MCIMX6S7CVM08AD

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 116 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCNOBSOLETEEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code0000.00.0000Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S7CVM08AD – IC MPU I.MX6S 800MHZ 624MAPBGA

The MCIMX6S7CVM08AD is a single-core ARM® Cortex®-A9 microprocessor operating at up to 800 MHz, delivered in a 624-MAPBGA (21×21 mm) surface-mount package. It is designed for embedded industrial and medical applications that require responsive, multimedia-capable processing with a high degree of functional integration.

As part of the i.MX 6S family, the device targets graphically rich user interfaces and multimedia-enabled systems by combining a Cortex-A9 core with graphics acceleration, 1080p video capability, integrated power management and a broad set of peripheral interfaces.

Key Features

  • Core and Performance – Single ARM® Cortex®-A9 core, 32-bit, running up to 800 MHz for responsive application processing.
  • Multimedia & Graphics – On-chip graphics acceleration with 2D/3D engines and 1080p video processing capability to support rich user interfaces and video applications.
  • Memory Interfaces – Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types to accommodate a range of memory system designs.
  • Connectivity – Integrated Gigabit Ethernet (10/100/1000 Mbps), CAN interface, and four USB 2.0 ports with PHY to enable wired networking and peripheral connectivity.
  • Security – Comprehensive hardware security features including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection to help protect system assets and boot integrity.
  • Industrial Qualification & Temperature – Industrial qualification with operating temperature range from −40°C to 105°C for demanding environments.
  • Package & Mounting – 624-MAPBGA supplier device package (21×21 mm) in a surface-mount form factor suitable for compact, high-density boards.
  • Standards Compliance – RoHS compliant to support regulatory and environmental requirements.

Typical Applications

  • Industrial Human-Machine Interfaces (HMIs) – Drives graphically rich, responsive touch and display interfaces for control panels and operator stations.
  • Medical Devices – Supports medical imaging displays and user interfaces where industrial qualification and secure boot are important.
  • Multimedia Terminals – Enables 1080p video processing and graphics acceleration for video-enabled embedded systems.
  • Connected Embedded Systems – Integrates Ethernet, USB and CAN connectivity for networked instrumentation, gateways and instrumentation controllers.

Unique Advantages

  • Highly integrated multimedia platform: Combines a Cortex‑A9 core with dedicated 2D/3D graphics and video processing to reduce external component needs for display- and video-focused designs.
  • Robust hardware security: Multiple hardware security primitives including TrustZone, secure boot and cryptography provide layered protection for firmware and data.
  • Flexible memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 allow designers to choose memory types that match performance and cost targets.
  • Industrial-ready thermal range: −40°C to 105°C operating range suits deployments in challenging ambient conditions.
  • Comprehensive I/O: Gigabit Ethernet, multiple USB 2.0 ports with PHY and CAN support modern connectivity requirements for embedded systems.
  • Compact, production-friendly package: 624-MAPBGA (21×21 mm) surface-mount package enables space-efficient PCB layouts for compact products.

Why Choose MCIMX6S7CVM08AD?

The MCIMX6S7CVM08AD positions itself as a single-core, industrial-grade embedded processor that balances efficient application processing with integrated multimedia and security capabilities. Its combination of Cortex‑A9 performance, graphics/video support and broad peripheral set makes it suitable for industrial and medical systems that require responsive interfaces and secure operation.

Engineers building compact, connectivity-rich embedded products will find the device’s flexible memory interfaces, extensive security features and industrial temperature qualification valuable for long-term deployments. Detailed package and module documentation is available in the i.MX 6Solo/6DualLite family technical documentation to support design-in and production.

Request a quote or contact sales to discuss pricing, lead times and availability for MCIMX6S7CVM08AD and to obtain additional technical resources for your design.

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