MCIMX6S6AVM08ABR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 667 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6S6AVM08ABR – IC MPU I.MX6S 800MHz 624-MAPBGA
The MCIMX6S6AVM08ABR is a single-core ARM® Cortex®-A9 microprocessor operating at 800 MHz in a 624-MAPBGA (21 × 21 mm) package. Designed for integrated multimedia and display-focused applications, it combines a Cortex-A9 core with NEON™ SIMD and multimedia acceleration, a flexible memory interface, a broad set of peripheral interfaces, and on-chip power management.
This device addresses use cases requiring graphics and video processing, human-machine interfaces, and networked embedded systems, delivering a compact, supplier-ready MPU with extended operating temperature capability and comprehensive security features.
Key Features
- Core & DSP — ARM® Cortex®-A9 single 32-bit core at 800 MHz with NEON™ SIMD multimedia acceleration for efficient signal and media processing.
- Memory Interfaces — Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 memories to match a range of system memory designs.
- Graphics & Video — On-chip 2D and 3D graphics acceleration and 1080p video processing as documented for the i.MX6Solo/6DualLite series.
- Connectivity — Rich peripheral set including 10/100/1000 Mbps Ethernet (1), four USB 2.0 ports with PHY, and CAN for robust device communication.
- Display & I/O — Dedicated display interface support including LCD and keypad controllers for HMI and display-centric applications.
- Security Features — Hardware-level protections including ARM TrustZone, boot security, cryptography, secure fusebox, Secure JTAG, secure memory, secure RTC and tamper detection.
- Power & Integration — Integrated power management elements referenced in the i.MX6Solo/6DualLite documentation to simplify system power design.
- Package & Mounting — 624-MAPBGA (21 × 21 mm) surface-mount package (624-LFBGA case reference) suitable for compact, high-density board layouts.
- Operating Range & Compliance — Extended operating temperature from −40 °C to 125 °C; RoHS compliant.
Typical Applications
- Infotainment and Multimedia Gateways — Hardware-accelerated graphics and 1080p video processing support rich media playback and UI rendering.
- Human‑Machine Interfaces (HMI) — Integrated LCD and keypad controllers plus graphics acceleration for responsive control panels and displays.
- Networked Embedded Systems — Gigabit Ethernet and multiple USB 2.0 ports enable high-throughput connectivity for industrial or communication devices.
- Industrial Control with Field Networks — CAN and abundant peripheral interfaces support machine control and sensor connectivity in embedded systems.
Unique Advantages
- Balanced compute and multimedia — Cortex‑A9 core with NEON SIMD and graphics/video acceleration provides CPU performance alongside efficient media processing.
- Flexible memory support — LPDDR2, LVDDR3 and DDR3 controller support allows designers to optimize cost, power and performance per application.
- Comprehensive connectivity — Integrated Gigabit Ethernet, four USB 2.0 PHYs and CAN reduce external component count and simplify board design.
- Integrated security — Multiple hardware security mechanisms protect boot, runtime and stored data to support secure product designs.
- Rugged thermal range — −40 °C to 125 °C operating range enables deployment in thermally demanding environments.
- Compact, high-density package — 624-MAPBGA (21 × 21 mm) footprint supports compact system layouts while providing extensive I/O.
Why Choose MCIMX6S6AVM08ABR?
The MCIMX6S6AVM08ABR combines a single-core ARM® Cortex®-A9 processor with NEON multimedia acceleration, integrated graphics and video capability, and a broad set of connectivity options to deliver a well-rounded MPU for display-centric and networked embedded designs. Its flexible memory interfaces and integrated power management features let engineers tailor systems for cost, performance, and power objectives.
With extensive on-chip security features and an extended operating temperature range, this device is suited to designs that require media performance, secure boot/runtime behavior, and robust operation across challenging thermal conditions.
Request a quote or submit an inquiry to purchase the MCIMX6S6AVM08ABR and discuss availability and volume pricing.

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