MCIMX6U6AVM08ADR

IC MPU I.MX6DL 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 198 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A002A1Ethernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U6AVM08ADR – IC MPU I.MX6DL 800MHZ 624MAPBGA

The MCIMX6U6AVM08ADR is an ARM® Cortex®-A9 based microprocessor featuring a dual-core, 32-bit architecture running at 800 MHz. It is designed for multimedia-focused embedded systems and infotainment, telematics, HMI and display-based cluster applications where integrated graphics, video processing and rich peripheral connectivity are required.

With on-chip graphics acceleration, multimedia DSP/NEON SIMD support and a broad set of I/O controllers, this device combines processing performance with system-level integration for compact, feature-rich embedded designs.

Key Features

  • Core – Dual ARM® Cortex®-A9 cores, 32-bit, operating at 800 MHz to support multitasking multimedia and user-interface workloads.
  • Multimedia Acceleration – Integrated graphics acceleration and multimedia co-processors with NEON™ SIMD to accelerate 2D/3D graphics and media processing.
  • Memory Interfaces – Support for LPDDR2, LVDDR3 and DDR3 memory controllers to match a range of system memory choices and bandwidth needs.
  • Display and UI – Display interface controllers including LCD and keypad controllers for rich HMI and display-based applications.
  • Connectivity – Built-in Ethernet (10/100/1000 Mbps, 1 port), multiple USB 2.0 ports with PHY (4), and CAN interface for common wired network and peripheral connectivity.
  • Security – On-chip security feature set including ARM TrustZone (ARM TZ), boot security, cryptography engines, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Package and Mounting – Supplied in a 624-MAPBGA (21 × 21 mm) surface-mount package (624-LFBGA case), suitable for space-constrained board layouts.
  • Operating Range – Rated for operation from −40 °C to 125 °C to support extended-temperature embedded environments.

Typical Applications

  • Infotainment and Multimedia Systems – Integrated graphics acceleration, video processing and multimedia DSP support enable responsive user interfaces and media playback.
  • Telematics and HMI – Dual-core processing, extensive I/O and security features support connected HMI and telematics modules with robust boot and runtime protection.
  • Display-Based Clusters – LCD and display controller support combined with graphics acceleration make the device suitable for instrument clusters and display-centric control panels.
  • Industrial Embedded Controllers – Gigabit Ethernet, multiple USB ports and CAN support connectivity and peripheral integration for industrial control and monitoring systems.

Unique Advantages

  • Integrated multimedia and graphics: On-chip 2D/3D graphics acceleration and NEON SIMD support reduce the need for external accelerators and simplify system design.
  • Broad memory interface support: LPDDR2, LVDDR3 and DDR3 controller compatibility lets designers choose memory technologies that match performance and cost targets.
  • Comprehensive connectivity: Gigabit Ethernet, four USB 2.0 ports with PHY and CAN provide multiple wired interfaces for networking and peripheral integration.
  • Robust security feature set: ARM TrustZone, cryptography, secure boot and hardware security primitives help protect IP and system integrity from boot through runtime.
  • Extended operating temperature: −40 °C to 125 °C rating supports deployment in environments that require wide thermal tolerance.
  • Compact BGA package: 624-MAPBGA (21×21 mm) package enables high-density board layouts while maintaining a rich peripheral set.

Why Choose MCIMX6U6AVM08ADR?

The MCIMX6U6AVM08ADR positions itself as a balanced, integrated MPU for embedded systems that demand multimedia capability, secure boot/runtime features and extensive peripheral connectivity. Its dual Cortex‑A9 cores at 800 MHz, combined with graphics acceleration and dedicated multimedia processing, provide a capable foundation for user interfaces, video and telematics functions.

This part is suitable for engineers designing space-efficient, connected devices that require a mix of performance, security and I/O. The broad memory support, comprehensive interfaces and extended temperature rating offer design flexibility and operational robustness for long-life embedded programs.

Request a quote or submit a sales inquiry to get pricing, availability and lifecycle information for the MCIMX6U6AVM08ADR. Our team can provide technical details and support to help integrate this device into your next embedded design.

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