MCIMX6S8DVM10AB

IC MPU I.MX6S 1.0GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 1.0GHz 624-MAPBGA (21x21)

Quantity 14 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1.0GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S8DVM10AB – IC MPU I.MX6S 1.0GHZ 624MAPBGA

The MCIMX6S8DVM10AB is an NXP i.MX 6S series microprocessor featuring a single ARM® Cortex®-A9 core running at 1.0 GHz. Designed for multimedia-focused consumer applications, it combines a 32-bit application core with on-chip graphics and video processing, integrated power management features, and a broad set of peripheral interfaces.

This device targets web and multimedia consumer products and embedded display systems where balanced compute performance, graphics/video capability, and connectivity are required in a compact surface-mount BGA package.

Key Features

  • Core – Single ARM® Cortex®-A9 32-bit core operating at 1.0 GHz, suited for general application processing in multimedia-focused designs.
  • Multimedia Acceleration – Built-in 2D/3D graphics acceleration and 1080p video processing capabilities to support rich user interfaces and video playback.
  • Memory Interfaces – Integrated memory controllers supporting LPDDR2, LVDDR3, and DDR3 to match a range of system memory choices.
  • Connectivity – Integrated 10/100/1000 Mbps Ethernet controller (1), USB 2.0 + PHY functionality (4), and CAN interface for wired networking and peripheral connectivity.
  • Security Features – Hardware security capabilities including ARM TrustZone (TZ), Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, and Tamper Detection for enhanced system protection.
  • Packaging – 624-MAPBGA supplier device package with 21 × 21 mm footprint; datasheet notes a 21 × 21 mm BGA package with 0.8 mm pitch.
  • Power & Integration – Integrated power management elements referenced in the product series datasheet to streamline system power design.
  • Qualification & Compliance – Consumer qualification with RoHS compliance; Operating temperature range specified as 0 °C to 95 °C.

Typical Applications

  • Web and Multimedia Tablets – Provides processing, graphics acceleration, and multimedia playback capabilities suitable for consumer tablets and similar devices.
  • Consumer Multimedia Products – Used in consumer-focused embedded platforms requiring video processing and display support.
  • Display and Camera Systems – Supports interfaces and processing blocks for connecting displays and camera sensors in multimedia applications.

Unique Advantages

  • Balanced Single-Core Performance: A 1.0 GHz ARM® Cortex®-A9 core offers efficient application-level processing for consumer multimedia workloads.
  • Integrated Multimedia Subsystems: On-chip 2D/3D graphics and 1080p video processing reduce the need for external accelerators and simplify BOM.
  • Flexible Memory Support: Native controllers for LPDDR2, LVDDR3, and DDR3 allow designers to choose memory options that match cost and performance targets.
  • Rich Connectivity: Gigabit Ethernet, multiple USB 2.0 PHYs, and CAN provide broad wired interface options for networking and peripheral integration.
  • Comprehensive Security: Hardware security features such as ARM TZ, secure boot, cryptography, and tamper detection help protect firmware and sensitive data.
  • Compact Surface-Mount Packaging: 624-MAPBGA (21 × 21 mm) package supports high-density board designs and standard BGA manufacturing flows.

Why Choose MCIMX6S8DVM10AB?

The MCIMX6S8DVM10AB positions itself as a compact, consumer-qualified multimedia application processor that combines a 1.0 GHz ARM® Cortex®-A9 core with integrated graphics/video acceleration, flexible memory interfaces, and a broad set of connectivity and security features. It is suited to designs where multimedia capability, secure boot/operation and multiple peripheral interfaces must coexist in a surface-mount BGA package.

This part is appropriate for embedded system designers and procurement teams targeting consumer multimedia devices, tablet-class products, and display- or camera-enabled products that require a balance of compute, connectivity, and security backed by NXP i.MX 6 series documentation and package options.

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