 | | MCIMX6S7CVM08AB | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 786 | |
 | | MCIMX6S7CVM08AC | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 925 | |
 | | MCIMX6S7CVM08ACR | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,458 | |
 | | MCIMX6S7CVM08AD | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,263 | |
 | | MCIMX6S7CVM08ADR | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,074 | |
 | | MCIMX6S8DVM10AB | NXP Semiconductors | IC MPU I.MX6S 1.0GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,793 | |
 | | MCIMX6S8DVM10AC | NXP Semiconductors | IC MPU I.MX6S 1.0GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 517 | |
 | | MCIMX6S8DVM10AD | NXP Semiconductors | IC MPU I.MX6S 1.0GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 490 | |
 | | MCIMX6U1AVM08AB | NXP Semiconductors | IC MPU I.MX6DL 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 681 | |
 | | MCIMX6U1AVM08ABR | NXP Semiconductors | IC MPU I.MX6DL 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,030 | |
| N/A | | MCIMX6U1AVM08AC | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 875 | |
 | | MCIMX6U1AVM08ACR | NXP Semiconductors | IC MPU I.MX6DL 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 535 | |
 | | MCIMX6U1AVM08AD | NXP Semiconductors | IC MPU I.MX6DL 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,117 | |
 | | MCIMX6U1AVM08ADR | NXP Semiconductors | IC MPU I.MX6DL 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 597 | |
 | | MCIMX6U1AVM10AC | NXP Semiconductors | IC MPU I.MX6DL 1GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 524 | |
 | | MCIMX6U1AVM10AD | NXP Semiconductors | IC MPU I.MX6DL 1GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,092 | |
 | | MCIMX6U4AVM08AB | NXP Semiconductors | IC MPU I.MX6DL 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,128 | |
 | | MCIMX6U4AVM08ABR | NXP Semiconductors | IC MPU I.MX6DL 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,668 | |
 | | MCIMX6U4AVM08AC | NXP Semiconductors | IC MPU I.MX6DL 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 782 | |
 | | MCIMX6U4AVM08ACR | NXP Semiconductors | IC MPU I.MX6DL 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,088 | |