MCIMX6U6AVM08AB

IC MPU I.MX6DL 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 805 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U6AVM08AB – IC MPU I.MX6DL 800MHz 624-MAPBGA

The MCIMX6U6AVM08AB is a dual-core ARM® Cortex®-A9 microprocessor operating at 800 MHz in a 624-MAPBGA (21×21 mm) package. It is built for embedded multimedia and display-driven systems and combines dual-core processing, hardware graphics/video capabilities and integrated power management for compact, high-functionality designs.

Designed for infotainment, telematics, HMI and display-based applications, the device delivers multimedia acceleration, broad memory interface support and rich peripheral connectivity to simplify system integration and speed time to market.

Key Features

  • Processor Core Dual ARM® Cortex®-A9 cores (2 core, 32-bit) running at 800 MHz for general-purpose and multimedia processing.
  • Media and Acceleration Integrated 2D and 3D graphics processors and 1080p video processing with multimedia DSP and NEON™ SIMD co-processor support for accelerated media workloads.
  • Memory Interfaces Supports LPDDR2, LVDDR3 and DDR3 memory controllers for flexible memory subsystem design.
  • Connectivity and I/O Gigabit Ethernet (10/100/1000 Mbps), four USB 2.0 ports with PHY, CAN and multiple display interfaces (LCD, keypad) to connect a wide range of peripherals.
  • Security and Boot On-chip security features include ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection to support protected boot and runtime operation.
  • Power Management Integrated power management functions reduce external component count and simplify board-level power architecture.
  • Package and Mounting 624-MAPBGA (21×21 mm) supplier device package, surface-mount mounting type suitable for compact embedded boards.
  • Operating Range Wide operating temperature range from −40 °C to 125 °C for deployment in thermally demanding environments.

Typical Applications

  • Infotainment platforms — Multimedia playback, display control and connectivity for integrated entertainment systems.
  • Telematics — Data aggregation and processing for telematics modules requiring multimedia and communications interfaces.
  • Human–Machine Interfaces (HMI) — Driving LCD displays and keypad inputs for graphical user interfaces and instrument clusters.
  • Multimedia gateways and sensor hubs — Interfacing cameras, displays and external wireless modules while handling local media processing.

Unique Advantages

  • Balanced dual-core performance: Two Cortex‑A9 cores at 800 MHz provide a combination of responsive control and concurrent multimedia processing.
  • Integrated multimedia stack: On-chip 2D/3D graphics and 1080p video processing reduce external accelerator requirements and simplify board design.
  • Rich peripheral set: Gigabit Ethernet, multiple USB 2.0 + PHY ports and CAN support a wide range of connectivity scenarios without extensive external bridging.
  • Comprehensive security primitives: Hardware TrustZone, cryptography and secure boot elements help protect boot and runtime integrity for connected systems.
  • Flexible memory support: LPDDR2, LVDDR3 and DDR3 controllers allow designers to choose suitable memory technologies for performance and cost balance.
  • Robust thermal capability: −40 °C to 125 °C operating range enables deployment in thermally challenging embedded applications.

Why Choose MCIMX6U6AVM08AB?

The MCIMX6U6AVM08AB positions itself as a compact, multimedia-focused embedded processor for applications that require combined general-purpose compute, graphics/video acceleration and extensive peripheral connectivity. Its dual-core Cortex‑A9 architecture, broad memory interface support and hardware security features deliver a strong platform for developers building infotainment, telematics, HMI and display-centric systems.

As part of the i.MX 6Solo/6DualLite family, the device provides platform scalability and integrates power and multimedia capabilities to reduce BOM and streamline system design for production-grade embedded solutions.

Request a quote or submit an inquiry to receive pricing and availability information, and to discuss how MCIMX6U6AVM08AB can meet your embedded design requirements.

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