MCIMX6U6AVM10AD

IC MPU I.MX6DL 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1GHz 624-MAPBGA (21x21)

Quantity 606 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U6AVM10AD – IC MPU I.MX6DL 1GHZ 624MAPBGA

The MCIMX6U6AVM10AD is an ARM® Cortex®-A9 based microprocessor with a dual-core, 32-bit architecture running at up to 1 GHz. It integrates multimedia-focused processing, including 2D/3D graphics and 1080p video processing, to support advanced embedded HMI and multimedia applications.

Designed for highly integrated embedded designs, this device provides multiple memory interfaces, a broad set of peripheral connectivity, and a robust security feature set to support complex system-level integration and secure boot environments.

Key Features

  • Core Dual ARM® Cortex®-A9 cores, 32-bit, operating up to 1 GHz for multitasking and responsive application performance.
  • Graphics & Video Integrated 2D and 3D graphics processors with 1080p video processing to enable rich user interfaces and multimedia playback.
  • Memory Interfaces Supports LPDDR2, LVDDR3, and DDR3 memory controllers for flexible memory subsystem design.
  • Connectivity Integrated Ethernet (10/100/1000 Mbps) and multiple USB 2.0 ports with PHYs (4) plus CAN for vehicle or industrial communication networks.
  • Security On-chip security capabilities including ARM TrustZone (TZ), Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, and Tamper Detection to support secure boot and runtime protection.
  • Integration & Power Includes integrated power management and PLL/oscillator support as described in the product datasheet for system-level power sequencing and clocking.
  • Package & Mounting Available in a 624-MAPBGA (21 × 21 mm) / 624-LFBGA package; surface mount for compact board designs.
  • Operating Range Rated for an operating temperature range of −40 °C to 125 °C to accommodate demanding thermal environments.

Typical Applications

  • Infotainment Systems Multimedia processing and display support for high-resolution user interfaces and media playback.
  • Human–Machine Interfaces (HMI) Graphics acceleration and multiple I/O interfaces enable responsive, feature-rich HMI designs.
  • Telematics and Connectivity Gateways Integrated Ethernet, USB, and CAN support connectivity and data exchange in communication-focused embedded systems.
  • Camera and Display Interfaces Interfaces for displays and camera sensors to enable imaging, streaming, and video processing use cases.

Unique Advantages

  • Multimedia-focused architecture: Dual Cortex-A9 cores with integrated 2D/3D graphics and 1080p video processing reduce the need for external accelerators.
  • Flexible memory support: LPDDR2, LVDDR3, and DDR3 controllers allow designers to choose memory technology that balances cost and performance.
  • Comprehensive security features: Hardware-supported TrustZone, secure boot, cryptography, and tamper detection provide layered protection for sensitive applications.
  • Broad peripheral set: Gigabit Ethernet, four USB 2.0 + PHY ports, and CAN provide extensive I/O options for connectivity-rich designs.
  • Robust operating range: −40 °C to 125 °C rating supports deployment in thermally demanding embedded environments.
  • Compact BGA package: 624-MAPBGA (21 × 21 mm) enables dense PCB layouts while accommodating high pin count.

Why Choose MCIMX6U6AVM10AD?

The MCIMX6U6AVM10AD combines dual ARM® Cortex®-A9 processing, integrated multimedia acceleration, flexible memory interfaces, and a wide set of connectivity options to simplify system design for advanced embedded applications. Its comprehensive on-chip security and integrated power/clock management help reduce BOM complexity and accelerate development cycles.

This device is well suited to engineers building multimedia-rich HMIs, telematics and connectivity gateways, and display or camera-enabled systems that require a compact BGA package, multiple peripheral interfaces, and a broad operating temperature range.

Request a quote or contact sales to discuss pricing, lead times, and how the MCIMX6U6AVM10AD can fit into your next embedded design.

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