MCIMX6U1AVM08AD

IC MPU I.MX6DL 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 170 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A002A1Ethernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U1AVM08AD – IC MPU I.MX6DL 800MHZ 624MAPBGA

The MCIMX6U1AVM08AD is an ARM® Cortex®-A9 based microprocessor from the i.MX 6U family featuring two 32-bit cores running at 800 MHz. It delivers integrated multimedia capabilities including 2D/3D graphics and 1080p video processing, along with a broad set of peripheral interfaces for embedded and infotainment-focused applications.

Designed for systems that require a balance of processing performance, graphics/video handling and broad I/O integration, this module addresses use cases such as infotainment, human-machine interfaces and multimedia-rich embedded designs while offering an extended operating temperature range for demanding environments.

Key Features

  • Core Dual ARM® Cortex®-A9 processors, 32-bit, up to 800 MHz for responsive application and multimedia processing.
  • Multimedia Acceleration Integrated 2D and 3D graphics processors and 1080p video processing support for rich user interfaces and video playback.
  • NEON SIMD Multimedia co-processor support including NEON™ SIMD to accelerate signal and media processing workloads.
  • Memory Interfaces Built-in controllers for LPDDR2, LVDDR3 and DDR3 memory types to support flexible memory configurations.
  • Display and Input Dedicated controllers for LCD and keypad interfaces to simplify HMI and display integration.
  • Connectivity Integrated Ethernet (10/100/1000 Mbps, 1 port), four USB 2.0 ports with PHY and CAN interface for common peripheral and network connections.
  • Security On-chip security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and tamper detection.
  • Package & Mounting 624-MAPBGA (21×21 mm) surface mount package suitable for high-density board designs.
  • Operating Range Wide operating temperature range from −40°C to 125°C for operation in challenging thermal environments.
  • Compliance RoHS compliant.

Typical Applications

  • Automotive Infotainment & HMI Drives multimedia-rich dashboards and in-car displays with integrated graphics and video processing.
  • Telematics & Navigation Supports navigation and telematics functions with multiple connectivity options and media acceleration.
  • Display-Based Clusters Suitable for instrument clusters and advanced display systems that require coordinated video and graphics output.
  • Embedded Multimedia Systems Ideal for industrial HMI and other embedded devices that need robust graphics, I/O and secure boot capabilities.

Unique Advantages

  • Balanced Processing and Media: Dual Cortex-A9 cores combined with dedicated graphics and video engines deliver capable application and multimedia performance.
  • Extensive I/O Integration: Gigabit Ethernet, multiple USB 2.0 + PHY ports, CAN and display controllers reduce external component count and simplify system design.
  • Flexible Memory Support: Native support for LPDDR2, LVDDR3 and DDR3 enables designers to choose memory optimized for performance and cost.
  • Comprehensive Security Suite: Hardware security features including TrustZone, secure JTAG and cryptography improve system trust and protect boot and runtime assets.
  • Wide Temperature Capability: −40°C to 125°C rating supports deployment in thermally demanding environments.
  • High-Density Packaging: 624-MAPBGA (21×21) package supports compact, high-density board layouts.

Why Choose MCIMX6U1AVM08AD?

The MCIMX6U1AVM08AD offers a practical combination of dual-core ARM Cortex-A9 processing, multimedia acceleration and broad peripheral integration for embedded systems that require rich user interfaces and reliable connectivity. Its comprehensive security features and wide operating temperature range make it suitable for demanding embedded applications where system integrity and environmental robustness matter.

This part is well suited to designers looking for an integrated platform that reduces external BOM and supports complex HMI, multimedia and connectivity requirements while leveraging the documentation and technical resources provided for the i.MX 6 series.

Request a quote or submit an inquiry to receive pricing and availability information for the MCIMX6U1AVM08AD.

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