Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX6S7CVM08ABMCIMX6S7CVM08ABNXP SemiconductorsIC MPU I.MX6S 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
786
MCIMX6S7CVM08ACMCIMX6S7CVM08ACNXP SemiconductorsIC MPU I.MX6S 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
925
MCIMX6S7CVM08ACRMCIMX6S7CVM08ACRNXP SemiconductorsIC MPU I.MX6S 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,458
MCIMX6S7CVM08ADMCIMX6S7CVM08ADNXP SemiconductorsIC MPU I.MX6S 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,263
MCIMX6S7CVM08ADRMCIMX6S7CVM08ADRNXP SemiconductorsIC MPU I.MX6S 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,074
MCIMX6S8DVM10ABMCIMX6S8DVM10ABNXP SemiconductorsIC MPU I.MX6S 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,793
MCIMX6S8DVM10ACMCIMX6S8DVM10ACNXP SemiconductorsIC MPU I.MX6S 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
517
MCIMX6S8DVM10ADMCIMX6S8DVM10ADNXP SemiconductorsIC MPU I.MX6S 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
490
MCIMX6U1AVM08ABMCIMX6U1AVM08ABNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
681
MCIMX6U1AVM08ABRMCIMX6U1AVM08ABRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,030
N/AMCIMX6U1AVM08ACNXP SemiconductorsIC MPU I.MX6S 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
875
MCIMX6U1AVM08ACRMCIMX6U1AVM08ACRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
535
MCIMX6U1AVM08ADMCIMX6U1AVM08ADNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,117
MCIMX6U1AVM08ADRMCIMX6U1AVM08ADRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
597
MCIMX6U1AVM10ACMCIMX6U1AVM10ACNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
524
MCIMX6U1AVM10ADMCIMX6U1AVM10ADNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,092
MCIMX6U4AVM08ABMCIMX6U4AVM08ABNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,128
MCIMX6U4AVM08ABRMCIMX6U4AVM08ABRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,668
MCIMX6U4AVM08ACMCIMX6U4AVM08ACNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
782
MCIMX6U4AVM08ACRMCIMX6U4AVM08ACRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,088

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up