MCIMX6U4AVM10AD

IC MPU I.MX6DL 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1GHz 624-MAPBGA (21x21)

Quantity 547 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A002A1Ethernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U4AVM10AD – IC MPU I.MX6DL 1GHZ 624MAPBGA

The MCIMX6U4AVM10AD is an ARM® Cortex®-A9 microprocessor IC (i.MX6DL) featuring a dual-core, 32-bit architecture running at up to 1 GHz. It targets multimedia-focused embedded applications and integrates processing, graphics and video capabilities in a single device.

Designed for display-driven and infotainment-class systems, the device combines 2D and 3D graphics, 1080p video processing and integrated power management with a broad set of memory and peripheral interfaces to simplify system design and accelerate time to market.

Key Features

  • Core and Performance  Dual ARM® Cortex®-A9 cores, 32-bit, operating up to 1 GHz to support compute and UI workloads.
  • Graphics and Video  Integrated 2D and 3D graphics processors and 1080p video processing for high-quality display and multimedia playback.
  • Multimedia Acceleration  Multimedia DSP and NEON™ SIMD provide vector and signal-processing acceleration for media and compute tasks.
  • Memory Interfaces  On-chip controllers for LPDDR2, LVDDR3 and DDR3 memory types to match system performance and cost targets.
  • Connectivity and I/O  Includes Gigabit Ethernet (10/100/1000 Mbps, 1), four USB 2.0 ports with PHY, CAN interface, and display interfaces including keypad and LCD controllers.
  • Security Features  Hardware security capabilities including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Package and Mounting  624-MAPBGA (21 × 21 mm) supplier device package / 624-LFBGA case; surface mount mounting type for compact board integration.
  • Environmental Range  Rated for operation from −40 °C to 125 °C to support a wide range of deployment environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Infotainment Systems  Delivers multimedia processing and display support for in-vehicle or embedded infotainment units.
  • Human–Machine Interfaces (HMI)  Drives responsive graphical interfaces with 2D/3D acceleration and touchscreen/display support.
  • Telematics and Connected Devices  Provides networking and peripheral connectivity (Gigabit Ethernet, USB, CAN) for connected embedded systems.
  • Display-Based Clusters  Supports LCD controllers and 1080p video processing for high-resolution instrument and display clusters.

Unique Advantages

  • Highly integrated multimedia subsystem: Combines 2D/3D graphics and 1080p video processing on-chip to reduce external component count.
  • Balanced dual-core architecture: Dual ARM Cortex-A9 cores at 1 GHz enable responsive user interfaces and parallel multimedia workloads.
  • Flexible memory options: Built-in controllers for LPDDR2, LVDDR3 and DDR3 let designers optimize cost and performance.
  • Comprehensive peripheral set: Gigabit Ethernet, multiple USB 2.0 ports with PHY, CAN and display interfaces simplify system integration.
  • Extensive hardware security: Multiple secure boot and cryptographic features protect system integrity and sensitive data.
  • Wide operating temperature: −40 °C to 125 °C specification supports deployment in demanding thermal environments.

Why Choose MCIMX6U4AVM10AD?

The MCIMX6U4AVM10AD positions itself as a compact, feature-rich microprocessor solution for embedded multimedia and display-centric designs. Its dual-core ARM® Cortex®-A9 architecture, combined with integrated graphics, video acceleration and a broad peripheral set, helps streamline BOM and board complexity for developers building infotainment, HMI, telematics and display cluster systems.

As part of the i.MX 6 family, this device is supported by technical documentation and design resources that help reduce development risk and improve product time to market. The combination of security features, flexible memory support and extended temperature range delivers a robust foundation for commercial embedded applications.

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