MCIMX6S6AVM08AC

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 981 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S6AVM08AC – ARM Cortex-A9 800 MHz, 624-MAPBGA

The MCIMX6S6AVM08AC is an i.MX 6S series microprocessor from NXP Semiconductors featuring a single ARM® Cortex®-A9 core running at 800 MHz. It targets embedded multimedia and display-driven designs that require integrated processing, graphics acceleration and multiple high-speed interfaces.

Designed for systems that combine video, graphics and communications, this device integrates multimedia co-processors (including NEON™ SIMD), 2D/3D graphics and video processing capabilities alongside a broad set of memory and peripheral interfaces.

Key Features

  • Core and Performance Single ARM® Cortex®-A9 core, 32-bit, up to 800 MHz for general-purpose and multimedia processing.
  • Multimedia and SIMD Integrated multimedia co-processors with NEON™ SIMD and dedicated 2D/3D graphics and video processing engines for display and video applications.
  • Memory Controllers Supports LPDDR2, LVDDR3 and DDR3 memory interfaces to match a range of performance and cost targets.
  • Connectivity Gigabit Ethernet (10/100/1000 Mbps), four USB 2.0 ports with PHY and CAN interface provide broad wired peripheral connectivity.
  • Security and Boot Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Integrated System Features On-chip video processing, integrated power management and a range of display interfaces (including LCD and keypad support) for compact system designs.
  • Package and Thermal 624-MAPBGA package (21 × 21 mm) in a surface-mount form factor; rated operating temperature range of −40 °C to 125 °C.
  • Compliance RoHS compliant.

Typical Applications

  • Infotainment and Multimedia Systems — System controllers for display-centric devices leveraging the integrated 2D/3D graphics and video processing engines.
  • Telematics and Connectivity Modules — Networked modules that require Gigabit Ethernet, multiple USB ports and CAN for peripheral and sensor integration.
  • Human‑Machine Interfaces (HMI) — Interactive display controllers and touchscreen interfaces using the processor’s display and graphics capabilities.
  • Camera and Imaging Subsystems — Video capture and processing applications that benefit from on-chip video processing and memory interface flexibility.

Unique Advantages

  • Integrated Multimedia Processing: Combines Cortex‑A9 CPU with NEON™ SIMD and dedicated graphics/video engines to simplify system architecture for visual applications.
  • Flexible Memory Support: LPDDR2, LVDDR3 and DDR3 controller support allows optimization for performance, power and cost trade-offs.
  • Broad Peripheral Set: Built-in Gigabit Ethernet, multiple USB 2.0 + PHY interfaces and CAN enable diverse connectivity without extensive external logic.
  • Comprehensive Security: Multiple hardware security features and secure boot options help protect system integrity and sensitive data.
  • Industrial Temperature Range: −40 °C to 125 °C rating supports deployment in thermally demanding embedded environments.
  • Compact, High‑Density Package: 624-MAPBGA (21 × 21 mm) provides a high pin-count footprint for complex designs in a single package.

Why Choose MCIMX6S6AVM08AC?

The MCIMX6S6AVM08AC positions itself as a highly integrated microprocessor for embedded designs that require a balance of CPU performance, multimedia acceleration and extensive I/O. With an ARM® Cortex®-A9 core, NEON™ SIMD support, integrated graphics/video processing and flexible memory interfaces, it enables concise system architectures for display, video and connectivity-driven products.

This part is suited to engineers building infotainment, telematics, HMI, imaging and other display-centric systems that demand on-chip multimedia capabilities, robust security features and a wide operating temperature range. The combination of integration and interface density helps reduce external components and simplifies BOM decisions while supporting scalable designs.

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