MCIMX6S6AVM10AC

IC MPU I.MX6S 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 1GHz 624-MAPBGA (21x21)

Quantity 340 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S6AVM10AC – IC MPU I.MX6S 1GHz 624-MAPBGA

The MCIMX6S6AVM10AC from NXP Semiconductors is an i.MX 6S microprocessor integrating a single ARM® Cortex®-A9 core running at up to 1 GHz. It combines multimedia acceleration, memory interface flexibility and a broad set of peripheral interfaces to support feature-rich embedded systems.

Designed for infotainment, telematics, HMI and display-driven embedded applications, this device brings integrated graphics/video capabilities, advanced security primitives and multiple high-speed I/O options in a 624-ball MAPBGA package suitable for surface-mount assembly.

Key Features

  • Core and Architecture Single ARM® Cortex®-A9 core, 32-bit, operating up to 1 GHz.
  • Multimedia and DSP Multimedia co-processor support with NEON™ SIMD and DSP capabilities, plus 2D and 3D graphics processors and 1080p video processing as described for the i.MX 6 series.
  • Memory Interfaces Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types to match a range of memory subsystem designs.
  • Connectivity and Peripheral I/O On-chip Ethernet 10/100/1000 Mbps (1), four USB 2.0 ports with PHY, CAN interface, keypad and LCD display controllers.
  • Security and Boot Rich security features including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection.
  • Package and Mounting Supplier device package: 624-MAPBGA (21 × 21 mm). Package case listed as 624-LFBGA; mounting type is surface mount.
  • Operating Range Specified operating temperature range of −40 °C to 125 °C.
  • Graphics Acceleration Graphics acceleration supported (2D/3D) for rich user interfaces and display rendering.

Typical Applications

  • Infotainment & Multimedia — Use for high-resolution displays and video playback systems that benefit from integrated 2D/3D graphics and 1080p video processing.
  • Human‑Machine Interfaces (HMI) — Drive interactive touch and display panels with keypad and LCD controller support and graphics acceleration.
  • Telematics & Connectivity Appliances — Leverage built-in Ethernet, multiple USB 2.0 ports and CAN for connected embedded systems and gateway functions.
  • Embedded Display Clusters — Support display-centric clusters requiring robust graphics, secure boot and a wide operating temperature range.

Unique Advantages

  • Single‑chip multimedia integration: Combines CPU, multimedia DSP/NEON and graphics/video engines to reduce external processing requirements.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support enables designers to choose memory types that match performance and cost targets.
  • Comprehensive connectivity: Gigabit Ethernet, four USB 2.0 + PHY ports and CAN simplify system I/O and external device interfacing.
  • Extensive security feature set: On-chip TrustZone, boot security, cryptography and secure peripherals help protect system integrity and sensitive data.
  • Wide temperature operation: −40 °C to 125 °C rating addresses demanding thermal environments and extends deployment versatility.
  • Compact, manufacturable package: 624-MAPBGA (21×21 mm) surface-mount package supports high-density board designs.

Why Choose MCIMX6S6AVM10AC?

The MCIMX6S6AVM10AC positions itself as a balanced solution for embedded systems that require a combination of CPU performance, multimedia capabilities and broad peripheral integration. Its ARM® Cortex®-A9 core at 1 GHz, together with integrated graphics and video processing, supports responsive user interfaces and media playback while minimizing external components.

This device is well suited to engineers building infotainment, telematics, HMI and display-focused applications that need secure boot options, multiple high-speed interfaces and operation across a wide temperature range. The combination of on-chip memory controller flexibility, connectivity and security features supports scalable designs and long-term product robustness.

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