MCIMX6U5EVM10ADR

IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DL 2 Core, 32-Bit 1.0GHz 624-MAPBGA (21x21)

Quantity 1,493 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6U
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed1.0GHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6U5EVM10ADR – IC MPU I.MX6DL 1.0GHZ 624MAPBGA

The MCIMX6U5EVM10ADR from NXP Semiconductors is a dual-core ARM® Cortex®-A9 microprocessor, delivering 1.0 GHz processing across two 32-bit cores. It is part of the i.MX 6U family and is designed for embedded applications that require balanced compute, multimedia acceleration and a broad set of peripheral interfaces.

With integrated multimedia support (NEON™ SIMD), graphics acceleration, multiple memory controller options and extensive connectivity (Gigabit Ethernet, multiple USB 2.0 PHYs, CAN), this device targets embedded segments such as IoT gateways, access control, point-of-sale and telematics where performance, integration and system security are important.

Key Features

  • Processing Core — ARM® Cortex®-A9 dual-core, 32-bit architecture running at 1 GHz for parallel application and I/O processing.
  • Multimedia Acceleration — NEON™ SIMD co-processor and graphics acceleration to offload media and signal processing tasks.
  • Memory Interfaces — Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types to match a range of performance and power targets.
  • Display and HMI — Built-in controllers for LCD and keypad interfaces to support user interface designs.
  • High-speed Connectivity — One 10/100/1000 Mbps Ethernet port plus four USB 2.0 ports with integrated PHYs and CAN for in-field communications.
  • Security Features — ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection to support secured boot and runtime protection strategies.
  • Package & Mounting — Available in a 624-ball MAPBGA (21 × 21 mm) / 624-LFBGA package; surface-mount device suitable for compact embedded boards.
  • Operating Range — Specified operating temperature range from −20 °C to 105 °C for deployment in a variety of environments.
  • Compliance — RoHS compliant for environmental and manufacturing compliance needs.

Typical Applications

  • IoT Gateways — Process sensor data and manage network connectivity using integrated Ethernet, USB PHYs and security features.
  • Access Control — Drive LCD/keypad interfaces and handle secure authentication with onboard cryptography and tamper detection.
  • Point-of-Sale (POS) — Support multimedia UI, peripheral connectivity and secure boot/cryptography for payment and transaction terminals.
  • Telematics — Combine connectivity (Ethernet, CAN, USB) and multimedia processing to support telemetry and remote monitoring applications.

Unique Advantages

  • Balanced Dual-Core Performance: Two ARM® Cortex®-A9 cores at 1 GHz provide concurrent processing for application and I/O tasks.
  • Integrated Multimedia and Graphics: NEON™ SIMD and graphics acceleration reduce software complexity for media-rich embedded UIs.
  • Broad Connectivity Suite: Gigabit Ethernet, four USB 2.0 + PHY ports and CAN support a wide range of external peripherals and networks without extensive external logic.
  • Comprehensive Security Toolbox: Multiple hardware security features (TrustZone, secure JTAG, secure memory, cryptography and tamper detection) support robust device and boot protection.
  • Flexible Memory Options: Support for LPDDR2, LVDDR3 and DDR3 enables designers to scale memory performance and power for their application needs.
  • Rugged Operating Range and Compact Package: −20 °C to 105 °C operation and a 624-ball MAPBGA package allow compact board designs for embedded environments.

Why Choose MCIMX6U5EVM10ADR?

The MCIMX6U5EVM10ADR positions itself as a versatile embedded application processor by combining dual-core Cortex-A9 performance with dedicated multimedia acceleration, extensive connectivity and a comprehensive set of hardware security features. Its multiple memory interface options and integrated PHYs simplify BOM and board-level integration for mid-range embedded designs.

This device is well suited for designers targeting connected, media-capable embedded systems that require on-chip security and a compact surface-mount package. Backed by the NXP i.MX 6U series, it provides a clear hardware foundation for scalable embedded products that demand both performance and integration.

Request a quote or submit an inquiry to get pricing and availability for the MCIMX6U5EVM10ADR and discuss how it fits your next embedded design.

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