MCIMX6U6AVM08AD

IC MPU I.MX6DL 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 183 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A002A1Ethernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U6AVM08AD – IC MPU I.MX6DL 800MHz 2‑Core 624‑MAPBGA

The MCIMX6U6AVM08AD is a dual‑core ARM® Cortex®‑A9 microprocessor operating at 800 MHz from the i.MX 6U series. It combines multicore application processing with integrated multimedia and graphics capabilities, memory interfaces, and a broad set of peripherals targeted at embedded and infotainment applications.

Designed for integration into display, HMI and connected embedded systems, this package provides a compact 624‑MAPBGA (21 × 21 mm) footprint with extended temperature support for demanding environments.

Key Features

  • Core and Performance  Dual ARM® Cortex®‑A9 cores, 32‑bit, running at 800 MHz to handle multitasking application and multimedia workloads.
  • Multimedia and SIMD  Integrated multimedia co‑processors with NEON™ SIMD support plus 2D/3D graphics acceleration and 1080p video processing capabilities referenced in the series documentation.
  • Memory Interfaces  Built‑in memory controllers supporting LPDDR2, LVDDR3 and DDR3 memory technologies for flexible system memory configurations.
  • Display and User I/O  Display interface controllers supporting LCD and keypad interfaces for direct HMI and display connectivity.
  • High‑Speed Connectivity  Single 10/100/1000 Mbps Ethernet controller and four USB 2.0 ports with PHY provide wired networking and peripheral connectivity.
  • Additional Interfaces  Integrated CAN interface plus other peripheral interfaces to connect sensors, storage and communication modules.
  • Security and Boot  Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Package and Mounting  624‑MAPBGA (21 × 21 mm) surface‑mount package suitable for compact board designs; package information and ball assignments are provided in the series documentation.
  • Operating Range and Compliance  Rated for an operating temperature range of ‑40 °C to 125 °C and supplied as RoHS‑compliant.

Typical Applications

  • Infotainment Systems  Integrated multimedia and graphics capabilities enable audio/video playback and display control in infotainment platforms.
  • Human‑Machine Interfaces (HMI)  LCD and keypad interface support plus graphics acceleration make it suitable for interactive control panels and instrument displays.
  • Video and Imaging Devices  On‑chip video processing and 2D/3D graphics acceleration support display and camera sensor use cases.
  • Connected Embedded Gateways  Gigabit Ethernet, multiple USB ports and CAN connectivity allow networked gateway and telematics-style devices to interface with peripherals and networks.

Unique Advantages

  • Balanced Dual‑Core Processing: Two Cortex‑A9 cores at 800 MHz provide multi‑threaded application capability while keeping system complexity manageable.
  • Broad Memory Flexibility: Supports LPDDR2, LVDDR3 and DDR3 memory types to match performance and cost targets across designs.
  • Comprehensive I/O Set: Ethernet, multiple USB 2.0 + PHY ports, CAN, and display interfaces reduce external controller requirements and simplify BOM.
  • Integrated Multimedia Subsystem: Graphics acceleration plus series‑documented 1080p video processing enable rich user interfaces and media playback without heavy external silicon.
  • Integrated Security Primitives: Multiple on‑chip security features support secure boot and cryptography to help protect system integrity and sensitive data.
  • Wide Temperature Capability: Operation from ‑40 °C to 125 °C enables deployment in thermally demanding environments.

Why Choose MCIMX6U6AVM08AD?

The MCIMX6U6AVM08AD positions itself as a versatile embedded application processor that combines dual‑core Cortex‑A9 processing, multimedia and graphics acceleration, and a broad peripheral set in a compact 624‑MAPBGA package. Its flexible memory support and integrated interfaces make it suitable for display‑centric and connected embedded systems where integrated media processing and connectivity are required.

Designers benefit from the series' documented features—multimedia processors, integrated power management and comprehensive electrical and package information—enabling informed system integration and reliable long‑term deployment.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the MCIMX6U6AVM08AD. Our team can provide lead‑time details and assist with ordering.

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