MCIMX6QP7CVT8AB

IC MPU I.MX6QP 800MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6QP 4 Core, 32-Bit 800MHz 624-FCBGA (21x21)

Quantity 727 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6QP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed800MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6QP7CVT8AB – IC MPU I.MX6QP 800MHZ 624FCBGA

The MCIMX6QP7CVT8AB is an NXP Semiconductors i.MX 6QuadPlus-series application processor featuring a quad ARM® Cortex®‑A9 core cluster running up to 800 MHz. Designed for embedded and industrial applications, it integrates multimedia acceleration, a 64‑bit DDR3/DDR3L/LPDDR2 memory interface, and a broad set of peripheral controllers to support rich user interfaces and connected systems.

Engineered for graphics‑intensive and video applications, this industrial‑qualified device is supplied in a 624‑FCBGA surface‑mount package (21×21 mm, 0.8 mm pitch) and supports a wide operating temperature range for deployment in demanding environments.

Key Features

  • Core and Performance – Quad ARM® Cortex®‑A9 32‑bit cores operating up to 800 MHz, providing processor performance for multimedia and responsive embedded applications.
  • Memory Interfaces – Integrated memory controllers for LPDDR2, DDR3L and DDR3, supporting 64‑bit DDR interfaces for system memory.
  • Graphics and Video – On‑chip 2D/3D graphics acceleration and 1080p video processing capabilities suitable for advanced displays and video playback.
  • Display Support – Multiple display interface controllers including HDMI, LCD parallel, LVDS and MIPI/DSI for flexible UI and panel options.
  • Connectivity – Built‑in Ethernet (10/100/1000 Mbps, 1), SATA 3 Gbps (1), multiple USB 2.0 + PHY ports (3) and USB 2.0 OTG + PHY (1), plus CAN for industrial fieldbus connectivity.
  • Security – Hardware security features including ARM TrustZone (TZ), A‑HAB, CAAM, CSU, SJC and SNVS to support secure boot and system integrity functions.
  • Package and Temperature – 624‑FCBGA (21×21 mm) surface‑mount package; industrial operating temperature range −40°C to 105°C.
  • Regulatory – RoHS compliant.

Typical Applications

  • Human–Machine Interfaces (HMI) – Drives high‑resolution graphical interfaces and responsive touchscreens using integrated 2D/3D graphics and multiple display outputs.
  • Video Processing and Display – Supports 1080p video processing and display pipelines for media playback, digital signage and camera‑based systems.
  • Industrial Control and Instrumentation – Industrial‑qualified operating range and CAN connectivity make it suitable for control panels, instrumentation and factory automation displays.
  • Embedded Networking and Storage Appliances – Integrated Gigabit Ethernet and SATA 3 Gbps enable networked embedded systems and local storage applications.

Unique Advantages

  • Quad‑core processing with NEON SIMD: Four ARM® Cortex®‑A9 cores and NEON™ SIMD support enable compute and multimedia workloads within a single device.
  • Comprehensive display and video I/O: Native support for HDMI, LVDS, MIPI/DSI and parallel LCD interfaces simplifies multi‑panel and high‑resolution display designs.
  • Broad peripheral connectivity: Multiple USB ports, USB OTG, Gigabit Ethernet, SATA and CAN cover a wide range of I/O and networking requirements without external controllers.
  • Hardware security building blocks: ARM TrustZone, A‑HAB and CAAM provide on‑chip capabilities for secure boot, cryptography and system partitioning.
  • Industrial qualification and thermal range: Specified for −40°C to 105°C operation to meet the environmental needs of industrial applications.
  • Compact FCBGA package: 624‑FCBGA (21×21 mm, 0.8 mm pitch) provides a high‑density, surface‑mount form factor for space‑constrained embedded boards.

Why Choose MCIMX6QP7CVT8AB?

The MCIMX6QP7CVT8AB positions itself as a highly integrated processor for embedded and industrial systems that require multimedia, display flexibility and robust peripheral connectivity. Its combination of quad ARM® Cortex®‑A9 cores, on‑chip graphics/video processing and a wide suite of interfaces reduces the need for external components while addressing display‑centric and networked applications.

As part of the i.MX 6DualPlus/6QuadPlus family, this device benefits from documented architecture and package information, making it suitable for designers targeting industrial-grade human‑machine interfaces, video appliances and connected embedded products that demand long‑lifecycle availability and comprehensive integration.

Request a quote or submit an inquiry for MCIMX6QP7CVT8AB today by referencing the part number and your required quantity and lead time.

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