia — On-chip graphics and video capabilities reduce the need for external accelerators and simplify system design.
  • Comprehensive Security Suite — Multiple hardware security blocks enable secure boot, cryptography and tamper detection to protect system integrity.
  • Flexible Memory Support — Compatibility with LPDDR2, LVDDR3 and DDR3 memory types allows designers to optimize cost and performance.
  • Extensive I/O — Gigabit Ethernet, multiple USB 2.0 ports with PHY, and CAN offer broad connectivity options for networked embedded systems.
  • Wide Operating Temperature — −40 °C to 125 °C range supports deployment in thermally demanding environments.

Why Choose MCIMX6U1AVM08AB?

The MCIMX6U1AVM08AB combines dual ARM® Cortex®-A9 processing, integrated multimedia acceleration and extensive security features in a compact 624-MAPBGA package. Its mix of performance, connectivity and memory flexibility makes it suitable for embedded designs that require responsive user interfaces, multimedia handling and robust device protection.

Backed by NXP Semiconductors' i.MX 6U family architecture and supporting documentation, this device is appropriate for development projects targeting infotainment, telematics, HMI and other display-driven embedded systems where long-term platform continuity and component-level integration are required.

Request a quote or submit an inquiry to obtain pricing, lead times and ordering information for the MCIMX6U1AVM08AB. Our team can provide technical and procurement support to integrate this processor into your next embedded design.

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