MCIMX6S1AVM08ADR

IC MPU I.MX6S 800MHZ 624MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21)

Quantity 517 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-MAPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A002A1Ethernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Speed800MHzSupplier Device Package624-MAPBGA (21×21)USBUSB 2.0 + PHY (4)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6S1AVM08ADR – IC MPU I.MX6S 800MHZ 624MAPBGA

The MCIMX6S1AVM08ADR is a single‑core ARM® Cortex®‑A9 microprocessor IC running at 800 MHz in a 624‑MAPBGA (21×21 mm) package. It targets integrated multimedia and display‑centric systems, offering a balance of processing performance, graphics acceleration, and on‑chip integration.

Its architecture and peripheral set make it suitable for infotainment, telematics, HMI and other display‑based applications where multimedia processing, connectivity and system security are required alongside broad memory interface support.

Key Features

  • Core and Performance Single ARM® Cortex®‑A9 core, 32‑bit, operating at 800 MHz to deliver deterministic application processing for embedded multimedia workloads.
  • Multimedia and DSP Integrated multimedia co‑processors with NEON™ SIMD support and graphics acceleration to handle 2D/3D and media‑oriented tasks.
  • Memory Interfaces Multi‑type memory controller support for LPDDR2, LVDDR3 and DDR3, enabling flexible system memory choices and scalable memory performance.
  • Display and UI Display interface controllers including LCD and keypad support for rich user interfaces and display subsystem integration.
  • Connectivity Single 10/100/1000 Mbps Ethernet controller, four USB 2.0 ports with PHY, and CAN interface support for broad peripheral and network connectivity.
  • Security and Boot On‑chip security features include ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection to support secure system deployment.
  • Package and Mounting Supplied in a 624‑MAPBGA (21×21 mm) surface‑mount package suitable for high‑density board designs.
  • Operating Temperature Rated for operation from −40 °C to 125 °C to support designs that require wide temperature range operation.

Typical Applications

  • Infotainment systems — Drives multimedia processing and display control for integrated entertainment and information systems.
  • Human‑Machine Interfaces (HMI) — Supports responsive graphics and input handling for control panels and touch displays.
  • Telematics and navigation — Provides the processing and connectivity needed for navigation, communication and vehicle telematics modules.
  • Display‑based systems — Suited for clusters and instrument displays that require integrated graphics and display interfaces.

Unique Advantages

  • Highly integrated multimedia processing: On‑chip NEON SIMD and graphics acceleration reduce system complexity and offload media tasks from the main CPU.
  • Flexible memory support: Compatibility with LPDDR2, LVDDR3 and DDR3 enables designers to select memory that matches performance and cost targets.
  • Comprehensive connectivity: Gigabit Ethernet, multiple USB 2.0 ports with PHY and CAN support a wide range of peripheral and network interfaces.
  • Robust security feature set: Built‑in TrustZone, cryptography and secure boot primitives help protect system IP and enable secure boot strategies.
  • Wide operating temperature: −40 °C to 125 °C rating supports deployment in thermally challenging environments.
  • Compact BGA package: 624‑MAPBGA (21×21 mm) enables high‑density PCB designs while providing necessary I/O counts.

Why Choose MCIMX6S1AVM08ADR?

The MCIMX6S1AVM08ADR positions itself as a single‑core, 800 MHz ARM® Cortex®‑A9 MPU optimized for multimedia and display‑centric embedded systems. Its combination of a dedicated multimedia co‑processor, broad memory interface support, comprehensive peripheral set and integrated security features make it a practical choice for designers seeking an integrated processing solution for infotainment, HMI, telematics and display systems.

With a robust operating temperature range and a high‑density 624‑MAPBGA package, this device is suitable for designs that require compact form factor, secure boot and varied connectivity options while maintaining clear upgrade paths within the i.MX 6 series architecture.

Request a quote or submit a request for pricing and availability for the MCIMX6S1AVM08ADR to move your design forward.

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