MCIMX6S6AVM08ADR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 1,316 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A002A1 | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6S6AVM08ADR – IC MPU I.MX6S 800MHz 624-MAPBGA
The MCIMX6S6AVM08ADR is a single-core ARM® Cortex®-A9 microprocessor running at 800 MHz, offered by NXP Semiconductors as part of the i.MX 6S series. It is designed for embedded systems requiring a compact, integrated processing solution with multimedia acceleration and a broad set of peripheral interfaces.
Targeted for infotainment, telematics, HMI and display-based embedded systems, the device combines a 32-bit Cortex‑A9 core with on-chip graphics acceleration, multiple memory interface options and a comprehensive set of I/O to simplify system design.
Key Features
- Core Single ARM® Cortex®-A9 core, 32-bit, operating at 800 MHz for general-purpose embedded processing.
- Multimedia and SIMD Integrated multimedia co‑processors and NEON™ SIMD support for accelerated media and signal-processing tasks.
- Memory Interfaces Support for LPDDR2, LVDDR3 and DDR3 memory controllers to match a variety of memory performance and power profiles.
- Graphics and Video Series-level features include 2D and 3D graphics acceleration and 1080p video processing as described in the i.MX6Solo/6DualLite documentation.
- High-speed Network and USB Integrated Ethernet MAC capable of 10/100/1000 Mbps (single port) and four USB 2.0 controllers with PHYs for connectivity and peripheral expansion.
- Peripheral Interfaces On-chip support for display interfaces (LCD, keypad) and additional serial interfaces including CAN to address common embedded control and HMI needs.
- Security Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection for system integrity and protected boot flows.
- Package and Mounting Supplied in a 624-pin MAPBGA/LFBGA package (21 × 21 mm), surface-mountable for compact board-level integration.
- Operating Range Rated for an operating temperature range of −40 °C to 125 °C to support demanding thermal environments.
- Compliance RoHS compliant.
Typical Applications
- Infotainment systems — Drives multimedia, display and user-interface tasks where on-chip graphics acceleration and multimedia processing are required.
- Telematics and connected devices — Provides processing, network and USB connectivity for data communication and peripheral integration.
- Human–Machine Interfaces (HMI) — Powers display controllers and keypad-driven interfaces for control panels and operator displays.
- Embedded display systems — Suitable for display-based systems and clusters that require a compact package, memory flexibility and graphics/video capability.
Unique Advantages
- Single-chip multimedia capability: Integrated NEON SIMD and multimedia co-processors reduce the need for external accelerators and simplify BOM.
- Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support enables tuning of performance and power for varied system requirements.
- Comprehensive I/O integration: Gigabit Ethernet, multiple USB 2.0 + PHY ports, CAN and display interfaces consolidate common connectivity needs on chip.
- Hardware security stack: On-chip TrustZone, cryptography and secure boot features help protect software and secure device identity.
- Compact, manufacturable package: 624‑MAPBGA (21 × 21 mm) surface-mount package supports dense PCB layouts and automated assembly.
- Wide operating temperature: −40 °C to 125 °C rating supports deployment in thermally demanding embedded environments.
Why Choose MCIMX6S6AVM08ADR?
The MCIMX6S6AVM08ADR positions itself as a concise, integrated processing option within the i.MX 6S family, delivering an 800 MHz Cortex‑A9 core combined with multimedia acceleration, extensive peripheral interfaces and on-chip security features. It is suitable for embedded designers who need a compact BGA package with versatile memory options and robust connectivity.
With documented series-level capabilities for graphics and video, a full set of network and USB interfaces, and a design that simplifies system integration, this processor supports scalable embedded deployments where multimedia processing, secure boot and flexible memory choices are key considerations.
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