MCIMX6U6AVM08ACR

IC MPU I.MX6DL 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 373 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U6AVM08ACR – IC MPU I.MX6DL 800MHZ 624MAPBGA

The MCIMX6U6AVM08ACR is an NXP Semiconductors embedded microprocessor featuring a dual ARM® Cortex®-A9 core architecture running at 800 MHz. It is designed as a multimedia-focused MPU with integrated graphics acceleration and memory controller flexibility for demanding embedded display and connectivity applications.

This device targets embedded systems that require integrated processing, multimedia capabilities and a broad set of peripheral interfaces, delivering a balance of performance, integration and thermal range for industrial-grade environments.

Key Features

  • Core  Dual ARM® Cortex®-A9, 32-bit cores operating at 800 MHz to support concurrent application and multimedia tasks.
  • Multimedia Acceleration  Includes graphics acceleration and multimedia DSP support with NEON™ SIMD for optimized media processing workloads.
  • Memory Interfaces  On-chip controllers for LPDDR2, LVDDR3 and DDR3 memory, enabling flexible system memory configurations.
  • Display and HMI  Display interface controllers for LCD and keypad integration suitable for human‑machine interface implementations.
  • Connectivity  Integrated Ethernet 10/100/1000 Mbps (1) and CAN interface support for wired networking and vehicle/industrial bus systems.
  • USB  Four USB 2.0 ports with integrated PHY for peripheral connectivity and host/device use cases.
  • Security  Hardware security features including ARM TrustZone, boot security, cryptography engines, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Mounting  624-MAPBGA (21×21 mm) supplier device package, 624-LFBGA case, surface-mount mounting type for compact board integration.
  • Operating Range  Wide operating temperature from -40 °C to 125 °C for use in thermally demanding embedded environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded Multimedia Systems  System processors for display-driven applications that require integrated graphics acceleration and multimedia processing.
  • Human‑Machine Interfaces (HMI)  Drive LCD panels and keypad interfaces for interactive control panels and operator displays.
  • Industrial and Connectivity Gateways  Use integrated Ethernet, CAN and multiple USB ports to connect sensors, peripherals and networked devices.
  • Telematics and Infotainment Devices  Support multimedia, networking and security features needed for connected embedded products.

Unique Advantages

  • Balanced dual-core performance: Dual ARM® Cortex®-A9 cores at 800 MHz provide parallel processing capability for application and multimedia tasks.
  • Integrated multimedia and security: On-chip graphics acceleration combined with hardware security primitives simplifies system design while protecting boot and runtime integrity.
  • Flexible memory support: Multiple supported memory types (LPDDR2, LVDDR3, DDR3) enable designers to optimize cost, performance and power for the target application.
  • Comprehensive I/O set: Built-in Ethernet, CAN and four USB 2.0 ports reduce external component count and streamline board-level integration.
  • Rugged operating range: -40 °C to 125 °C operating temperature supports deployment in thermally challenging embedded environments.
  • Compact BGA packaging: 624-MAPBGA (21×21) surface-mount package allows high-density board layouts for space-constrained designs.

Why Choose MCIMX6U6AVM08ACR?

The MCIMX6U6AVM08ACR delivers a practical combination of dual-core ARM® Cortex®-A9 processing, multimedia acceleration and a broad peripheral set in a compact 624-MAPBGA package. It is suited to embedded designers who need integrated connectivity, advanced media handling and on-chip security features while maintaining a wide operating temperature range.

With flexible memory interface options and multiple high-speed I/O features, this MPU supports scalable embedded designs where consolidation of functionality and predictable thermal performance are important. The device aligns with development efforts that prioritize system-level integration and long-term reliability from a recognized semiconductor vendor.

Request a quote or contact sales to discuss availability, pricing and lead time for MCIMX6U6AVM08ACR.

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