| N/A | | MCIMX6QP6AVT8ABR | NXP Semiconductors | IC MPU I.MX6QP 852MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 656 | |
 | | MCIMX6QP7CVT8AA | NXP Semiconductors | IC MPU I.MX6QP 800MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 948 | |
 | | MCIMX6QP7CVT8AB | NXP Semiconductors | IC MPU I.MX6QP 800MHZ 624FCBGA | Microprocessors | 624-FCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21×21) | 924 | |
 | | MCIMX6S1AVM08AB | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,078 | |
 | | MCIMX6S1AVM08ABR | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 184 | |
 | | MCIMX6S1AVM08AC | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 591 | |
 | | MCIMX6S1AVM08ACR | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 544 | |
 | | MCIMX6S1AVM08AD | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,247 | |
 | | MCIMX6S1AVM08ADR | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,540 | |
 | | MCIMX6S1AVM10AC | NXP Semiconductors | IC MPU I.MX6S 1GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,947 | |
 | | MCIMX6S1AVM10AD | NXP Semiconductors | IC MPU I.MX6S 1GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 380 | |
 | | MCIMX6S4AVM08AB | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 800 | |
 | | MCIMX6S4AVM08ABR | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 509 | |
 | | MCIMX6S4AVM08AC | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,881 | |
 | | MCIMX6S4AVM08ACR | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 368 | |
 | | MCIMX6S4AVM08AD | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,211 | |
 | | MCIMX6S4AVM08ADR | NXP Semiconductors | IC MPU I.MX6S 800MHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 887 | |
 | | MCIMX6S4AVM10AC | NXP Semiconductors | IC MPU I.MX6S 1GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 506 | |
 | | MCIMX6S4AVM10AD | NXP Semiconductors | IC MPU I.MX6S 1GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,022 | |
 | | MCIMX6S5DVM10AB | NXP Semiconductors | IC MPU I.MX6S 1.0GHZ 624MAPBGA | Microprocessors | 624-MAPBGA (21x21) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Mounting Type: Surface Mount Supplier Device Package: 624-MAPBGA (21×21) | 1,049 | |