MCIMX6U1AVM08ABR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 259 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6U |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6U1AVM08ABR – ARM Cortex‑A9 Dual‑Core 800 MHz MPU
The MCIMX6U1AVM08ABR is a dual‑core ARM® Cortex®‑A9 microprocessor operating at 800 MHz, packaged in a 624‑MAPBGA (21×21 mm) surface‑mount package. It combines CPU performance with multimedia acceleration and integrated system interfaces to address embedded display, infotainment, telematics and HMI applications.
Designed with integrated power management, graphics/video capabilities and a broad set of interfaces, this device provides a compact, high‑function building block for designs that require processing, multimedia and connectivity in a single device.
Key Features
- Core & Performance Dual ARM® Cortex®‑A9 cores, 32‑bit, running at 800 MHz provide balanced processing performance for embedded applications.
- Memory Interface Built‑in memory controllers supporting LPDDR2, LVDDR3 and DDR3 memory types for flexible system memory design.
- Graphics & Multimedia Graphics acceleration and multimedia DSP capabilities including NEON™ SIMD and series‑level 2D/3D and 1080p video processing features enable advanced user interfaces and video playback.
- Connectivity Integrated interfaces include 1× 10/100/1000 Mbps Ethernet, up to four USB 2.0 ports with PHY, and CAN for vehicle and industrial networks.
- Security & Boot Hardware security features such as ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection provide layered device protection.
- System Integration & Power Integrated power management features reduce external component count and simplify power sequencing for embedded system designs.
- Package & Mounting 624‑MAPBGA supplier device package (21×21 mm, 0.8 mm pitch) optimized for surface‑mount assembly in compact systems.
- Operating Range & Compliance Rated for an operating temperature range of −40 °C to 125 °C and RoHS compliant for regulatory compatibility in many embedded environments.
Typical Applications
- Infotainment Systems High‑performance multimedia processing and multiple display interfaces support audio/video user interfaces and media playback.
- Telematics Integrated connectivity (Ethernet, CAN, USB) and multimedia capabilities enable connected telematics gateways and in‑vehicle devices.
- Human‑Machine Interfaces (HMI) Graphics acceleration, NEON SIMD and flexible memory support enable responsive, feature‑rich touch and display interfaces.
- Display‑Based Clusters Video processing and display controller support provide the necessary building blocks for instrument clusters and digital dashboards.
Unique Advantages
- Highly integrated processing and multimedia: Dual Cortex‑A9 cores with graphics and video processing reduce the need for multiple discrete processors.
- Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller options allow designers to optimize cost, power and performance tradeoffs.
- Rich connectivity set: Gigabit Ethernet, multiple USB 2.0 ports with PHY and CAN simplify peripheral integration and system I/O design.
- Comprehensive security features: On‑chip trust, cryptography and tamper detection enable secure boot and protected runtime environments.
- Compact production package: 624‑MAPBGA (21×21 mm) supports high‑density board layouts for space‑constrained designs.
- Wide temperature capability: −40 °C to 125 °C operating range supports deployment across demanding thermal environments.
Why Choose MCIMX6U1AVM08ABR?
The MCIMX6U1AVM08ABR delivers a balanced combination of dual‑core processing, multimedia acceleration and extensive peripheral support in a compact BGA package. Its flexible memory interfaces and integrated system features make it appropriate for embedded designs that require responsive user interfaces, video processing and robust connectivity without adding multiple discrete components.
This part is suitable for development teams targeting infotainment, telematics, HMI and display cluster implementations that demand a compact, integrated processing solution with security features and broad I/O capability.
Request a quote or submit an inquiry to evaluate MCIMX6U1AVM08ABR for your next embedded design project.

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