MCIMX6U6AVM08ACR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 373 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6U |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6U6AVM08ACR – IC MPU I.MX6DL 800MHZ 624MAPBGA
The MCIMX6U6AVM08ACR is an NXP Semiconductors embedded microprocessor featuring a dual ARM® Cortex®-A9 core architecture running at 800 MHz. It is designed as a multimedia-focused MPU with integrated graphics acceleration and memory controller flexibility for demanding embedded display and connectivity applications.
This device targets embedded systems that require integrated processing, multimedia capabilities and a broad set of peripheral interfaces, delivering a balance of performance, integration and thermal range for industrial-grade environments.
Key Features
- Core Dual ARM® Cortex®-A9, 32-bit cores operating at 800 MHz to support concurrent application and multimedia tasks.
- Multimedia Acceleration Includes graphics acceleration and multimedia DSP support with NEON™ SIMD for optimized media processing workloads.
- Memory Interfaces On-chip controllers for LPDDR2, LVDDR3 and DDR3 memory, enabling flexible system memory configurations.
- Display and HMI Display interface controllers for LCD and keypad integration suitable for human‑machine interface implementations.
- Connectivity Integrated Ethernet 10/100/1000 Mbps (1) and CAN interface support for wired networking and vehicle/industrial bus systems.
- USB Four USB 2.0 ports with integrated PHY for peripheral connectivity and host/device use cases.
- Security Hardware security features including ARM TrustZone, boot security, cryptography engines, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Package & Mounting 624-MAPBGA (21×21 mm) supplier device package, 624-LFBGA case, surface-mount mounting type for compact board integration.
- Operating Range Wide operating temperature from -40 °C to 125 °C for use in thermally demanding embedded environments.
- Compliance RoHS compliant.
Typical Applications
- Embedded Multimedia Systems System processors for display-driven applications that require integrated graphics acceleration and multimedia processing.
- Human‑Machine Interfaces (HMI) Drive LCD panels and keypad interfaces for interactive control panels and operator displays.
- Industrial and Connectivity Gateways Use integrated Ethernet, CAN and multiple USB ports to connect sensors, peripherals and networked devices.
- Telematics and Infotainment Devices Support multimedia, networking and security features needed for connected embedded products.
Unique Advantages
- Balanced dual-core performance: Dual ARM® Cortex®-A9 cores at 800 MHz provide parallel processing capability for application and multimedia tasks.
- Integrated multimedia and security: On-chip graphics acceleration combined with hardware security primitives simplifies system design while protecting boot and runtime integrity.
- Flexible memory support: Multiple supported memory types (LPDDR2, LVDDR3, DDR3) enable designers to optimize cost, performance and power for the target application.
- Comprehensive I/O set: Built-in Ethernet, CAN and four USB 2.0 ports reduce external component count and streamline board-level integration.
- Rugged operating range: -40 °C to 125 °C operating temperature supports deployment in thermally challenging embedded environments.
- Compact BGA packaging: 624-MAPBGA (21×21) surface-mount package allows high-density board layouts for space-constrained designs.
Why Choose MCIMX6U6AVM08ACR?
The MCIMX6U6AVM08ACR delivers a practical combination of dual-core ARM® Cortex®-A9 processing, multimedia acceleration and a broad peripheral set in a compact 624-MAPBGA package. It is suited to embedded designers who need integrated connectivity, advanced media handling and on-chip security features while maintaining a wide operating temperature range.
With flexible memory interface options and multiple high-speed I/O features, this MPU supports scalable embedded designs where consolidation of functionality and predictable thermal performance are important. The device aligns with development efforts that prioritize system-level integration and long-term reliability from a recognized semiconductor vendor.
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