MCIMX6S5EVM10AD

IC MPU I.MX6S 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 1GHz 624-MAPBGA (21x21)

Quantity 308 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S5EVM10AD – IC MPU I.MX6S 1GHz 624-MAPBGA

The MCIMX6S5EVM10AD is an NXP i.MX 6S series microprocessor IC featuring a single ARM® Cortex®-A9 core running up to 1 GHz. It is engineered for embedded multimedia-focused designs, providing integrated graphics acceleration, video processing and a broad set of on-chip interfaces.

Designed for display-driven and connected consumer devices, the device combines multimedia-capable processing, multiple high-speed interfaces and hardware security features in a compact 624-MAPBGA (21×21 mm) surface-mount package.

Key Features

  • Core & Architecture  Single ARM® Cortex®-A9 32-bit core at 1 GHz delivering processor performance targeted at embedded multimedia applications.
  • Memory Interfaces  Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 memory technologies for flexible system memory design.
  • Graphics & Video  Includes graphics acceleration with 2D and 3D capabilities and supports 1080p video processing, plus NEON™ SIMD multimedia co-processor support.
  • Connectivity & Peripherals  Built-in 10/100/1000 Mbps Ethernet (1), four USB 2.0 ports with PHY, CAN interface and display input/output controllers (Keypad, LCD) for rich peripheral connectivity.
  • Security & System Reliability  Hardware security suite including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC with tamper detection.
  • Power & Integration  Integrated power management features and on-chip support for connecting common wireless and sensor peripherals (WLAN, Bluetooth, GPS, camera sensors, storage).
  • Package & Environmental  624-LFBGA / 624-MAPBGA surface-mount package (21×21 mm) with operating temperature range from −20 °C to 105 °C; RoHS compliant.

Typical Applications

  • Web and Multimedia Tablets  Single-core Cortex-A9 performance with graphics acceleration and 1080p video processing suited for tablet-class multimedia playback and user interfaces.
  • Display and Camera Systems  Integrated LCD and keypad controllers plus camera sensor connectivity make this device suitable for display-driven embedded products and camera-enabled consumer devices.
  • Connected Consumer Electronics  On-chip Ethernet, multiple USB 2.0 PHYs and support for common wireless peripherals enable networking and accessory connectivity for consumer products.

Unique Advantages

  • Highly integrated multimedia support: Graphics acceleration, 2D/3D capabilities and 1080p video processing reduce external component requirements for display and video applications.
  • Flexible memory options: Support for LPDDR2, LVDDR3 and DDR3 memory interfaces allows designers to choose the memory profile that fits performance and cost targets.
  • Comprehensive peripheral set: Gigabit Ethernet, multiple USB 2.0 ports with PHY, CAN and display controllers provide direct connectivity for a wide range of peripherals.
  • Robust security features: Built-in TrustZone, cryptography, secure boot and tamper detection help protect system integrity and sensitive data on-device.
  • Compact, production-friendly package: 624-MAPBGA (21×21 mm) surface-mount package balances I/O count and PCB footprint for embedded designs with thermal headroom to −20 °C to 105 °C.

Why Choose MCIMX6S5EVM10AD?

The MCIMX6S5EVM10AD positions itself as a balanced embedded processor option within the i.MX 6S family, combining a 1 GHz ARM® Cortex®-A9 core with dedicated multimedia acceleration, flexible memory interfaces and extensive onboard connectivity. Its integrated security features and power management capabilities make it suitable for products that require a compact, multimedia-capable processing solution with strong system-level features.

This part is appropriate for design teams building display-centric or connected consumer devices that need a single-core Cortex-A9 solution with hardware multimedia support, comprehensive peripheral interfaces and a compact BGA package for production deployment.

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