MCIMX6U5EVM10AD

IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1.0GHz 624-MAPBGA (21x21)

Quantity 1,602 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1.0GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U5EVM10AD – IC MPU I.MX6DL 1.0GHZ 624MAPBGA

The MCIMX6U5EVM10AD is an NXP Semiconductors i.MX 6DL family microprocessor based on dual ARM® Cortex®‑A9 cores, running at up to 1.0 GHz. Designed for embedded multimedia-focused applications, the device integrates graphics and video processing alongside power management to deliver high-performance processing with optimized power consumption.

This package-level offering targets consumer and embedded markets such as web and multimedia tablets and other consumer products that require integrated display, camera and peripheral connectivity with secure boot and cryptographic features.

Key Features

  • Core Dual ARM® Cortex®‑A9 cores, 32‑bit architecture operating up to 1 GHz for responsive application processing.
  • Memory Interfaces Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 devices for flexible system memory design.
  • Graphics & Multimedia On‑chip 2D and 3D graphics processors and 1080p video processing capabilities to enable high‑quality display and multimedia features.
  • Security & Boot Comprehensive security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection to protect device integrity and data.
  • Peripheral Interfaces Multiple high‑speed and peripheral interfaces including Gigabit Ethernet (10/100/1000 Mbps), four USB 2.0 ports with PHY, and CAN for broad connectivity options.
  • Co‑processing Multimedia DSP capabilities and NEON™ SIMD support for accelerated media and signal processing tasks.
  • Package & Mounting Supplier device package: 624‑MAPBGA (21×21 mm); package case listed as 624‑LFBGA; surface mount mounting type for integration into compact boards.
  • Operating Range Rated for operation from −20 °C to 105 °C to meet a wide range of embedded thermal requirements.
  • Power Management Includes integrated power management features as described in the product documentation to optimize system power consumption.

Typical Applications

  • Web and Multimedia Tablets Enables responsive user interfaces and high‑quality video playback with integrated graphics and 1080p video processing.
  • Consumer Electronics Suited for consumer products that require multimedia acceleration, peripheral connectivity and secure boot features.
  • Display and Camera Systems Provides display controllers and camera interface support for devices integrating LCDs and imaging sensors.

Unique Advantages

  • Highly integrated multimedia capability: Combines 2D/3D graphics and 1080p video processing to simplify multimedia system design.
  • Dual‑core performance at 1 GHz: Dual ARM Cortex‑A9 cores deliver the compute headroom needed for responsive embedded applications.
  • Flexible memory support: Native controllers for LPDDR2, LVDDR3 and DDR3 enable designers to choose memory solutions that match cost and performance targets.
  • Comprehensive connectivity: Multiple USB 2.0 ports with PHY, Gigabit Ethernet and CAN support a wide range of peripheral and networked use cases.
  • Robust security feature set: On‑chip security primitives including TrustZone, secure boot and cryptography help protect platform integrity and data.
  • Board‑level packaging: 624‑MAPBGA (21×21 mm) surface‑mount package supports dense, compact board layouts for space‑constrained designs.

Why Choose MCIMX6U5EVM10AD?

The MCIMX6U5EVM10AD positions itself as a balanced embedded processor solution combining dual Cortex‑A9 performance, integrated multimedia acceleration and a broad set of connectivity and security features. Its memory flexibility and integrated power management make it suitable for designers targeting consumer and multimedia‑oriented embedded products.

As part of the i.MX 6U family from NXP Semiconductors, this device offers platform continuity for projects that require scalable multimedia performance, secure boot and a comprehensive peripheral set backed by available technical documentation.

Request a quote or submit an inquiry to learn more about pricing, availability and how the MCIMX6U5EVM10AD can fit into your next embedded design.

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