MCIMX6U5EVM10AC

IC MPU I.MX6S 1GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 2 Core, 32-Bit, 64-Bit 1GHz 624-MAPBGA (21x21)

Quantity 614 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP Semiconductors
Manufacturing StatusActive
Manufacturer Standard Lead Time0 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPIECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit, 64-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnknownRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U5EVM10AC – ARM® Cortex®-A9 2‑Core MPU, 1 GHz, 624‑MAPBGA

The MCIMX6U5EVM10AC is a microprocessor class device from NXP Semiconductors based on the ARM® Cortex®‑A9 architecture. It delivers dual‑core processing at 1 GHz and targets embedded applications that require multimedia processing, display connectivity and broad I/O integration.

With integrated multimedia co‑processing (NEON™ MPE), graphics acceleration and multiple display controllers, this device is positioned for designs needing performance, secure boot and extensive peripheral support within a compact 624‑MAPBGA package.

Key Features

  • Core — ARM® Cortex®‑A9 dual‑core processor running at 1 GHz; core configuration listed as 2 Core, 32‑Bit, 64‑Bit.
  • Multimedia and Acceleration — Multimedia co‑processors and NEON™ MPE are provided for signal processing; graphics acceleration is supported for visual and UI workloads.
  • Memory Controllers — Integrated controllers for DDR3, DDR3L and LPDDR2 memory types to support a range of system memory configurations.
  • Display Interfaces — On‑chip display interface controllers include HDMI, Keypad, LCD, LVDS and MIPI for flexible human‑machine interface designs.
  • Connectivity — Gigabit Ethernet (10/100/1000 Mbps (1)), USB 2.0 + PHY (4) and Bluetooth as additional interface options enable wired and wireless connectivity choices.
  • Security — Security features include ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC and Tamper Detection for enhanced platform protection.
  • Package & Mounting — Supplied in a 624‑MAPBGA (21×21) supplier package and listed package case 624‑LFBGA; surface mount mounting type.
  • Operating Range — Rated operating temperature from ‑20 °C to 105 °C for extended environmental operation.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Human‑Machine Interfaces — Use HDMI, LCD, LVDS and MIPI display controllers with graphics acceleration for responsive UI and touchscreen systems.
  • Multimedia Devices — Leverage the NEON™ MPE and multimedia co‑processors for audio/video processing and media playback functions.
  • Industrial Embedded Systems — Gigabit Ethernet, multiple USB interfaces and extended temperature rating support networked control and industrial HMI applications.
  • Connected Gateways and Peripherals — Integrated USB, Ethernet and Bluetooth interfaces enable gateway, peripheral hub and connectivity sub‑system designs.

Unique Advantages

  • Dual‑Core Processing at 1 GHz: Delivers a balance of compute performance for multitasking embedded workloads.
  • Rich Display and Multimedia Support: Multiple display controllers and graphics acceleration simplify implementation of advanced UIs and multimedia functions.
  • Comprehensive Security Suite: On‑chip security features including ARM TZ, secure boot and cryptography help protect system integrity and sensitive data.
  • Flexible Memory Options: Support for DDR3, DDR3L and LPDDR2 memory controllers allows designers to choose memory solutions that match performance and power targets.
  • Broad I/O Connectivity: Gigabit Ethernet, four USB 2.0 + PHY ports and Bluetooth support diverse peripheral and network interfaces without external bridges.
  • Engineered for Harsh Environments: Operating temperature range from ‑20 °C to 105 °C enables deployment in demanding embedded environments.

Why Choose MCIMX6U5EVM10AC?

The MCIMX6U5EVM10AC combines dual‑core ARM® Cortex®‑A9 performance, multimedia acceleration and a comprehensive set of I/O and security features in a compact 624‑MAPBGA package. It is well suited for embedded system designs that require integrated display support, robust connectivity and platform security.

Backed by NXP Semiconductors, this device offers a practical platform for engineers building scalable, reliable embedded products where multimedia capability, secure boot and flexible memory and interface options are required.

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