MCIMX6S6AVM10ADR

IC MPU I.MX6S 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 1GHz 624-MAPBGA (21x21)

Quantity 1,340 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S6AVM10ADR – IC MPU I.MX6S 1GHZ 624MAPBGA

The MCIMX6S6AVM10ADR is a single‑core ARM® Cortex®‑A9 microprocessor operating at 1 GHz in a 624‑ball MAPBGA package (21 × 21 mm). It combines a 32‑bit application core with multimedia accelerators and a broad set of integrated interfaces to address graphically rich, connected embedded systems.

Designed for industrial and medical product segments that require responsive user interfaces and multiple peripheral connections, this device delivers integrated memory interfaces, graphics acceleration, and extensive security features to support system-level integration and robustness.

Key Features

  • Core and Performance Single ARM® Cortex®‑A9 core, 32‑bit, running at 1 GHz for single‑threaded application workloads.
  • Multimedia and DSP Support Integrated multimedia co‑processors and NEON™ SIMD support for multimedia acceleration and signal processing tasks.
  • Memory Interfaces On‑chip controllers for DDR3, DDR3L and LPDDR2 memory types for flexible memory subsystem design.
  • Display and Graphics Display interface controllers for LCD and keypad support plus graphics acceleration for responsive GUIs.
  • Connectivity Gigabit Ethernet (10/100/1000 Mbps, 1 port), four USB 2.0 ports with PHY, and CAN interface provide broad peripheral and network connectivity.
  • Security Hardware security capabilities including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, and tamper detection to help protect system integrity.
  • Package and Mounting 624‑MAPBGA supplier package in a 21 × 21 mm BGA footprint (0.8 mm pitch); surface‑mount device suitable for compact board designs.
  • Operating Range and Compliance Rated for an operating temperature range of −40 °C to 125 °C and RoHS compliant for environmental regulation alignment.

Typical Applications

  • Industrial Control and HMI Drives graphically rich human‑machine interfaces and display systems requiring responsive graphics and multiple I/O connections.
  • Medical Devices Enables embedded medical instrumentation and diagnostic displays where multimedia acceleration and secure boot capabilities are required.
  • Embedded Networking Appliances Supports networked appliances and gateways with integrated Gigabit Ethernet, USB host/device, and CAN connectivity.

Unique Advantages

  • Integrated Multimedia Acceleration NEON and multimedia co‑processors reduce CPU load for graphics and signal‑processing tasks, simplifying system partitioning.
  • Flexible Memory Support Native controllers for DDR3, DDR3L and LPDDR2 give designers options for cost, power and performance tradeoffs.
  • Comprehensive Security Suite Multiple hardware security features support secure boot, cryptography and tamper detection to help protect IP and data.
  • Broad Peripheral Connectivity Gigabit Ethernet, four USB 2.0 + PHY ports and CAN enable diverse peripheral and network topologies without external bridges.
  • Wide Operating Temperature −40 °C to 125 °C rating supports deployment in demanding thermal environments.
  • Compact BGA Packaging The 21 × 21 mm MAPBGA package enables high‑density board layouts while keeping a standardized footprint for assembly.

Why Choose MCIMX6S6AVM10ADR?

The MCIMX6S6AVM10ADR positions itself as a compact, integrated application processor for embedded systems that need responsive user interfaces, multimedia handling and multiple high‑speed interfaces. Its single ARM® Cortex®‑A9 core at 1 GHz, combined with NEON multimedia support and a broad set of I/O, makes it suitable for industrial and medical designs where integration and secure operation are priorities.

With a flexible memory interface set, comprehensive hardware security features, and a BGA footprint optimized for space‑constrained boards, this device supports designs that require a balance of processing capability, connectivity and rugged operating range backed by documented technical specifications.

Request a quote or submit a purchase inquiry to start the procurement process for the MCIMX6S6AVM10ADR and evaluate how it fits your embedded system design needs.

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