MCIMX6S6AVM08AB
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 95 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6S6AVM08AB – IC MPU I.MX6S 800MHz 624-MAPBGA
The MCIMX6S6AVM08AB is an ARM® Cortex®-A9 microprocessor in the i.MX 6S series, featuring a single 32-bit core running at 800 MHz. It provides integrated multimedia acceleration, a broad set of peripheral interfaces, and flexible memory support for embedded and display-focused systems.
Designed for infotainment, telematics, HMI and display-based systems, the device delivers a compact, high-density package and a wide operating-temperature range that supports deployment in demanding environments.
Key Features
- Core and Performance Single ARM® Cortex®-A9 core at 800 MHz delivering 32-bit processing for control, user interface, and multimedia tasks.
- Multimedia and DSP Includes multimedia co-processors and NEON™ SIMD acceleration for enhanced media processing and signal tasks.
- Memory Interfaces Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 to match a range of system memory configurations.
- Display and UI Built-in display interface controllers with LCD and keypad support for graphical user interfaces and local control.
- Connectivity Gigabit Ethernet (10/100/1000 Mbps) and CAN support plus four USB 2.0 ports with PHY provide versatile wired connectivity options.
- Security On-chip security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
- Graphics Acceleration Hardware graphics acceleration to support 2D/3D rendering and improved UI responsiveness.
- Package and Mounting Supplied in a 624-MAPBGA (21 × 21 mm) surface-mount package for compact, high-density board designs.
- Environmental Range Rated for operation from −40 °C to 125 °C to suit systems operating across a wide temperature span.
- Standards and Compliance RoHS compliant for environmental and manufacturing considerations.
Typical Applications
- Infotainment and Telematics Drives multimedia playback and user interfaces in infotainment and telematics equipment that require integrated audio/video processing and display support.
- Human‑Machine Interfaces (HMI) Powers graphical HMIs with LCD and keypad interfaces, leveraging graphics acceleration and NEON SIMD for responsive visual experiences.
- Display Systems Suited for display-based control clusters and embedded display controllers where compact packaging and display interfaces are required.
- Embedded Networking and Communications Supports connected applications with Gigabit Ethernet, multiple USB ports and CAN for device networking, data transfer and peripheral connectivity.
Unique Advantages
- Integrated Multimedia Processing: Multimedia co-processors and NEON SIMD accelerate media and signal workloads without adding external DSPs.
- Flexible Memory Support: Native controllers for LPDDR2, LVDDR3 and DDR3 enable a range of memory configurations to meet performance and cost targets.
- Comprehensive Connectivity: Gigabit Ethernet, four USB 2.0 ports with PHY and CAN provide broad interface options for networking and peripherals.
- Robust Security Suite: Multiple on-chip security features protect boot, cryptography and runtime assets to help secure system operation.
- Wide Operating Range: −40 °C to 125 °C operating temperature supports deployment in thermally challenging environments.
- Compact High‑Density Package: The 624-MAPBGA (21 × 21 mm) package enables space-constrained board designs while accommodating rich I/O.
Why Choose MCIMX6S6AVM08AB?
The MCIMX6S6AVM08AB combines a single ARM® Cortex®-A9 core at 800 MHz with multimedia acceleration, extensive I/O and a flexible memory interface set, making it well suited for embedded systems that require integrated media, display and connectivity capabilities. Its security features and wide operating-temperature range provide technical stability for demanding embedded use cases.
Engineers building infotainment, telematics, HMI or display-based systems will find this device offers a balanced mix of performance, integration and packaging density within the i.MX 6S family for streamlined prototyping and deployment.
Request a quote or submit your requirements to our team to get pricing and availability for the MCIMX6S6AVM08AB.

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