MCIMX6U6AVM10ACR

IC MPU I.MX6DL 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1GHz 624-MAPBGA (21x21)

Quantity 996 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A002A1Ethernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U6AVM10ACR – IC MPU I.MX6DL 1GHZ 624MAPBGA

The MCIMX6U6AVM10ACR is a dual-core ARM® Cortex®-A9 microprocessor operating at up to 1 GHz, supplied in a 624-MAPBGA (21 × 21 mm) package. It targets embedded multimedia and display-focused applications, offering integrated graphics acceleration, video processing capabilities, and a broad set of peripheral interfaces for system-level integration.

Designed for infotainment, telematics, HMI and display-based systems, the device emphasizes processing performance, multimedia co-processing and a wide range of I/O to simplify board-level design and accelerate time-to-market.

Key Features

  • Core Architecture Dual ARM® Cortex®-A9 cores, 32-bit, running up to 1 GHz for parallel processing of application and multimedia tasks.
  • Multimedia and DSP Includes multimedia co-processors and NEON™ SIMD support plus graphics acceleration and video processing capability described in the product documentation.
  • Memory Interfaces Integrated memory controllers for LPDDR2, LVDDR3 and DDR3 memory types to support system memory scalability and performance.
  • Display and UI Display interface controllers for LCD and keypad support, enabling rich human-machine interface implementations.
  • Ethernet and USB Integrated Ethernet (10/100/1000 Mbps, 1 port) and four USB 2.0 controllers with PHY for networking and peripheral connectivity.
  • Additional Interfaces Multiple peripheral interfaces including CAN for vehicle networks or industrial fieldbus integration.
  • Security Features Hardware security features such as ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and tamper detection to support protected boot and secure operation.
  • Package and Mounting 624-LFBGA / 624-MAPBGA (21 × 21 mm) surface-mount package for compact system designs.
  • Operating Range Specified operating temperature range of -40 °C to 125 °C for deployment in temperature-challenging environments.
  • Environmental Compliance RoHS status: Compliant.

Typical Applications

  • Infotainment systems — Drives multimedia playback, display control and user-interface processing in embedded entertainment platforms.
  • Human–Machine Interfaces (HMI) — Powers graphical interfaces and input handling for operator panels and control displays.
  • Telematics and communication gateways — Provides networking, USB connectivity and processing headroom for connected embedded systems.
  • Display-based clusters and instrumentation — Supports high-resolution displays and video processing for instrument clusters and information displays.

Unique Advantages

  • Balanced dual-core performance: Two Cortex-A9 cores at up to 1 GHz deliver concurrent application and multimedia processing.
  • Integrated multimedia acceleration: NEON SIMD and dedicated multimedia co-processors reduce software overhead for media workloads.
  • Broad I/O integration: Gigabit Ethernet, multiple USB 2.0 + PHY ports, CAN and display interfaces reduce external component count.
  • Comprehensive security primitives: On-chip features for secure boot, cryptography and tamper detection help implement secured systems.
  • Robust temperature range: Rated from -40 °C to 125 °C for deployment in thermally demanding applications.
  • Compact high-pin-count package: 624-MAPBGA (21 × 21 mm) supports dense integration while preserving signal flexibility.

Why Choose MCIMX6U6AVM10ACR?

The MCIMX6U6AVM10ACR positions itself as an integrated microprocessor solution that combines dual-core Cortex-A9 processing with multimedia acceleration, comprehensive peripheral interfaces and hardware security features—making it suitable for embedded designs that require concurrent application and media processing with strong connectivity options. Its memory controller support for LPDDR2, LVDDR3 and DDR3, plus the broad operating temperature range, make it adaptable to a variety of system requirements.

Backed by detailed NXP technical documentation and package information, this device supports designers seeking a compact, feature-rich MPU for infotainment, HMI, display and communication-focused embedded systems.

Request a quote or submit an inquiry to receive pricing, availability and assistance specifying the MCIMX6U6AVM10ACR for your next embedded design.

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