MCIMX6S6AVM08ACR

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 128 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S6AVM08ACR – IC MPU I.MX6S 800MHz 624-MAPBGA

The MCIMX6S6AVM08ACR is an NXP i.MX 6S series microprocessor IC featuring a single ARM® Cortex®-A9 32-bit core running at 800 MHz. It delivers a tightly integrated multimedia-focused architecture with on-chip graphics acceleration and video processing capabilities.

Designed for infotainment, telematics, HMI and display-based systems, this device combines connectivity, memory interface flexibility and hardware security features to support complex user interfaces and multimedia applications.

Key Features

  • Core  Single ARM® Cortex®-A9 core, 32-bit at 800 MHz for deterministic application processing.
  • Memory Interface  Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 memory types.
  • Graphics and Video  On-chip graphics acceleration with 2D/3D support and 1080p video processing capabilities (series-level description).
  • Connectivity  One 10/100/1000 Mbps Ethernet port, four USB 2.0 ports with PHYs and CAN interface for broad peripheral and network connectivity.
  • Display and User I/O  Built-in display interface controllers supporting LCD and keypad connections for advanced human‑machine interfaces.
  • Security  Hardware security features including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package and Mounting  624-ball MAPBGA package (21 × 21 mm), surface-mount, supplier device package 624-MAPBGA (21x21).
  • Operating Range  Extended operating temperature range from −40 °C to 125 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Infotainment Systems  Multi‑media processing and display control where integrated graphics acceleration and video processing are required.
  • Human‑Machine Interfaces (HMI)  Touch panels and instrument interfaces leveraging LCD/keypad controllers and accelerated graphics.
  • Telematics and Connectivity Gateways  Networked devices using Gigabit Ethernet, multiple USB ports and CAN for peripheral and network integration.
  • Display Controllers and Clusters  High-resolution display handling for cluster- and dashboard-style systems requiring robust memory and graphics support.

Unique Advantages

  • Balanced Single‑Core Performance: A dedicated ARM® Cortex®-A9 core at 800 MHz provides predictable processing for control and multimedia tasks.
  • Flexible Memory Support: Native controllers for LPDDR2, LVDDR3 and DDR3 enable designers to choose memory types to match performance and cost targets.
  • Comprehensive Connectivity: Integrated Gigabit Ethernet, multiple USB 2.0 PHYs and CAN reduce external interface components and simplify system design.
  • Robust Hardware Security: Multiple on-chip security features (TrustZone, secure boot, cryptography, secure JTAG, secure memory and tamper detection) support secure boot and runtime protection.
  • Industrial Temperature Capability: Rated from −40 °C to 125 °C to support designs requiring wide operating temperature margins.
  • Compact, Surface‑Mount Package: 624-MAPBGA (21 × 21 mm) package provides high pin count in a compact footprint for dense system integration.

Why Choose MCIMX6S6AVM08ACR?

The MCIMX6S6AVM08ACR positions itself as a highly integrated multimedia microprocessor optimized for designs that require a combination of graphics/video capability, broad peripheral connectivity and on-chip security. Its flexible memory interfaces and extended temperature range make it suitable for embedded systems that demand dependable performance across varied operating conditions.

This device is appropriate for engineers and procurement teams building infotainment, telematics, HMI and display-focused products where integration, secure boot/runtime protection and a compact package help reduce BOM complexity and simplify board design.

If you would like pricing, availability or to request a quote for the MCIMX6S6AVM08ACR, please submit an inquiry or request a quote and our team will respond with next steps.

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