MCIMX6S1AVM08AC
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21) |
|---|---|
| Quantity | 1,093 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-MAPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | ||
| Speed | 800MHz | Supplier Device Package | 624-MAPBGA (21×21) | USB | USB 2.0 + PHY (4) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6S1AVM08AC – IC MPU I.MX6S 800MHz 624-MAPBGA
The MCIMX6S1AVM08AC is an ARM® Cortex®‑A9 based microprocessor operating at 800 MHz, offered by NXP Semiconductors as part of the i.MX 6S series. It provides a compact, single‑core 32‑bit application processor option for multimedia‑focused embedded designs.
Built for consumer and multimedia applications, the i.MX 6S series emphasizes high performance with optimized power consumption and integration, including graphics acceleration and video processing features referenced in the series datasheet.
Key Features
- Core Single ARM® Cortex®‑A9 core, 32‑bit at 800 MHz for control and application processing.
- Co‑processors and SIMD Multimedia and NEON™ SIMD support for accelerated media and signal processing workloads.
- Memory Integrated memory controller support for LPDDR2, LVDDR3 and DDR3 memory types.
- Graphics and Video (series) Series includes 2D/3D graphics processors and 1080p video processing as detailed in the i.MX 6Solo/6DualLite documentation.
- Interfaces Rich peripheral set including USB 2.0 with PHY (4), Gigabit Ethernet (10/100/1000 Mbps, 1), CAN, and display interfaces for keypad and LCD.
- Security Comprehensive security features listed for the device: ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC, and tamper detection.
- Package and Mounting 624‑MAPBGA supplier package in a 21 × 21 mm footprint; surface mount device suitable for compact board designs.
- Operating Range Specified operating temperature range of −40 °C to 125 °C.
- Regulatory RoHS compliant.
Typical Applications
- Web and Multimedia Tablets Provides the processing, multimedia acceleration, and display interfaces suited for tablet-class consumer devices (series use case).
- Consumer Multimedia Devices Targets consumer product designs that require video playback, graphics acceleration and connectivity to peripherals such as cameras and displays.
- Embedded HMI and Display Controllers Single‑core performance with LCD interface support for human‑machine interfaces and compact display systems.
Unique Advantages
- Single‑core, predictable performance: A dedicated ARM Cortex‑A9 core at 800 MHz provides deterministic single‑thread throughput for embedded application tasks.
- Broad memory support: Native support for LPDDR2, LVDDR3 and DDR3 enables flexible BOM choices across cost and performance tradeoffs.
- Rich on‑chip interfaces: Integrated USB, Gigabit Ethernet, CAN and display interfaces reduce external component count and simplify board design.
- Hardware security primitives: Multiple hardware security features (TrustZone, secure boot, cryptography, secure JTAG, etc.) help implement layered device protection.
- Compact BGA package: 624‑MAPBGA (21 × 21 mm) surface‑mount package enables high integration in space‑constrained designs.
- Wide operating temperature: −40 °C to 125 °C range supports deployment in thermally demanding embedded environments.
Why Choose MCIMX6S1AVM08AC?
The MCIMX6S1AVM08AC delivers a focused combination of single‑core ARM Cortex‑A9 performance, multimedia acceleration, and a broad set of integrated interfaces in a compact BGA package. It is well suited for designers targeting consumer multimedia and embedded HMI applications that need a balance of processing capability, media features and system integration.
Backed by NXP Semiconductors and documented within the i.MX 6S series technical documentation, this part offers a clear specification set for teams looking to implement video, display and peripheral‑rich designs while retaining flexibility in memory and interface choices.
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