MCIMX6U4AVM08ACR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 709 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6U |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6U4AVM08ACR – IC MPU I.MX6DL 800MHZ 624MAPBGA
The MCIMX6U4AVM08ACR is an ARM® Cortex®-A9 based microprocessor configured as a dual-core, 32-bit MPU running at 800 MHz. It combines high-performance application processing with multimedia-focused accelerators and integrated system elements for embedded designs.
This device targets infotainment, telematics, HMI and display-focused systems, offering a balance of processing, graphics/video capability and broad peripheral connectivity to support display, camera and wireless subsystem integration.
Key Features
- Core — Dual ARM® Cortex®-A9 processors, 32-bit, running up to 800 MHz to handle application and system tasks.
- Multimedia Acceleration — Includes multimedia DSP and NEON™ SIMD coprocessor plus documented 2D/3D graphics and 1080p video processing capability in the series.
- Memory Interfaces — Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 to match a range of system memory choices.
- Connectivity — Integrated Ethernet (10/100/1000 Mbps, 1), four USB 2.0 ports with PHY, and CAN interface for networking and peripheral connectivity.
- Display & HMI — Display interface controllers for LCD and keypad support to enable rich user interfaces and display systems.
- Security — On-chip security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Package & Mounting — 624-MAPBGA (21 × 21 mm) LFBGA package in a surface-mount form factor for compact system integration.
- Operating Range — Qualified for extended temperature operation from −40 °C to 125 °C.
- Compliance — RoHS-compliant device.
Typical Applications
- Infotainment and Telematics — Engineered for infotainment and telematics platforms that require application processing, multimedia playback and display integration.
- Human‑Machine Interfaces (HMI) — Drive LCD displays and keypad-based interfaces with integrated display controllers and graphics acceleration.
- Display-Based Clusters — Support for 2D/3D graphics and 1080p video processing suits instrument clusters and advanced display modules.
- Connected Embedded Gateways — Built-in Ethernet, multiple USB ports and CAN support enable networked gateway and peripheral aggregation designs.
Unique Advantages
- Balanced compute and multimedia: Dual Cortex-A9 cores at 800 MHz combined with NEON™ SIMD and multimedia DSP provide parallel processing for UI, video and application tasks.
- Broad memory support: LPDDR2, LVDDR3 and DDR3 memory controller support lets designers choose memory technology that fits cost and performance targets.
- Extensive connectivity: Integrated Gigabit Ethernet, four USB 2.0 PHYs and CAN reduce external interface components and simplify board-level design.
- Comprehensive security building blocks: On-chip trust, boot and cryptographic features help protect system integrity and sensitive data.
- Industrial temperature capability: Operation from −40 °C to 125 °C supports deployment in temperature-challenging embedded environments.
- Compact, surface-mount package: 624-MAPBGA (21 × 21 mm) package enables high-density implementations for space-constrained designs.
Why Choose MCIMX6U4AVM08ACR?
The MCIMX6U4AVM08ACR delivers a practical combination of dual-core Cortex‑A9 processing, multimedia acceleration and a wide set of peripheral interfaces—designed to simplify integration of displays, cameras and network modules. Its memory flexibility and on-chip security features make it suitable for embedded designs that require a mix of application performance, multimedia capability and system-level protection.
This MPU is well suited to engineers and procurement teams building infotainment, telematics, HMI and display-centric systems who need a compact BGA package, extended temperature operation and RoHS compliance for production designs.
Request a quote or submit your design requirements to receive pricing and availability information for the MCIMX6U4AVM08ACR. Our team can provide lead-time details and support for volume planning.

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