MCIMX6U6AVM08AC

IC MPU I.MX6DL 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 505 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U6AVM08AC – IC MPU I.MX6DL 800MHz 624-MAPBGA

The MCIMX6U6AVM08AC is an ARM® Cortex®-A9 based microprocessor device featuring a dual-core, 32-bit architecture running at 800 MHz. It is designed as a multimedia-focused application processor with integrated graphics acceleration and video processing capabilities for infotainment, telematics, HMI, and display-based systems.

With a broad set of interfaces and memory controller support, the device targets embedded designs that require combined processing performance, multimedia features, and flexible connectivity in a compact 624‑MAPBGA package.

Key Features

  • Core Dual ARM® Cortex®-A9 cores, 32-bit, operating at up to 800 MHz for responsive application and multimedia processing.
  • Multimedia and Acceleration Multimedia DSP and NEON™ SIMD co‑processors plus graphics acceleration and 1080p video processing capabilities for rich user interfaces and video playback.
  • Memory Support Integrated memory controllers supporting LPDDR2, LVDDR3, and DDR3 (including DDR3L/LPDDR2-800) for flexible system memory choices.
  • Connectivity and Peripherals Single Gigabit Ethernet (10/100/1000 Mbps), four USB 2.0 ports with PHY, and additional interfaces including CAN for robust peripheral integration.
  • Display and Input Display interface controllers for LCD and keypad support to drive graphical HMIs and user input subsystems.
  • Security Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC, RTIC, and tamper detection.
  • Package and Mounting 624‑MAPBGA supplier device package (21×21 mm) / 624‑LFBGA case, surface mount for compact board-level integration.
  • Operating Range Specified operating temperature range of −40 °C to 125 °C for deployment across a wide range of environmental conditions.
  • Compliance RoHS compliant.

Typical Applications

  • Infotainment and Telematics Systems Processors and multimedia engines for audio/video playback, user menus, and connectivity features.
  • Human‑Machine Interfaces (HMI) Driving graphical displays, touch interfaces and keypad input for control panels and operator consoles.
  • Display-Based Clusters High-resolution display processing and video handling for instrument clusters and signage.
  • Embedded Multimedia Appliances Devices requiring integrated graphics acceleration, video decode/encode and multiple peripheral connections.

Unique Advantages

  • Integrated Multimedia Platform: Combines dual Cortex‑A9 processing with graphics acceleration and video processing to support rich user interfaces and media playback.
  • Flexible Memory Options: Support for LPDDR2, LVDDR3 and DDR3 memory types allows designers to choose the memory technology that fits performance and cost targets.
  • Comprehensive Connectivity: Built‑in Gigabit Ethernet, multiple USB 2.0 PHYs and CAN support enable a wide range of wired interface options without external controller overhead.
  • Hardware Security Suite: Multiple on‑chip security mechanisms (TrustZone, secure boot, cryptography, secure JTAG, secure memory) help protect firmware and data at the hardware level.
  • Wide Temperature Range: Operation from −40 °C to 125 °C supports deployment in temperature‑challenging environments.
  • Compact BGA Package: 624‑MAPBGA (21×21 mm) footprint for high I/O density in space-constrained designs.

Why Choose MCIMX6U6AVM08AC?

The MCIMX6U6AVM08AC delivers a balanced combination of dual Cortex‑A9 processing, multimedia acceleration, extensive interface support and on‑chip security features packaged in a compact BGA footprint. It is suited for embedded designs that require capable application processing alongside integrated graphics and video capabilities.

Engineers implementing HMIs, infotainment, telematics or display systems can leverage the device’s memory flexibility, peripheral set and temperature range to build robust products with documented NXP technical resources and package information available for system design and validation.

Request a quote or submit an inquiry to get pricing and availability for MCIMX6U6AVM08AC and accelerate your embedded multimedia system design.

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