MCIMX6S6AVM08AC
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 981 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6S6AVM08AC – ARM Cortex-A9 800 MHz, 624-MAPBGA
The MCIMX6S6AVM08AC is an i.MX 6S series microprocessor from NXP Semiconductors featuring a single ARM® Cortex®-A9 core running at 800 MHz. It targets embedded multimedia and display-driven designs that require integrated processing, graphics acceleration and multiple high-speed interfaces.
Designed for systems that combine video, graphics and communications, this device integrates multimedia co-processors (including NEON™ SIMD), 2D/3D graphics and video processing capabilities alongside a broad set of memory and peripheral interfaces.
Key Features
- Core and Performance Single ARM® Cortex®-A9 core, 32-bit, up to 800 MHz for general-purpose and multimedia processing.
- Multimedia and SIMD Integrated multimedia co-processors with NEON™ SIMD and dedicated 2D/3D graphics and video processing engines for display and video applications.
- Memory Controllers Supports LPDDR2, LVDDR3 and DDR3 memory interfaces to match a range of performance and cost targets.
- Connectivity Gigabit Ethernet (10/100/1000 Mbps), four USB 2.0 ports with PHY and CAN interface provide broad wired peripheral connectivity.
- Security and Boot Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Integrated System Features On-chip video processing, integrated power management and a range of display interfaces (including LCD and keypad support) for compact system designs.
- Package and Thermal 624-MAPBGA package (21 × 21 mm) in a surface-mount form factor; rated operating temperature range of −40 °C to 125 °C.
- Compliance RoHS compliant.
Typical Applications
- Infotainment and Multimedia Systems — System controllers for display-centric devices leveraging the integrated 2D/3D graphics and video processing engines.
- Telematics and Connectivity Modules — Networked modules that require Gigabit Ethernet, multiple USB ports and CAN for peripheral and sensor integration.
- Human‑Machine Interfaces (HMI) — Interactive display controllers and touchscreen interfaces using the processor’s display and graphics capabilities.
- Camera and Imaging Subsystems — Video capture and processing applications that benefit from on-chip video processing and memory interface flexibility.
Unique Advantages
- Integrated Multimedia Processing: Combines Cortex‑A9 CPU with NEON™ SIMD and dedicated graphics/video engines to simplify system architecture for visual applications.
- Flexible Memory Support: LPDDR2, LVDDR3 and DDR3 controller support allows optimization for performance, power and cost trade-offs.
- Broad Peripheral Set: Built-in Gigabit Ethernet, multiple USB 2.0 + PHY interfaces and CAN enable diverse connectivity without extensive external logic.
- Comprehensive Security: Multiple hardware security features and secure boot options help protect system integrity and sensitive data.
- Industrial Temperature Range: −40 °C to 125 °C rating supports deployment in thermally demanding embedded environments.
- Compact, High‑Density Package: 624-MAPBGA (21 × 21 mm) provides a high pin-count footprint for complex designs in a single package.
Why Choose MCIMX6S6AVM08AC?
The MCIMX6S6AVM08AC positions itself as a highly integrated microprocessor for embedded designs that require a balance of CPU performance, multimedia acceleration and extensive I/O. With an ARM® Cortex®-A9 core, NEON™ SIMD support, integrated graphics/video processing and flexible memory interfaces, it enables concise system architectures for display, video and connectivity-driven products.
This part is suited to engineers building infotainment, telematics, HMI, imaging and other display-centric systems that demand on-chip multimedia capabilities, robust security features and a wide operating temperature range. The combination of integration and interface density helps reduce external components and simplifies BOM decisions while supporting scalable designs.
Request a quote or submit a pricing inquiry to check availability and lead times for MCIMX6S6AVM08AC.

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