MCIMX6S6AVM08AB

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 95 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S6AVM08AB – IC MPU I.MX6S 800MHz 624-MAPBGA

The MCIMX6S6AVM08AB is an ARM® Cortex®-A9 microprocessor in the i.MX 6S series, featuring a single 32-bit core running at 800 MHz. It provides integrated multimedia acceleration, a broad set of peripheral interfaces, and flexible memory support for embedded and display-focused systems.

Designed for infotainment, telematics, HMI and display-based systems, the device delivers a compact, high-density package and a wide operating-temperature range that supports deployment in demanding environments.

Key Features

  • Core and Performance  Single ARM® Cortex®-A9 core at 800 MHz delivering 32-bit processing for control, user interface, and multimedia tasks.
  • Multimedia and DSP  Includes multimedia co-processors and NEON™ SIMD acceleration for enhanced media processing and signal tasks.
  • Memory Interfaces  Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 to match a range of system memory configurations.
  • Display and UI  Built-in display interface controllers with LCD and keypad support for graphical user interfaces and local control.
  • Connectivity  Gigabit Ethernet (10/100/1000 Mbps) and CAN support plus four USB 2.0 ports with PHY provide versatile wired connectivity options.
  • Security  On-chip security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Graphics Acceleration  Hardware graphics acceleration to support 2D/3D rendering and improved UI responsiveness.
  • Package and Mounting  Supplied in a 624-MAPBGA (21 × 21 mm) surface-mount package for compact, high-density board designs.
  • Environmental Range  Rated for operation from −40 °C to 125 °C to suit systems operating across a wide temperature span.
  • Standards and Compliance  RoHS compliant for environmental and manufacturing considerations.

Typical Applications

  • Infotainment and Telematics  Drives multimedia playback and user interfaces in infotainment and telematics equipment that require integrated audio/video processing and display support.
  • Human‑Machine Interfaces (HMI)  Powers graphical HMIs with LCD and keypad interfaces, leveraging graphics acceleration and NEON SIMD for responsive visual experiences.
  • Display Systems  Suited for display-based control clusters and embedded display controllers where compact packaging and display interfaces are required.
  • Embedded Networking and Communications  Supports connected applications with Gigabit Ethernet, multiple USB ports and CAN for device networking, data transfer and peripheral connectivity.

Unique Advantages

  • Integrated Multimedia Processing: Multimedia co-processors and NEON SIMD accelerate media and signal workloads without adding external DSPs.
  • Flexible Memory Support: Native controllers for LPDDR2, LVDDR3 and DDR3 enable a range of memory configurations to meet performance and cost targets.
  • Comprehensive Connectivity: Gigabit Ethernet, four USB 2.0 ports with PHY and CAN provide broad interface options for networking and peripherals.
  • Robust Security Suite: Multiple on-chip security features protect boot, cryptography and runtime assets to help secure system operation.
  • Wide Operating Range: −40 °C to 125 °C operating temperature supports deployment in thermally challenging environments.
  • Compact High‑Density Package: The 624-MAPBGA (21 × 21 mm) package enables space-constrained board designs while accommodating rich I/O.

Why Choose MCIMX6S6AVM08AB?

The MCIMX6S6AVM08AB combines a single ARM® Cortex®-A9 core at 800 MHz with multimedia acceleration, extensive I/O and a flexible memory interface set, making it well suited for embedded systems that require integrated media, display and connectivity capabilities. Its security features and wide operating-temperature range provide technical stability for demanding embedded use cases.

Engineers building infotainment, telematics, HMI or display-based systems will find this device offers a balanced mix of performance, integration and packaging density within the i.MX 6S family for streamlined prototyping and deployment.

Request a quote or submit your requirements to our team to get pricing and availability for the MCIMX6S6AVM08AB.

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